DOI QR코드

DOI QR Code

Fabrication of uniform micropattern arrays using nonionic surfactant-based wet etching process of high purity aluminum

비이온계 계면활성제기반 고순도 알루미늄 습식식각을 통한 균일한 마이크로패턴 어레이 제작

  • 장웅기 (강원대학교 기계메카트로닉스공학과) ;
  • 전은채 (한국기계연구원 나노공정연구실) ;
  • 최두선 (한국기계연구원 나노공정연구실) ;
  • 김병희 (강원대학교 기계메카트로닉스공학과) ;
  • 서영호 (강원대학교 기계메카트로닉스공학과)
  • Received : 2014.08.04
  • Accepted : 2014.08.20
  • Published : 2014.08.31

Abstract

In this paper, the effects of a nonionic surfactant on the etch uniformity and the etch profile during the wet-etching process of high-purity aluminum were investigated for the fabrication of uniform micropattern arrays. To improve the surface roughness of a high-purity aluminum plate, a mechanical lapping process and an electrolytic polishing process were used. After electrolytic polishing process, the surface roughness, Ra, of the high-purity aluminum plate was improved from $1.25{\mu}m$ to $0.02{\mu}m$. A photoresist was used as an etching mask during the aluminum etching process, where the mixture of phosphoric acid, acetic acid, nitric acid, a nonionic surfactant and water was used as the aluminum etchant. Different amounts of the Triton X-100 nonionic surfactant were added to the aluminum etchant to investigate the effect of a nonionic surfactant during the wet-etching process of high-purity aluminum. The etch rate and the etch profile were measured by an optical interferometer and a scanning electron microscope.

Keywords

References

  1. Luo. X., Cheng. K., Webb. D., and Wardle. F., "Design of Ultraprecision Machine Tools with Applications to Manufacture of Miniature and Micro Components", J. Materials Processing Technology, Vol. 167, No. 2-3, pp. 515-528, 2005. https://doi.org/10.1016/j.jmatprotec.2005.05.050
  2. Oh. J. S., Kim. C. , Park. C. H., and Choi. Y. J., "Current Status and Technical Issues of Ultra-precision Machine Tools", J. Korean Soc. Precis. Eng., Vol. 31, No. 3, pp. 189-197, 2014 https://doi.org/10.7736/KSPE.2014.31.3.189
  3. Mckeown. P. A., "The Role of Precision Engineering in manufacturing of the Future", Ann. CIRP, Vol. 36, pp. 495-501, 1987. https://doi.org/10.1016/S0007-8506(07)60751-3
  4. Taniguchi. N.,Nanotechnology, Oxford University Press, NewYork, 1996.
  5. Xia. Y., Whitesides. G. M., "Sofe Lithography", Angew. Chem. int. Ed., Vol. 37, pp. 550-575, 1998. https://doi.org/10.1002/(SICI)1521-3773(19980316)37:5<550::AID-ANIE550>3.0.CO;2-G
  6. Schife. H., Jaszewski. R. W., David. C., and Gobrecht. J., "Nanostructuring of Polymers and Fabrication of Interdigitated Electrodes by Hot Embossing Lirhography", Microelectron. Eng., Vol. 46, pp. 121-124, 1999. https://doi.org/10.1016/S0167-9317(99)00030-1
  7. Gottschalch. F., Hoffmann. T., Torres. C. M. S., Schulz. H., and Scheer. H. C., "polymer Issues in Nanoimprinting Technique", Solid State Electron., Vol. 43, pp. 1079-1083, 1999. https://doi.org/10.1016/S0038-1101(99)00028-3
  8. Snow. E. S., and Campbell. P. M., "Fabrication of Si nanostructures with an Atomic Force microscope", Appl. Phys. Lett., Vol. 64, pp. 1932-1934, 1994. https://doi.org/10.1063/1.111746
  9. Minne. S. C., Adams. J. D., Yaralioglu. G., Manalis. S. R., Atalar. A., and Quate. C. F., "Centimeter Scale Atomic Force microscope Imaging and Lithography", Appl. Phys. Lett., Vol. 73, pp. 1742-1744, 1998. https://doi.org/10.1063/1.122263
  10. Marrian. C. R. K., Perkins. F. K., Brandow. S. L., Koliski. T. S., Dobisz. E. A., and Calvert. J. M, "Low Voltage Electron Beam Lithography in Self-assembled Ultrathin Films with the Scanning Tunneling Microscope", Appl. Phys. Lett., Vol. 64, pp. 390-392, 1994. https://doi.org/10.1063/1.111157
  11. Ivanisevic. A., and Mirkin. C. A, "Dip-Pen Nanolithography on Semiconductor Surfaces", J. Am. Chem. Soc., Vol. 123, pp. 7887-7889, 2001. https://doi.org/10.1021/ja010671c
  12. Polmear, I. J., Light Alloys: Metallurgy of the Light Metals (3rd ed.), Butterworth-Heinemann, 1995.
  13. Lee. E. S., and Kim. C. G., "A Study on Machinig Characteristics of the Electropolishing of Aluminum alloy", Transactions of the KSMTE., Vol. 12, No. 2, pp. 17-22, 2003.
  14. Datta. A., Nam. K. T., Kim. S. h.,, and Kim. K. B., "Optimization of Al Interlayer Thickness for the Multilayer Diffusion Barrier Scheme in Cu Metallization", Journal of applied physics, Vol. 92, No. 2, pp. 1099-1105. 2002. https://doi.org/10.1063/1.1486039
  15. Graciaa. A., Lachaise. J., and MorelG. G., "Optimal Phase Behavior of Water Oilblend/surfactant Systems", Prog. colloid polym. sci., Vol. 93, pp. 257-260, 1993. https://doi.org/10.1007/BFb0118539
  16. Park. R. Y., and Kim. Y. H., "The Effects of Interfacial Properties of the Styrene/Water on the Styrene Latex Particle Properties using Triton X-100/SDS Surfactant Mixture", J. of the Korean Oil Chemists. Soc., Vol. 27, No. 3, pp. 240-248, 2010.