• 펄프종이기술
• /
• 제37권5호통권113호
• /
• pp.63-69
• /
• 2005

This study was performed to introduce recently developed polyvinylamine as a wet-end process and paper strength improving aids. As a retention and drainage aids, high cationic charged polyvinylamine was more effective at the BCTMP and ONP stock condition than LBKP stock condition. As a dry tensile strength aid, dual system of polyvinylamine with anionic polyacrylamide was the best at the LBKP or ONP stock conditions. On the other hand, polyvinyl amine alone was better than dual system of polyvinylamine with anionic polyacrylamide at the BCTMP condition. As a wet tensile strength aid, polyvinylamine single system and dual system of polyvinylamine with anionic polyacrylamide were good at LBKP, BCTMP and ONP stock conditions. However, poly(aminoamide)-epichlorohydrin resin was good at LBKP and ONP stock conditions but efficiency of poly(aminoamide)-epichlorohydrin resin was remarkably decreased at BCTMP stock condition.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
• /
• pp.1649-1652
• /
• 2006

2.22-inch qVGA $(240{\times}320)$ amorphous silicon thin film transistor liquid active matrix crystal display (${\alpha}$- Si TFT-AMLCD) panel has been successfully demonstrated employing a 2.5 um fine-patterning technology by a wet etch process. Higher resolution 2.22-inch qVGA LCD panel with an aperture ratio of 58% can be fabricated because the 2.5 um fine pattern formation technique is combined with high thermal photo-resist (PR) development. In addition, a novel concept of unique ${\alpha}$-Si TFT process architecture, which is advantageous in terms of reliability, was proposed in the fabrication of 2.22-inch qVGA LCD panel. Overall results show that the 2.5 um finepatterning is a considerably significant technology to obtain higher aperture ratio for higher resolution ${\alpha}$-Si TFT-LCD panel realization.

• Elastomers and Composites
• /
• 제55권3호
• /
• pp.184-190
• /
• 2020

In the wet master batch process, process oil is used to improve the workability of silica-SBR. The process oil expands the polymer and provides lubrication to soften the stiff rubber chain. However, addition of excess process oil can interfere in the crosslinking reaction between rubber molecules and reduce the crosslinking density of silica-SBR. Controlling the amount of process oil is an important aspect for properly controlling the workability and crosslinking density of silica-SBR. In this study, silica-SBR was prepared by adjusting the amount of process oil to confirm its effect on silicaSBR. Vulcanization characteristics of silica-SBR were examined using a moving die rheometer. Dynamic viscoelasticity was measured using a dynamic mechanical thermal analyzer, and the mechanical properties were investigated using the universal testing machine according to ASTM D412. As a result, all silica-SBR compounds with 10 to 40 phr of process oil have effects of improving the processability and the silica dispersibility. Also, the optimum condition was determined when 10 phr of processed oil was added because the abrasion resistance was improved 65% compared to that at 40 phr.

• 한국지하수토양환경학회지:지하수토양환경
• /
• 제18권7호
• /
• pp.41-53
• /
• 2013

The study is to propose the optimal separation technique of heavy metals (Pb and Zn) contaminated in soil for improving the removal efficiency by various applicable techniques. The heavy metal contaminated soil samples near abandoned mine X-1 and X-2 were used for the study. Firstly, the wet classification process was shown more than 80% of removal efficiency for lead and zinc. Meanwhile, the magnetic separation process was shown low removal efficiency for lead and zincs because those heavy metals were non-magnetic materials. For the next step, the flotation separation process was shown approximately 24.4% of removal efficiency for zinc, while the gravity concentration process was shown approximately 57% of removal efficiency for lead, and 19.9% of removal efficiency for zinc, respectively. Therefore, zinc contaminated in soil would be effectively treated by the combination technique of the wet classification and the flotation technique. Meanwhile, lead contaminated in soil would be effectively treated by the combination technique of the wet classification process and the flotation process. Furthermore, the extraction of organic matter was shown more effective with aeration, 3% of hydrogen peroxide and 3% of lime such as calcium hydroxide.

• 한국재료학회지
• /
• 제29권11호
• /
• pp.697-702
• /
• 2019

In this study, using a wet chemical process, we evaluate the effectiveness of different solution concentrations in removing layers from a solar cell, which is necessary for recovery of high-purity silicon. A 4-step wet etching process is applied to a 6-inch back surface field(BSF) solar cell. The metal electrode is removed in the first and second steps of the process, and the anti-reflection coating(ARC) is removed in the third step. In the fourth step, high purity silicon is recovered by simultaneously removing the emitter and the BSF layer from the solar cell. It is confirmed by inductively coupled plasma mass spectroscopy(ICP-MS) and secondary ion mass spectroscopy(SIMS) analyses that the effectiveness of layer removal increases with increasing chemical concentrations. The purity of silicon recovered through the process, using the optimal concentration for each process, is analyzed using inductively coupled plasma atomic emission spectroscopy(ICP-AES). In addition, the silicon wafer is recovered through optimum etching conditions for silicon recovery, and the solar cell is remanufactured using this recovered silicon wafer. The efficiency of the remanufactured solar cell is very similar to that of a commercial wafer-based solar cell, and sufficient for use in the PV industry.

• 한국전기전자재료학회논문지
• /
• 제30권12호
• /
• pp.800-805
• /
• 2017

Randomly patterned and wet chemical etching processes were used to treat anti-glare of display cover glasses. The surface and optical properties of grain size and surface morphology controlled by randomly patterned etching and wet chemical solution etching were investigated. The surface morphology and roughness of the etched samples were examined using a spectrophotometer and a portable surface roughness (Ra) measuring instrument, respectively. The gloss caused by reflection from the glass surface was measured at $60^{\circ}$ using a gloss meter. The surface of the sample etched by the doctor-blade process was more uniform than that obtained from a screen pattern etching process at gel state etching process of the first step. The surface roughness obtained from the randomly patterned etching process depended greatly on the mesh size, which in turn affected the grain size and pattern formation. The surface morphology and gloss obtained by the etching process in the second step depended primarily on the mesh size of the gel state etching process of the first step. In our experimental range, the gloss increased on decreasing the grain size at a lower mesh size for the first step process and for longer reaction times for the second step process.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
• /
• pp.418.2-418.2
• /
• 2016

$Al_2O_3$ passivation layer has excellent passivation properties at p-type Si surface. This $Al_2O_3$ layer forms thin $SiO_2$ layer at the interface. There were some studies about inserting thermal oxidation process to replace naturally grown oxide during $Al_2O_3$ deposition. They showed improving passivation properties. However, thermal oxidation process has disadvantage of expensive equipment and difficult control of thin layer formation. Wet chemical oxidation has advantages of low cost and easy thin oxide formation. In this study, $Al_2O_3$/$SiO_2/Si(100)$ interface was formed by wet chemical oxidation and PA-ALD process. $SiO_2$ layer at Si wafer was formed by $HCl/H_2O_2$, $H_2SO_4/H_2O_2$ and $HNO_3$, respectively. 20nm $Al_2O_3$ layer on $SiO_2/Si$ was deposited by PA-ALD. This $Al_2O_3/SiO_2/Si(100)$ interface were characterized by capacitance-voltage characteristics and quasi-steady-state photoconductance decay method.

• 펄프종이기술
• /
• 제46권4호
• /
• pp.62-68
• /
• 2014

The application of conifer leave to the papermaking process as a functional organic filler was investigated in this study. The powder of the conifer leave after hot water extraction for the functional extract, such as phytoncide, was applied to OCC stock. The comparison between the commercial wood flour and the conifer leave powder as organic filler for OCC paper were conducted with various wet pressing conditions. The amount of the water removal by the wet pressing process and the bulk of handsheet were increased by the addition of the wood flour and the conifer leave powder, although the tensile strength was decreased. At the higher pressure condition of the wet pressing, the wet pressing efficiency was greatly increased by the wood flour and the conifer leave powder. There was a little difference in the performance of the wood flour and the conifer leave powder as an organic filler. Those results showed the conifer leave powder could be an alternative resource to the wood powder for papermaking organic filler.

• 한국식품조리과학회지
• /
• 제15권2호
• /
• pp.185-190
• /
• 1999

보리로부터 전분분리 및 생산기술을 개발하기 위해 wet-milling, alkali 및 ethanol 처리를 병행한 전분 분리공정의 최적조건을 검토하였다. Wet-milling에서 최적 침지온도 및 시간을 검토한 결과 3$0^{\circ}C$, 12시간으로 처리하였을 때 단백질 5.7%, 전분함량이 69%를 나타내었으며 wet-milling에서 얻어진 조전분을 대상으로 100 mesh체로 처리시 전분의 백색도는 87%를 나타내었다. Alkali 처리에서의 최적조건은 0.2% NaOH로 6시간 처리하였을 때 가장 높은 단백질 제거 (0.3%)와 전분함량(93%)을 나타내었으며 10%(v/v) ethanol처리로 0.1% 조지방 함량을 나타냄으로써 잔존해 있는 조지방 성분이 제거되었음을 알 수 있었다. 상기의 최적조건에서 얻어진 전분의 성분은 단백질 0.1%, 전분함량 95%를 나타냈으며 기타의 성분의 순도 및 백색도가 시판되고 있는 옥수수전분 규격과 비교하여 볼 때 손색이 없었다.

• 펄프종이기술
• /
• 제37권3호
• /
• pp.50-58
• /
• 2005

It is generally known that paper industry is the second largest industry in the use of process water, and also have the highest environmental impact load in the contaminant sources. Paper is produced from the mixtures composed of 1% fibrous raw materials and 99% water. The optimum use of process water effects on the quality properties of paper and the environmental impact load of waste water treatment. In this research, the kinds of fibrous raw material & additives used in the paperboard production line were investigated, and the quantification of environmental loads and the environmental effects of process water on COD potential were evaluated. The NBDCODs were also analyzed from process water by the method of waste water treatment in paper mill and applied for the optimum use of recycling water, and zero effluent process. In the fibrous raw materials, KOCC caused the highest COD potentials, and sack paper & UKP was comparatively low. The NBDCOD of KOCC largely reduced after biological treatment because of easily biodegradable properties, but AOCC contained non-biodegradable materials. In chemical additives, COD was high in turns of rosin>starch>deaeration agent>dye, NBDCOD greatly reduced in starch and deaeration agent. In the case of 2 kinds of paperboard product, the COD potentials was mainly high in starch, AOCC and KOCC.