• Proceedings of the Korean Fiber Society Conference
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• 2000.04a
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• pp.197-200
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• 2000

• Journal of the Korean Geotechnical Society
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• v.32 no.5
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• pp.49-55
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• 2016

This study aims to present the practical Nitrogen monoxide (NO) removal capacity of cement mortar with Titanium dioxide ($TiO_2$) which is one of the paving materials by considering the environment of pavement in urban areas. NO removal capacity test under designated conditions of humidity of inflow gas and the test with variation of the degree of saturation of specimen were conducted. In the test for humidity, dry specimen is subject to the test and NO removal ratio was observed. Humidity-NO removal ratio curve is a log normal distribution in shape, and the maximum NO removal ratio appears at specific humidity. NO removal capacity test relying on the degree of saturation was carried out with wet specimen to reflect the unsaturated pavement by rainfall and domestic sewage. Wet specimen presents less NO removal capacity than dry specimen and the recovering evolution of NO removal capacity follows evaporation. Moreover, $TiO_2$ under the specific depth of specimen hardly contributes to NO removal capacity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.19-20
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• 2006

Two methods that can reduce reflectance in solar cells are surface texturing and anti-reflection coating. Wet chemical etching is a typical method that surface texturing of multi-crystalline silicon. Wet chemical etching methods are the acid texturization of saw damage on the surface of multi-crystalline silicon or double-step chemical etching after KOH saw damage removal too. These methods of surface texturing are realized by chemical etching in acid solutions HF-$HNO_3$-$H_2O$. In this solutions we can reduce reflectance spectra by simple process etching of multi-crystalline silicon surface. We have obtained reflectance of 27.19% m 400~1100nm from acidic chemical etching after KOH saw damage removal. This result is about 7% less than just saw damage removal substrate. The surface morphology observed by microscope and scanning electron microscopy (SEM).

• Laser Solutions
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• v.6 no.3
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• pp.29-35
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• 2003

In semiconductor processing, there are two types of particle contaminated onto the wafer, i.e. dry and wet state particles. In order to evaluate the cleaning performance of laser shock wave cleaning method, the removal of 1 m sized alumina particle at different particle conditions from silicon wafer has been carried out by laser-induced shock waves. It was found that the removal efficiency by laser shock cleaning was strongly dependent on the particle condition, i.e. the removal efficiency of dry alumina particle from silicon wafer was around 97％ while the efficiencies of wet alumina particle in DI water and IPA are 35％ and 55％ respectively. From the analysis of adhesion forces between the particle and the silicon substrate, the adhesion force of the wet particle where capillary force is dominant is much larger than that of the dry particle where Van der Waals force is dominant. As a result, it is seen that the particle in wet condition is much more difficult to remove from silicon wafer than the particle in dry condition by using physical cleaning method such as laser shock cleaning.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.1
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• pp.11-17
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• 2010

This study investigates the non-traditional manufacturing process of dry wire electrical discharge machining (EDM) in which liquid dielectric is replaced by a gaseous medium. Wire EDM experiments of thin workpieces were conducted both in wet and dry EDM conditions to examine the effects of spark cycle (T), spark on-time ($T_{on}$), thickness of work pieces, and work material on machining performance. The material removal rate (MRR) in the dry wire EDM case was much lower than that in the wet wire EDM case. In addition, the thickness of workpiece and work-material were found to be critical factors influencing the MRR for dry EDM process. The relative ratios of spark, arc and short circuit were also calculated and compared to examine the effectiveness of processes of dry and wet wire EDM.

• Journal of Korean Society for Atmospheric Environment
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• v.34 no.5
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• pp.659-667
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• 2018

$NO_x$ and $SO_2$ are mainly generated in the combustion of fossil fuels, and they cause secondary aerosol formation and acid rain in the atmosphere. Many studies have been conducted on the wet scrubbing process which can simultaneously reduce $NO_x$ and $SO_2$ at relatively low temperature. In this study, we conducted an experimental study on wet scrubbing by using NaOH solution. Especially, this study focuses on $NO_x$ and $SO_2$ removal characteristics by varying $NO_2/NO_x$ ratio and $SO_2$ concentration.

• Journal of the Korean Applied Science and Technology
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• v.31 no.1
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• pp.159-166
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• 2014

In recent years, researchers have put a considerable effort to decrease the emission of harmful gaseous pollutants to the atmosphere. In order to remove simultaneously $SO_2$ and $NO_X$ from the flue gas of small and medium-sized ship, we designed minimal wet scrubber inside a compact multistage modular system. In this study we proceed experiment of elemental technology at each stage of the scrubber. The each stage is oxidation of NO which is the main component of $NO_X$, and removal of $SO_2$, respectively. $NaClO_2$ was used to oxidize NO gas, and NaOH was used to remove $SO_2$ gas. The maximum NO conversion efficiency and the $SO_2$ removal efficiency are both indicate 100%.

• Korean Journal of Soil Science and Fertilizer
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• v.50 no.6
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• pp.615-622
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• 2017

This study was conducted to evaluate the odor reduction efficacy of the dip injection wet scrubber (DIWS) using tap water as washing fluid. The $NH_3$ and $H_2S$ removal efficiency of 7 day batch operated DIWS was evaluated twice over a total of 14 days of experiment. The $NH_3$ removal efficiency ranged from 26 to 37%. The $H_2S$ removal efficiency was between 22 and 30%. The pH of the washing fluid maintained below 8 and the $NH_4{^+}$ concentration tended to keep constant around 350 ppm after 5 days of washing-fluid replacement. Therefore, the 5-day washing fluid replacement interval is more preferable than the 7-day interval. The $NH_4{^+}$ concentration and the electrical conductivity (EC) showed a high correlation. The EC measurement can be used as an alternative to conventional $NH_4{^+}$ concentration measurement method for real time monitoring of washing fluid condition.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.44 no.4
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• pp.85-90
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• 2012

Wet pressing process has great influence not only on the paper properties but also on the efficiency of total manufacturing process including energy efficiency. The slow drainage propensity of old corrugated container(OCC) might require more complicated control of wet pressing process. In this study, the change in press efficiency and in structure of wet sheet by the various condition of laboratory roll press simulator were evaluated to provide background information about wet pressing of OCC. The higher pressure and the slower machine speed resulted in higher efficiency of wet pressing but the change trends of dryness depending on the wet press pressure and machine speed were shown differently according to OCC treatment. The effects of water contents of felt on the wet press efficiency and sheet structure were also investigated. The higher contents of water in felt resulted in less removal of water generally and the crushed structure of wet sheet were appeared especially at higher pressure.

• Journal of the Semiconductor & Display Technology
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• v.11 no.3
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• pp.7-11
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• 2012

Among various wet cleaning methods, megasonic and jet spray gained their popularity in single wafer cleaning process for the efficient removal of particulate contaminants from the wafer surface. In the present study, we evaluated these two cleaning methods for particle removal efficiency (PRE) and pattern damage on the aluminum layered wafer surface. Also the effect of $CO_2$ dissolved water in jet spray cleaning is assessed by measuring PRE. It is observed that the jet spray cleaning process is more effective in terms of PRE and pattern damage compared to megasonic cleaning and the mixing of $CO_2$ in the water during jet sprays further increases the PRE. We believe that the outcome of the present study is useful for the semiconductor cleaning process engineers and researchers.