Browse > Article
http://dx.doi.org/10.4313/JKEM.2017.30.12.800

Optical Property and Surface Morphology Control by Randomly Patterned Etching  

Kim, Sung Soo (Gaingongyoung Corporation)
Lee, Jeong Woo (Department of Energy & Environmental Engineering, Shinhan University)
Jeon, Bup Ju (Department of Energy & Environmental Engineering, Shinhan University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.30, no.12, 2017 , pp. 800-805 More about this Journal
Abstract
Randomly patterned and wet chemical etching processes were used to treat anti-glare of display cover glasses. The surface and optical properties of grain size and surface morphology controlled by randomly patterned etching and wet chemical solution etching were investigated. The surface morphology and roughness of the etched samples were examined using a spectrophotometer and a portable surface roughness (Ra) measuring instrument, respectively. The gloss caused by reflection from the glass surface was measured at $60^{\circ}$ using a gloss meter. The surface of the sample etched by the doctor-blade process was more uniform than that obtained from a screen pattern etching process at gel state etching process of the first step. The surface roughness obtained from the randomly patterned etching process depended greatly on the mesh size, which in turn affected the grain size and pattern formation. The surface morphology and gloss obtained by the etching process in the second step depended primarily on the mesh size of the gel state etching process of the first step. In our experimental range, the gloss increased on decreasing the grain size at a lower mesh size for the first step process and for longer reaction times for the second step process.
Keywords
Anti glare; Randomly patterned etching; Etching solution; Surface morphology; Gloss;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 S. Verhaverbeke, I. Teerlinck, C. Vinckier, G. Stevens, R. Cartuyvels, and M. M. Heyns, J. Electrochem. Soc., 141, 2852 (1994). [DOI: https://doi.org/10.1149/1.2059243]   DOI
2 M. Sekine, Appl. Surf. Sci., 192, 270 (2002). [DOI: https://doi.org/10.1016/S0169-4332(02)00031-4]   DOI
3 J. K. Kang and C. B. Musgrave, J. Chem. Phys., 116, 275 (2002). [DOI: https://doi.org/10.1063/1.1420729]   DOI
4 T. E. Myers, S. Shanmugam, T. S. Alan, M. J. Towner, K. W. Uhlig, and L. Zhang, U.S. 20130299452 A1, 14 November, 2013.
5 E. Wang and Y. Zhao, Opt. Lett., 39, 3748 (2014). [DOI: https://doi.org/10.1364/OL.39.003748]   DOI
6 V. Bliznetsov, H. M. Lin, Y. J. Zhang, and D. Johnson, J. Micromech. Microeng., 25, 087002 (2015). [DOI: https://doi.org/10.1088/0960-1317/25/8/087002]   DOI
7 C. T. Lee, Appl. Chem. Eng., 27, 101 (2016). [DOI: https://doi.org/10.14478/ace.2016.1005]   DOI
8 G.A.C.M. Spierings, J. Mater. Sci., 28, 6261 (1993). [DOI: https://doi.org/10.1007/BF01352182]   DOI
9 S. S. Kim, J. S. Hwang, and B. J. Jeon, J. Korean Inst. Electr. Electron. Mater. Eng., 28, 607 (2015). [DOI: https://doi.org/10.4313/JKEM.2015.28.9.607]