1 |
Nah, J. W., Kim, J. H., Lee, H. M. and Paik, K. W., 2004, 'Electromigraion in Flip Chip Solder Bump of 97PB-3Sn/37Pb-63Sn Combination Structure,' Acta Materialia, Vol. 52, pp. 129-136
DOI
ScienceOn
|
2 |
Shed, A., 2004, 'Accumulated Creep Strain and Energy Density based Thermal Fatigue Life Prediction Models for SnAgCu Solder Joint,' 54th ECTC, Las Vegas, Nevada, USA, pp. 737-746
|
3 |
Darveaux, R., 1997, 'Solder Joint Fatigue Life Model, in Design and Reliability of Solders and Solder Interconnections,' Miner. Meta. Mater. Soc., pp. 213-218
|
4 |
Shed, A., 2001, 'Predicting Solder Joint Reliability for Thermal, Power, and Bend Cycle within 25% Accuracy,' 2001 Electronic Components and Technology Conference, pp. 255-263
|
5 |
Hossain, M. and Agonafer, D., 2004, 'Strain based Approach for Predicting the Solder Joint Fatigue Life with the Addition of Intermetallic Compound using Finite Element Modeling,' 2004 International Society Conference on Thermal Phenomena, pp. 358-367
|
6 |
Shin, K. H. and Chung, S. K., 2006, 'FEA-based Design and Fabrication of Functionally Graded Materials,' Key Engineering Materials, Vol. 326-328, pp. 1681-1684
|
7 |
Kim, C. H, Hong, J. S. and Han, G. Y., 2006, 'Performance Advancement of Evaluation Algorithm for Inner Defects in Semiconductor Packages,' Transactions of KSMTE, Vol. 15, No. 6, pp. 82-87
과학기술학회마을
|
8 |
Jang, S. Y., Wolf, J, Kwon, W. S. and Paik, K. W., 2002, 'UBM(Under Bump Metallization) Study for Pb-free Electroplating Bumping: Interface Reaction and Electromigration,' 2002 Electronic Components and Technology Conference
|
9 |
Lau, J. and Liu, K., 2004, 'Global Trends in Lead-free Soldering-Part I and II,' Advanced Packaging
|