• 제목/요약/키워드: Wet Process

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Flip Chip Non-wet 개선 및 신뢰성 향상을 위한 Low Residue Flux 구현 방안 연구 (A Study on Low Residue Flux for Improving Flip Chip Non-wet and Reliability)

  • 이현숙;김민석;김태훈;문기일
    • 마이크로전자및패키징학회지
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    • 제28권2호
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    • pp.45-50
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    • 2021
  • Flip chip 제품의 난이도 증가에 따라 solder wetting 및 신뢰성 관점에서 강점을 갖는 flux 소재에 대한 관심이 높아지고 있다. 지용성 flux의 경우 별도의 세정 공정이 없기 때문에 공정 효율화 측면에서 유리하나, 리플로우 공정이후 반응을 마친 잔여물이 잔존하게 되는 경우 Cu migration 및 delamination을 발생시킬 수 있다. 본 연구에서는 저잔사 flux 구현을 위해 신규 resin에 적합한 solvent 및 activator를 변경 하였으며, package 환경에서 non-wet 및 신뢰성 개선 유무를 확인하였다. 저장 안정성 평가를 통해 신규 소재에 대한 안정성을 확보하였으며, boiling point가 상이한 solvent와 activator 2종 적용 및 activator 함량 증대를 통해 non-wet 미 발생 flux 소재를 확보하였다. 해당 소재에 대한 신뢰성 검증 이후 평면 분석 결과 flux residue 기인성 delamination 현상은 발견되지 않았으며, 이를 통해 저잔사 flux에 대한 최종 조성을 확보하였다.

STUDY ON THE HIGH EFFICIENCY BURIED CONTACT SOLAR CELL WITH WET ETCHING PROCESS

  • Kang, Dae-Keun;Choi, Kang-Ho;Lee, Joo-Yul;Lee, Kyu-Hwan
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2009년도 추계학술대회 초록집
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    • pp.156-156
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    • 2009
  • High efficiency silicon solar cell technology based on planar technology has been improved by various kinds of process by using the wet etching process. In particular, the buried contact solar cell has been successfully studied. In the present work, a simplified process of the buried contact solar cell has been suggested to help one design effectively the high-efficiency solar cell.

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MEMS switch 응용을 위한 free standing 금속 구조물에 관한 연구 (A free standing metal structures for MEMS switches)

  • 황현석;김응권;강현일;이규일;이태용;송준태
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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    • pp.187-188
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    • 2005
  • In this paper, big free standing metal structures for electrostatic MEMS switches are easily fabricated using photoresist sacrificial layer. The entire process sequence, through the removal of the sacrificial layer, is kept below 150 $^{\circ}C$ to avoid curing problem of photoresist sacrificial layer. Metal structure is fabricated by thermal evaporator and a self test electrode is fabricated underlying metal suspended structure for testing by electrostatic force. The new wet release process is considered using methanol rinse, general wet release process cause stiction problem by capillary force during drying, and the yield is dramatically improved than previous wet release process using DI water rinse. The fabrication becomes much simpler and cheaper with use of a photoresist sacrificial layer.

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스크린 프린팅 기술을 적용한 피스톤 스커트의 브레이드 코팅공정에 관한 기초연구 - 매개변수 연구 (A Basic Study on Blade Coating Process of Piston Skirt by Applying the Technology of Screen Printing - Parametric Study)

  • 전상명
    • Tribology and Lubricants
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    • 제25권6호
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    • pp.414-420
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    • 2009
  • In this study, using the general expressions predicting the pressure under a blade and the volume of coating fluid passing through the blade edge, it is predicted the change of the coating wet film thickness related with various parameters determining the characteristics of this blade coating process. Using the results of this research, it can be found the optimized coating wet film thickness taking into account the parameters related with various coating process on various metal surfaces will be able to be predicted.

스퍼터링 증착 조건에 따른 금속 박막의 습식 식각율 (The Wet Etching Rate of Metal Thin Film by Sputtering Deposition Condition)

  • 허창우
    • 한국정보통신학회논문지
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    • 제14권6호
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    • pp.1465-1468
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    • 2010
  • 습식 식각은 식각용액으로서 화학용액을 사용하는 공정으로 반응물이 기판표면에서 화학반응을 일으켜 표면을 식각하는 과정이다. 습식 식각 시 수${\mu}m$의 해상도를 얻기 위해서는 그 부식액의 조성이나, 에칭시간, 부식액의 온도 등을 고려하여야 한다. 본 실험에서 사용한 금속은 Cr, Al, ITO 로 모두 DC sputter 방법을 사용해서 증착하여 사용하였다. Cr박막은 $1300{\AA}$ 정도의 두께를 사용하였고, ITO (Indium Tin Oxide) 박막은 가시광 영역에서 투명하고 (80% 이상의 transmittance), 저저항 (Sheet Resistance : $50\;{\Omega}/sq$ 이하) 인 박막을 사용하였으며, 신호선으로 주로 사용되는 Al등의 증착조건에 따른 wet etching 특성을 조사하였다.

물티슈 제조공정의 전과정 평가 (Life Cycle Assessment on Process of Wet Tissue Production)

  • 안중우
    • 청정기술
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    • 제24권4호
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    • pp.269-274
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    • 2018
  • 본 연구에서는 물티슈 제조공정에 대한 전과정평가를 수행하였다. 물티슈 제조공정은 약액을 조제하여 부직포 원단에 투여하고 포장하는 단계로 이루어진다. 특정 업체의 실제 공정을 대상으로 투입 산출물 데이터를 수집하였고, 환경부와 해외 LCI DB를 활용하여 상 하위 흐름을 연결하여 이 공정에 대한 잠재적인 환경영향을 산출하였다. 특성화 결과, 오존층파괴 3.46.E-06 kg $CFC_{11}$, 산성화 5.11.E-01 kg $SO_2$, 자원고갈 $3.52.E+00\;1yr^{-1}$, 지구온난화 1.04.E+02 kg $CO_2$, 부영양화 2.31.E-02 kg ${PO_4}^{3-}$, 광화학산화물생성 2.22.E-02 kg $C_2H_4$, 인간독성 1.55.E+00 kg 1,4 DCB, 생태독성 5.82.E-04 kg 1,4 DCB로 나타났다. 일반적으로 제조공정의 환경영향을 줄이기 위해 공정을 개선하거나 환경영향이 적은 원자재와 포장재로 변경하는 등의 방법이 있다. LCA 결과, 공정에 사용되는 에너지가 주요이슈로 도출되었기 때문에 에너지 효율을 개선한 공정시스템 설계나 환경영향이 낮은 에너지원으로 변경하는 등의 방안이 필요하다. LCA의 특성상 이 연구결과는 사용된 LCI DB 종류에 따라 달라질 수 있고 모든 물티슈 제조공정을 대표할 수 없다.

일부 합성피혁 근로자들의 Dimethylformamide, Methyl Ethyl Ketone, Toluene 노출에 따른 요중 대사물질 (Urinary Metabolites of Dimethylformamide, Methyl Ethyl Ketone, and Toluene exposed Workers in Synthetic Leather Factories)

  • 최호춘;김강윤;안선희;이영자;정규철
    • 한국산업보건학회지
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    • 제11권2호
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    • pp.135-144
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    • 2001
  • This study was performed to measure airborne dimethylformamide(DMF), methyl ethyl ketone(MEK) and toluene and their urinary metabolites concentrations and to determine the relationship between airborne and urinary concentration. Airborne samples and their urinary metabolites were measured 98 male workers who work for 8 synthetic leather factories in a portion of Kyoung-In area. Urine samples were collected at end-of-shift to estimate the exposure levels. 1. The concentration of airborne DMF by process was 8.81 ppm for wet-mixing, 15.05 ppm for wet-coating, 6.03 ppm for dry-mixing, 5.58 ppm for dry-coating, 5.37 ppm for printing, and 9.03 ppm for total. There was statistically significant difference by process. Urinary NMF concentrations of wet-mixing, wet-coating, dry-mixing, dry-coating and printing were $90.55mg/{\ell}$, $79.80mg/{\ell}$, $39.86mg/{\ell}$, $25.23mg/{\ell}$, and $38.15mg/{\ell}$, respectively, and total geometric mean was $56.24mg/{\ell}$. There was significant difference by process. 2. The concentration of airborne MEK by process was 1.89 ppm for wet-mixing, 1.96 ppm for wet-coating, 10.33 ppm for dry-mixing, 29.24 ppm for dry-coating, 14.98 ppm for printing, and 4.87 ppm for total. There was statistically significant difference by process. Urinary MEK concentrations of wetmixing, wet-coating, dry-mixing, dry-coating and printing were $0.93mg/{\ell}$, $0.70mg/{\ell}$, $3.29mg/{\ell}$, $3.29mg/{\ell}$, and $1.06mg/{\ell}$, respectively, and total geometric mean was $1.25mg/{\ell}$. There was statistically significant difference by process. Urinary MEK 3. The concentration of airborne toluene by process was 0.35ppm for wet-mixing, 0.42ppm for wet-coating, 2.95ppm for dry-mixing, 11.67ppm for dry-coating, 4.88ppm for printing, 1.24ppm for total. There was statistically significant difference by process. Urinary hippuric acid concentrations of wet-mixing, wet-coating, dry-mixing, dry-coating and printing were 0.24g/g creatinine, 0.21g/g creatinine, 0.34g/g creatinine, 0.52g/g creatinine, and 0.29g/g creatinine, respctively and total geometric mean was 0.28g/g creatinine. There was statistically significant difference by process. 4. No. of exceeded KPEL was 40 workers(40.8%) for DMF(10ppm), 1 worker(1.0%) for MEK(200ppm), and no worker for toluene(100ppm). No. of exceeded KBEI was 62 workers(63.3%) for urinary NMF($40mg/{\ell}$), 29 workers(29.6%) for urinary MEK, 1 worker(1.0%) for urinary hippuric acid. 5. The regression equations were Log(NMF)=0.4094*Log(DMF)+1.3587(r=0.4516) for DMF, Log(MEKU)=0.1859*Log(MEK)-0.0324(r=0.3303) for MEK, Log(HA)=0.2106*Log(Toluene)-0.5685(r=0.4497) for toluene. Synthetic leather factory workers expose to 3 kinds of organic solvents which are DMF, MEK and toluene. Their urinary NMF and MEK levels were higher than their concentration levels through respiratory. It seems that the urinary levels were affected skin absorption for working habit and alcohol intake.

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고농도 페놀 폐수의 습식산화와 호기성 생물학적 통합처리 (Integrated Wet Oxidation and Aerobic Biological Treatment of the Wastewater Containing High Concentration of Phenol)

  • 최호준;이승호;유용호;윤왕래;서일순
    • KSBB Journal
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    • 제22권4호
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    • pp.244-248
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    • 2007
  • 고농도 페놀폐수 전처리 습식산화공정의 반응온도, 초기 pH 및 균일촉매 ($CuSO_4$) 등이 후처리 호기성 생물학적 공정에 미치는 영향을 조사하였다. 습식산화에서의 높은 반응온도와 산성 초기조건이 후처리 생물학적 산화공정에서 높은 산화속도와 최종 COD 제거율을 유발하였다. 습식산화에서 균일촉매를 사용하면 전처리 습식산화반응은 낮은 반응온도에서도 높은 COD 제거속도를 보였으나, 후처리 생물학적 산화공정에서는 낮은 최종 COD 제거율을 나타내었다.

비이온계 계면활성제기반 고순도 알루미늄 습식식각을 통한 균일한 마이크로패턴 어레이 제작 (Fabrication of uniform micropattern arrays using nonionic surfactant-based wet etching process of high purity aluminum)

  • 장웅기;전은채;최두선;김병희;서영호
    • 한국기계가공학회지
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    • 제13권4호
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    • pp.13-20
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    • 2014
  • In this paper, the effects of a nonionic surfactant on the etch uniformity and the etch profile during the wet-etching process of high-purity aluminum were investigated for the fabrication of uniform micropattern arrays. To improve the surface roughness of a high-purity aluminum plate, a mechanical lapping process and an electrolytic polishing process were used. After electrolytic polishing process, the surface roughness, Ra, of the high-purity aluminum plate was improved from $1.25{\mu}m$ to $0.02{\mu}m$. A photoresist was used as an etching mask during the aluminum etching process, where the mixture of phosphoric acid, acetic acid, nitric acid, a nonionic surfactant and water was used as the aluminum etchant. Different amounts of the Triton X-100 nonionic surfactant were added to the aluminum etchant to investigate the effect of a nonionic surfactant during the wet-etching process of high-purity aluminum. The etch rate and the etch profile were measured by an optical interferometer and a scanning electron microscope.

A Compacted In-line Wet Etch/Cleaning System With a Reverse Moving Control System

  • Im, Seung-Hyeok;Cho, Eou-Sik;Kwon, Sang-Jik
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.863-866
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    • 2008
  • For the cost reduction in the fabrication of display panels, a reverse moving system was equipped to a compacted in-line wet etch/cleaning system. For the effect of the alternating movement of substrate on the wet etch process, ITO layers were etched in various moving modes of substrates and the results were compared and analyzed.

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