• Journal of Welding and Joining
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• v.33 no.3
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• pp.32-39
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• 2015

With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

• Journal of the Society of Naval Architects of Korea
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• v.41 no.1
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• pp.55-63
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• 2004

This paper is concerned with the simulator to estimate deformation due to welding of panel blocks. An efficient computer program system has been developed which can be applied to estimation of weld-induced deformation under the given welding conditions. The theoretical background of the present simulator is described with the prediction model for the various type of weld-induced deformation. The developed simulator has been applied to estimation of weld-induced deformation in panel block assembly. This paper ends with some findings from applying the developed simulator.

• International Journal of Precision Engineering and Manufacturing
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• v.4 no.3
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• pp.36-41
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• 2003

This paper describes a numerical analysis of a non-steady state porthole die extrusion, which is useful for manufacturing long tubes with a hollow section. Materials divided through several portholes are gathered within a chamber and are then welded under high pressure. This weldability classifies the quality of tube products and is affected by process variables and die shapes. However, porthole die extrusion has been executed based on the experience of experts, due to the complicated die assembly and the complexity of metal flow. In order to better assist the design of die and to obtain improvement of productivity, non-steady state 3D FE simulation of porthole die extrusion is required. Therefore, the objective of this study is to analyze the behavior of metal flow and to determine the welding pressure of hot extrusion products under various billet temperatures, bearing length, and tube thickness by FE analysis. The results of FE analysis are compared with those of experiments.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.331-333
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• 2005

It comes up conversation in automobile industry that some technologies related to production and quality for goods have to be developed to make rationalization of the unit cost of production because material of car muffler is replaced by expensive stainless steel having corrosion-resistance and oxidation-resistance. Quality evaluation and control is direct method for the company producing welded goods in large quantities to increase productivity and to improve quality. It seems that prevention of inferior quality and increasement of productivity will be hard if production design does not have quality evaluation method related to weld assembly, They have been producing welded goods using MIG weld but still do not have not only quality evaluation method but also evaluation criterion for welded joint. In this study, the way for development of quality evaluation method is showed by analysis and calculation of waveform to improve technology related to welding process

• International Journal of Ocean System Engineering
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• v.2 no.2
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• pp.82-91
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• 2012

Fillet welding is widely used in the assembly of ships and offshore structures. The T-joint configuration is frequently reported to experience fatigue damage when a marine structure meets extreme loads such as storm loads. Fatigue damage is affected by the magnitude of residual stresses on the weld. Recently, many shipping registers and design guides have required that the fatigue strength assessment procedure of seagoing structures under wave-induced random loading and storm loading be compensated based on the effect of residual stresses. We propose a computational procedure to analyze the residual stresses in a T-joint. Residual stresses are measured by the X-ray diffraction (XRD) method, and a 3-D finite element analysis (FEA) is performed to obtain the residual stress profile in the T-joint. The proposed finite element model is validated by comparing experiments with computational results, and the characteristics of the residual stresses in the T-joint are discussed.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1499-1504
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• 2007

Spot-welding is widely used to construct passenger car bodies in automotive industry. Occasionally severe spot-weld distortions in sub-assembly make further spot-weld difficult. In this paper, distortions for various spot-weld conditions are measured using coordinate measuring machine. Then, based on finite element solution for unit translation or unit rotation of nugget edge, equivalent loads for spot-weld distortions are determined. They can be used to predict the spot-weld distortion using finite element method.

• Journal of the Society of Naval Architects of Korea
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• v.39 no.1
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• pp.49-60
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• 2002

Welding is essential in ship production since welding is very popular method for joining two or more metals. However, welding causes residual stress and distortion and these give a bad influence to the structure strength and assembly of ship blocks. Therefore, prediction and treatment of residual stress and distortion is a key to accuracy control in shipyard. In this paper, a computational procedure, based on thermal-elastic-plastic 3-dimensional FEA, has been suggested to simulate butt and fillet welding process. In the simulation process, temperature distribution at each time step is obtained by heat transfer analysis and then thermal deformation analysis is done with obtained temperature distributions to find the residual stress and distortion. In heat transfer analysis, enthalpy method is used to realize phase change at melting temperature. Also element birth and death method is used to simulate adding of weld metal in both heat transfer analysis and thermal elastic plastic analysis. The proposed procedure is verified by related researches and the results show good agreement with those of related researches.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.25 no.4
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• pp.472-481
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• 2015

Objectives: Welding is a major task in shipbuilding yards that generates welding fumes. A significant amount of welding in shipbuilding yards is done on steel. Inevitably, manganese is present in the base metals being joined and the filler wire being used and, consequently, in the fumes to which workers are exposed. The objective of this work was to characterize manganese exposure associated with work area, total and particle size-selective mass concentration, and compare the mass concentrations obtained using a three-piece cassette sampler, size-selective impactor sampler and blood manganese concentrations. Materials: All samples were collected from the main work areas at one shipbuilding yard. We used a three piece cassette sampler and the eight stage cascade impactor sampler for the airborne manganese mass concentration of total and all size fractions, respectively. In addition, we used the results of health examination of workers sampled for airborne manganese. Results: The oder of high concentration of airborne manganese in shipbuilding processes was as follows; block assembly, block erection, outfitting installation, steel cutting, and outfitting preparation. The percentages of samples that exceeded the OES of the ministry of employment and labor by the cassette sampling method was 12.5%, however 59.1% of sampled workers by the impactor sampling method exceeded the TLV of the ACGIH. Conclusions: Even though the manganese concentrations in blood of workers exposed to higher airborne manganese concentration were higher than among those exposed to lower concentrations, there was no difference in blood manganese concentrations among work duration. The data analyzed here by characterizing size-selective mass concentrations indicates that the inhaled manganese of welders in shipbuilding yards could be mostly manganese-containing respirable particle sizes.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.