• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.54-56
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• 2005

Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.97-101
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

• International Journal of Korean Welding Society
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• v.4 no.1
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• pp.46-52
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• 2004

To combine the mechanical advantages of ceramics with those of metals, one often uses both materials within one composite component. But, as known, they have different material properties and fracture behaviors. In this study, a four-point bending test is carried out on $Si_3N_4$ joined to ANSI 304L stainless steel with a Ti-Ag-Cu filler and a Cu interlayer at room temperature to evaluate their longitudinal strain behaviors. And, to detect localized strain, a couple of strain gages are pasted near the joint interfaces of the ceramic and metal sides. The normal strain rates are varied from $3.33{\times}10^5$ to $3.33{\times}10^{-1}s^{-1}$ Within this range, the experimental results showed that the four-point bending strength and the deflection of the interlayer increased with increasing the strain rate.

• ETRI Journal
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• v.41 no.3
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• pp.396-407
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• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

• Journal of the Korean Society for Heat Treatment
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• v.29 no.1
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• pp.1-7
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• 2016

Titanium and its alloys can be usually joined with brazing method. And the alloys should be brazed at low temperature to keep their original microstructure. In this study, the mechanical strength and microstructure of the CP-Ti joint-brazed with $Zr_{54}Ti_{22}Ni_{16}Cu_8$ filler metal having melting temperature of $774{\sim}783^{\circ}C$ were investigated. The tensile strengths of the joint-brazed at $800^{\circ}C$ with $100^{\circ}C/min$ of cooling rate showed more than 400 MPa which was as high as base metal. The $Widmanst{\ddot{a}}tten$ structure consisting of Ti and $Ti_2Ni$ phase was observed in the joint area. However, the tensile strengths of the joint-brazed at $800^{\circ}C$ with $15^{\circ}C/min$ of cooling rate were decreased and the Ti, $(Ti,Zr)_2Ni$ and $Ti_2Ni$ phases were observed at the joint area. It is believed that the $(Ti,Zr)_2Ni$ laves phases could decrease the mechanical strength of the joint and the cooling rate should be controled to get high strength of the titanium joint.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.12
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• pp.1120-1127
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• 2013

In this paper, novel chip-on-chip(CoC) flip-chip bump structures using chip-on-wafer(CoW) process technology are proposed, designed and fabricated, and their microwave frequency responses are analyzed. With conventional bumps of Cu pillar/SnAg and Cu pillar/Ni/SnAg and novel Polybenzoxazole(PBO)-passivated bumps of Cu pillar/SnAg, Cu pillar/Ni/SnAg and SnAg with the deposition option of $2^{nd}$ Polyimide(PI2) layer on the wafer, 10 kinds of CoC samples are designed and their frequency responses up to 20 GHz are investigated. The measurement results show that the bumps on the wafers with PI2 layers are better for the batch flip-chip process and have average insertion loss of 0.14 dB at 18 GHz. The developed bump structures for chips with fine-pitch pads show similar or slightly better insertion loss of 0.11~0.14 dB up to 18 GHz, compared with that of 0.13~0.17 dB of conventional bump structures in this study, and we find that they could be utilized in various microwave packages for high integration density.

• Economic and Environmental Geology
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• v.5 no.3
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• pp.133-144
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• 1972

The mine of our present concern is situated at Shim-ri, Gusan-myon, Changwon-gun, Kyongsang-namdo, with lattitude $128^{\circ}35^{\prime}{\sim}36^{\prime}N$ and longitude $35^{\circ}03^{\prime}{\sim}04^{\prime}E$. This mine has not been noticed until the intermittent geological survey for the ore deposits were initiated from September, 1967 till 1970. The main mineralized zones, No.1 and No.2 zones, were studied by the diamond drilling of 9 holes down to the total depth of 1,140m, and found to have ore reserves of Cu 1.99% ore, estimated to reach around $358,000{\frac{M}{T}}$ (proved $117,000{\frac{M}{T}}$, indicated $241,000{\frac{M}{T}}$), which triggered the new exploitation of this mine. Geological composition of the district near the mine is mainly from the andesite belonging to the Silla Series of Kyongsang System and the distribution is broadly spread. Ore deposits are the hydrothermal one, filling the shear zone formed alongside the andesite main joint. There are two stripes of copper bearing mineralized zone which are about 40~70 meters apart and parallel to each other, in addition to which two others are expected. The strike of the main mineralized zone lies at $N15^{\circ}{\sim}20^{\circ}W$, the dip at $60^{\circ}{\sim}70^{\circ}NE$. The principal components of the ore mineral are chalcopyrite, bornite and as secondary, cuprite, tenorite, azurite and malachite. Pyrite, magnetite, specular hematite, very little of galena, sphalerite, quartz, epidote, zoisite, chlorite and calcite are found as gangue mineral. Confirmed by the drilling, the main mineralized zone, No.1 zone, has the length of 320m, average width of 1.62m, Ag 26g/t, Cu 1.84% and the average width of the ore zone except the narrow barren andesite horse interposed in the mineralized zone is 1.32m with Ag 32g/t and Cu 2.26%. The mineralized zone No.2 is 340m long, 1.00m wide with Ag 30g/t and Cu 2.15%. Neglecting the barren andesite horse the width is 0.73m with Ag 42g/t and Cu 2.94%.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.134-139
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• 2007

This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.

• Economic and Environmental Geology
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• v.9 no.3
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• pp.143-156
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• 1976

The Cretaceous metal ore deposits in the Gyeongsang basin of Gyeongsangbuk-do are characterized by the formation of metallogenic provinces which show zonal distribution pattern around Yeonil province where pneumatolytic type is dominated and hydrothermal type are distributed in the order of decreasing temperature type outward. Some Cretaceous granitic rocks include zoned alkali feldspars which reflect rapid variation of $H_2O$ during emplacement and crystallization of the water-saturated granitic magma. The ore deposits are considered to be originated from upward transportation of ore solution from the excess of water exhausted from uprising magma, which seems to be intimately related to the fact that the majority of the ore deposits in Daegu area are cummulated around the granites including zoned alkali feldspars. In order to collect geochemical data necessary for geochemical exploration in the study area, certain trace elements were chosen as pathfinders from monzonite and soil in the vicinity of Dalsung Tungsten Mine by studying the dispersion patterns of trace elements: Ba and Sr show trends to decrease toward ore deposit while Cu, Pb, and Mo increase. Around mining area there are distributed apparently Equisetum arvense Linne and Mentha sachinensis Kudo which may be used as index plants. In the viewpoint of geologic structure, the trends of the ore veins in contact aureole around the Palgongsan granite body correspond with the pre- and syn- plutonism joint pattern in hornfels in the area.