• Title/Summary/Keyword: W-doping

Search Result 198, Processing Time 0.024 seconds

The study of plasma source ion implantation process for ultra shallow junctions (Ulra shallow Junctions을 위한 플라즈마 이온주입 공정 연구)

  • Lee, S.W.;Jeong, J.Y.;Park, C.S.;Hwang, I.W.;Kim, J.H.;Ji, J.Y.;Choi, J.Y.;Lee, Y.J.;Han, S.H.;Kim, K.M.;Lee, W.J.;Rha, S.K.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2007.06a
    • /
    • pp.111-111
    • /
    • 2007
  • Further scaling the semiconductor devices down to low dozens of nanometer needs the extremely shallow depth in junction and the intentional counter-doping in the silicon gate. Conventional ion beam ion implantation has some disadvantages and limitations for the future applications. In order to solve them, therefore, plasma source ion implantation technique has been considered as a promising new method for the high throughputs at low energy and the fabrication of the ultra-shallow junctions. In this paper, we study about the effects of DC bias and base pressure as a process parameter. The diluted mixture gas (5% $PH_3/H_2$) was used as a precursor source and chamber is used for vacuum pressure conditions. After ion doping into the Si wafer(100), the samples were annealed via rapid thermal annealing, of which annealed temperature ranges above the $950^{\circ}C$. The junction depth, calculated at dose level of $1{\times}10^{18}/cm^3$, was measured by secondary ion mass spectroscopy(SIMS) and sheet resistance by contact and non-contact mode. Surface morphology of samples was analyzed by scanning electron microscopy. As a result, we could accomplish the process conditions better than in advance.

  • PDF

Effects of Phosphorus Doping Concentration on the Oxidation Kinetics of Tungsten Polycide I (텅스텐 폴리사이드의 산화반응속도에 미치는 인 도핑 농도의 영향 I)

  • 이종무;윤국한;임호빈;이종길
    • Electrical & Electronic Materials
    • /
    • v.4 no.1
    • /
    • pp.19-30
    • /
    • 1991
  • W/Si의 조성비가 2.6인 CVD텅스텐 실리사이드를 어닐링처리후 dry 또는 wet oxidation하여 폴리사이드 구조에서 다결정 Si내의 농도가 실리사이드의 산화반응속도에 미치는 영향을 조사하였다. 인의 농도에 관계없이 항상 실리사이드의 산화속도가 (100)Si의 그것보다 더 높았다. 저온에서 dry oxidation한 경우 인의 농도가 증가함에 따라 산화속도는 감소하였으나 고온에서 dry oxidation한 경우에는 P농도와 산화속도간에 상관관계가 별로 없었다. 한편, wet oxidation의 경우에는 모든 산화온도에서 인의 농도가 높을수록 실리사인의 산화속도가 더 낮은 것으로 나타났다.

  • PDF

Electron Paramagnetic Resonance Study of Al-incorporated ZnO:Mn Diluted Magnetic Semiconductors

  • Park, Jun Kue;Lee, K.W.;Choi, D.M.;Lee, Cheol Eui
    • Journal of the Korean Physical Society
    • /
    • v.73 no.12
    • /
    • pp.1884-1888
    • /
    • 2018
  • We have employed electron paramagnetic resonance spectroscopy and magnetization measurements in order to study the effect of Al-incorporation on the magnetic interactions in ZnO:Mn diluted magnetic semiconductors. Al-doping is shown to decrease the antiferromagnetic correlation and to increase the ferromagnetic interaction, which is attributed to the hydrogen-mediated ferromagnetic Mn complexes in our Mn-doped ZnO samples.

Discharge Characteristics of Plasma Jet Doping Device with the Atmospheric and Ambient Gas Pressure (플라즈마 제트 도핑 장치의 대기 및 기체의 압력 변화에 대한 방전 특성)

  • Kim, J.G.;Lee, W.Y.;Kim, Y.J.;Han, G.H.;Kim, D.J.;Kim, H.C.;Koo, J.H.;Kwon, G.C.;Cho, G.S.
    • Journal of the Korean Vacuum Society
    • /
    • v.21 no.6
    • /
    • pp.301-311
    • /
    • 2012
  • Discharge property of plasma jet devices is investigated for the application to the doping processes of crystalline solar cells and others. Current-voltage characteristics are shown as the typical normal-glow discharge in the various gas pressure of plasma jets, such as in the atmospheric plasma jets of Ar-discharge, in the ambient pressure of atmospheric discharge, and in the ambient Ar-pressure of Ar-discharge. The discharge voltage of atmospheric plasma jet is required as low as about 2.5 kV while the operation voltage of low pressure below 200 Torr is low as about 1 kV in the discharge of atmospheric and Ar plasma jets. With a single channel plasma jet, the irradiated plasma current on the doped silicon wafer is obtained high as the range of 10~50 mA. The temperature increasement of wafer is normally about $200^{\circ}C$. In the result of silicon wafers doped by phosphoric acid with irradiating the plasma jets, the doping profiles of phosphorus atoms shows the possibility of plasma jet doping on solar cells.

Advances in High Emission Sc2O3-W Matrix Cathode Materials

  • Wang, Jinshu;Yang, Yunfei;Liu, Wei;Wang, Yiman
    • Applied Microscopy
    • /
    • v.46 no.1
    • /
    • pp.20-26
    • /
    • 2016
  • Our work on $Sc_2O_3-W$ matrix dispenser cathodes had been reviewed in this paper. The cathode with uniform distribution of $Sc_2O_3$ had been obtained using liquid-liquid doping method. The cathode had excellent emission property, i.e., the emission current density in pulse condition could reach over $35A/cm^2$. It was found that the cathode surface was covered by a Ba-Sc-O active substance multilayer with a thickness of about 100 nm, which was different from the monolayer and semiconducting layer in thickness. Furthermore, the observation results displayed that nanoparticles appeared at the growth steps and the surface of tungsten grains of the fully activated cathode. The calculation result indicated that the nanoparticles could cause the increase of local electric field strengths. We proposed the emission model that both the Ba-Sc-O multilayer and the nanoparticles distributing mainly on the growth steps of the W grains contributed to the emission. The future work on this cathode has been discussed.

Effect of Microwave Irradiation on Morphology and Size of Anatase Nano Powder: Efficient Photodegradation of 4-Nitrophenol by W-doped Titania

  • Shojaei, Abdollah Fallah;Loghmani, Mohammad Hassan
    • Bulletin of the Korean Chemical Society
    • /
    • v.33 no.12
    • /
    • pp.3981-3986
    • /
    • 2012
  • Anatase nanocrystalline and its tungsten-doped (0.4, 2, and 4 mol %) powders have been synthesized by microwave irradiation through hydrolysis of titanium tetra-isopropoxide (TIP) in aqueous solution. The materials are characterized by XRD, Raman, SEM-EDX, TEM, FT-IR and UV-vis techniques. The nanocrystalline $TiO_2$ particles are 30 nm in nature and doping of tungsten ion decreases their size. As seen in TEM images, the crystallites of W (4 mol %) doped $TiO_2$ are small with a size of about 10 nm. The photocatalytic activity was tested on the degradation of 4-nitrophenol (4-NP). Catalytic activities of W-doped and pure $TiO_2$ were also compared. The results show that the photocatalytic activity of the W-doped $TiO_2$ photocatalyst is much higher than that of pure $TiO_2$. Degradation decreases from 96 to 50%, during 115 min, when the initial 4-NP concentration increases from 10 to 120 ppm. Maximum degradation was obtained at 35 mg of photocatalyst.

NiO/La2O3-ZrO2/WO3 Catalyst Prepared by Doping ZrO2 with La2O3 and Modifying with WO3 for Acid Catalysis

  • Sohn, Jong-Rack;Choi, Hee-Dong;Shin, Dong-Chul
    • Bulletin of the Korean Chemical Society
    • /
    • v.27 no.6
    • /
    • pp.821-829
    • /
    • 2006
  • A series of catalysts, $NiO/La_2O_3-ZrO_2/WO_3$, for acid catalysis was prepared by the precipitation and impregnation methods. For the $NiO/La_2O_3-ZrO_2/WO_3$ samples, no diffraction lines of nickel oxide were observed, indicating good dispersion of nickel oxide on the catalyst surface. The catalyst was amorphous to X-ray diffraction up to 300 ${^{\circ}C}$ of calcination temperature, but the tetragonal phase of $ZrO_2$ and monoclinic phase of $WO_3$ by the calcination temperatures from 400 ${^{\circ}C}$ to 700 ${^{\circ}C}$ were observed. The role of $La_2O_3$ in the catalyst was to form a thermally stable solid solution with zirconia and consequently to give high surface area and acidity. The high acid strength and high acidity were responsible for the W=O bond nature of complex formed by the modification of $ZrO_2$ with $WO_3$. For 2-propanol dehydration the catalyst calcined at 400 ${^{\circ}C}$ exhibited the highest catalytic activity, while for cumene dealkylation the catalyst calcined at 600 ${^{\circ}C}$ showed the highest catalytic activity. 25-$NiO/5-La_2O_3-ZrO_2/15-WO_3$ exhibited maximum catalytic activities for two reactions due to the effects of $WO_3$ modifying and $La_2O_3$ doping.

Development of SiGe Heterostructure Epitaxial Growth and Device Fabrication Technology using Reduced Pressure Chemical Vapor Deposition (저압화학증착을 이용한 실리콘-게르마늄 이종접합구조의 에피성장과 소자제작 기술 개발)

  • Shim, K.H;Kim, S.H;Song, Y.J;Lee, N.E;Lim, J.W;Kang, J.Y
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.18 no.4
    • /
    • pp.285-296
    • /
    • 2005
  • Reduced pressure chemical vapor deposition technology has been used to study SiGe heterostructure epitaxy and device issues, including SiGe relaxed buffers, proper control of Ge component and crystalline defects, two dimensional delta doping, and their influence on electrical properties of devices. From experiments, 2D profiles of B and P presented FWHM of 5 nm and 20 nm, respectively, and doses in 5×10/sup 11/ ∼ 3×10/sup 14/ ㎝/sup -2/ range. The results could be employed to fabricate SiGe/Si heterostructure field effect transistors with both Schottky contact and MOS structure for gate electrodes. I-V characteristics of 2D P-doped HFETs revealed normal behavior except the detrimental effect of crystalline defects created at SiGe/Si interfaces due to stress relaxation. On the contrary, sharp B-doping technology resulted in significant improvement in DC performance by 20-30 % in transconductance and short channel effect of SiGe HMOS. High peak concentration and mobility in 2D-doped SiGe heterostructures accompanied by remarkable improvements of electrical property illustrate feasible use for nano-sale FETs and integrated circuits for radio frequency wireless communication in particular.

A simulation study on the structural optimization of a 800V 4H-SiC Power DMOSFET (800V급 4H-SiC DMOSFET 전력 소자 구조 최적화 시뮬레이션)

  • Choi, Chang-Yong;Gang, Min-Seok;Bang, Wook;Kim, Sang-Chul;Kim, Nam-Kyun;Koo, Sang-Mo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2009.04b
    • /
    • pp.35-36
    • /
    • 2009
  • In this work, we demonstrate 800V 4H-SiC power DMOSFETs with several structural alterations to obtain a low threshold voltage ($V_{TH}$) and a high figure of merit ($V_B^2/R_{SP,ON}$). To optimize the device performance, we consider four design parameters; (a) the doping concentration ($N_{CSL}$) of current spreading layer (CSL) beneath the p-base region, (b) the thickness of p-base ($t_{BASE}$), (c) the doping concentration ($N_J$) and width ($W_J$) of a JFET region, (d) the doping concentration ($N_{EPI}$) and thickness ($t_{EPI}$) of epi-layer. These parameters are optimized using 2D numerical simulation and the 4H-SiC DMOSFET structure results in a threshold voltage ($V_{TH}$) below ~3.8V, and high figure of merit ($V_B^2/R_{SP,ON}$>${\sim}200MW/cm^2$) for a power MOSFET in $V_B$-800V range.

  • PDF

Characteristics of the Silicon Epitaxial Films Grown by RTCVD Method (RTCVD 법으로 성장한 실리콘 에피막의 특성)

  • Chung, W.J.;Kwon, Y.K.;Bae, Y.H.;Kim, K.I.;Kang, B.K.;Sohn, B.K.
    • Journal of Sensor Science and Technology
    • /
    • v.5 no.1
    • /
    • pp.63-70
    • /
    • 1996
  • Silicon epitaxial films of submicron level were successfully grown by the RTCVD method. For the growth of silicon epitaxial layers, $SiH_{2}Cl_{2}\;/\;H_{2}$ gas mixtures and various process parameters including $H_{2}$ prebake process were used. The growth conditions were varied to investigate their effects on the interface abruptness of doping profile, the film growth rates and crystalline properties. The crystallinity of the undoped silicon was excellent at the growth temperature of $900^{\circ}C$. The doping profiles were measured by SIMS technique. The abruptness of doping profile would be controlled within about $200{\AA}/decade$ in the structure of undoped Si / $n^{+}-Si$ substrate.

  • PDF