• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.4 s.33
• /
• pp.43-48
• /
• 2004

Electromigration of Sn-3.5Ag-0.5Cu solder bumps was investigated with current densities of $3{\~}4{\times}10^4 A/cm^2$ at temperatures of $130{\~}160^{\circ}C$ using flip chip specimens which consisted of upper Si chip and lower Si substrate. Electromigration failure of the Sn-3.5Ag-0.5Cu solder bump occurred with complete consumption of Cu UBM and void formation at cathode side of the solder bump. The activation energies for electromigration of the Sn-3.5Ag-0.5Cu solder bump were measured as 0.61 eV at current density of $3{\times}10^4 A/cm^2$, 0.63 eV at $3.5{\times}10^4 A/cm^2$, and 0.77 eV at $4{\times}10^4 A/cm^2$, respectively.

• Korean Journal of Materials Research
• /
• v.9 no.8
• /
• pp.825-830
• /
• 1999

Characteristics of SiOF films deposited by a FTES/$O_2$-plasma enhanced chemical vapor deposition method have been investigated using Fourier transform infrared spectroscopy, X-ray photoelectro spectroscopy, and ellipsometry. Electrical properties such as dielectric constant, dielectric breakdown and leakage current density are investigated using C-V and I-V measurements with MIS(Au/SiOF/p-Si) capacitor structure. Stepcoverage of the films have been also characterized using scanning electron microscopy and ellipsometry. A high quality SiOF film was formed on that the flow rates of FTES and $O_2$were 300sccm, respectively. The dielectric constant of the deposited SiOF film was about 3.1. This value is lower than that of the oxide films obtained using other method. The dielectric breakdown field and leakage current are more than 10MV/cm and about $8[\times}10^{9}A/\textrm{cm}^2$, respectively. The deposited SiOF film with thickness as $2500{\AA}$ on the $0.3{\mu}{\textrm}{m}$ metal pattern shows a high step-coverage without a void.

• Proceedings of the Korean Society of Propulsion Engineers Conference
• /
• 2012.05a
• /
• pp.331-341
• /
• 2012

A modified Ignition and Growth(I&G) model which is necessary to simulate the combustion phenomena of energetic materials and an analytical model determining the unknown parameters of the reaction rate equation are proposed. The modified I&G model sustains important physical implications with overcoming some problems of previous rate equations. This rate model consist of Ignition term which represent the formation of the hotspot due to void collapse and Growth term which means the shock to detonation transition phenomena. Also, the theoretical model is used to investigate the combustion characteristics of certain energetic materials before running Hydrocode by pre-determination of unknown parameter, b, G, x, I. The analytical model provides efficient and highly accurate results rather than previous method which simulated the unconfined-rate-stick via the numerical means.

• Composites Research
• /
• v.17 no.3
• /
• pp.1-7
• /
• 2004

In the vacuum assisted RTM (VARTM) process that has become the center of attention for manufacturing massive composite structures, a good evacuation of air in the fiber preform is recognized as the prime factor. The microvoids, or the dry spots, are formed as a result of improper gate/vent locations and the mold geometry. The non-uniform resin velocity at the flow front leads to the formation of microvoids in the fibers, whereas the air in the microvoids can migrate along with the resin flow during mold filling. The residual air in the internal voids of a composite structure may cause a degradation of the mechanical properties as well as the structural failure. In this study, a unified macro- and micro analysis methods were developed to investigate the formation and transport of air in resin during VARTM process. A numerical simulation program was developed to analyze the three-dimensional flow pattern as well as the macro- and microscopic distribution of air in a composite part fabricated by VARTM process.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.53-53
• /
• 2011

As the dimension of Cu interconnects has continued to reduce, its resistivity is expected to increase at the nanoscale due to increased surface and grain boundary scattering of electrons. To suppress increase of the resistivity in nanoscale interconnects, alloying Cu with other metal elements such as Al, Mn, and Ag is being considered to increase the mean free path of the drifting electrons. The formation of Al alloy with a slight amount of Cu broadly studied in the past. The study of Cu alloy including a very small Al fraction, by contrast, recently began. The formation of Cu-Al alloy is limited in wet chemical bath and was mainly conducted for fundamental studies by sputtering or evaporation system. However, these deposition methods have a limitation in production environment due to poor step coverage in nanoscale Cu metallization. In this work, gap-filling of Cu-Al alloy was conducted by cyclic MOCVD (metal organic chemical vapor deposition), followed by thermal annealing for alloying, which prevented an unwanted chemical reaction between Cu and Al precursors. To achieve filling the Cu-Al alloy into sub-100nm trench without overhang and void formation, furthermore, hydrogen plasma pretreatment of the trench pattern with Ru barrier layer was conducted in order to suppress of Cu nucleation and growth near the entrance area of the nano-scale trench by minimizing adsorption of metal precursors. As a result, superconformal gap-fill of Cu-Al alloy could be achieved successfully in the high aspect ration nanoscale trenches. Examined morphology, microstructure, chemical composition, and electrical properties of superfilled Cu-Al alloy will be discussed in detail.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
• /
• v.20 no.1
• /
• pp.43-63
• /
• 2022

The aim of this review is to communicate some essential knowledge of the underlying mechanism of the corrosion of structural containment alloys during molten salt reactor operation in the context of prospective online monitoring in future MSR installations. The formation of metal halide species and the progression of their concentration in the molten salt do reflect containment corrosion, tracing the depletion of alloying metals at the alloy salt interface will assure safe conditions during reactor operation. Even though the progress of alloying metal halides concentrations in the molten salt do strongly understate actual corrosion rates, their prospective 1^st order kinetics followed by near-linearly increase is attributed to homogeneous matrix corrosion. The service life of the structural containment alloy is derived from homogeneous matrix corrosion and near-surface void formation but less so from intergranular cracking (IGC) and pitting corrosion. Online monitoring of corrosion species is of particular interest for molten chloride systems since besides the expected formation of chromium chloride species CrCl₂ and CrCl₃, other metal chloride species such as FeCl₂, FeCl₃, MoCl₂, MnCl₂ and NiCl₂ will form, depending on the selected structural alloy. The metal chloride concentrations should follow, after an incubation period of about 10,000 hours, a linear projection with a positive slope and a steady increase of < 1 ppm per day. During the incubation period, metal concentration show 1^st order kinetics and increasing linearly with time^1/2. Ideally, a linear increase reflects homogeneous matrix corrosion, while a sharp increase in the metal chloride concentration could set a warning flag for potential material failure within the projected service life, e.g. as result of intergranular cracking or pitting corrosion. Continuous monitoring of metal chloride concentrations can therefore provide direct information about the mechanism of the ongoing corrosion scenario and offer valuable information for a timely warning of prospective material failure.

• The Korean Journal of Rheology
• /
• v.11 no.1
• /
• pp.34-43
• /
• 1999

Flow-induced voids during resin impregnation and poor fiber wetting have known to be highly detrimental to the performance of composite parts manufactured by resin transfer molding(RTM) process. In this study, in order to overcome these serious problems encountered in RTM, the effects of surface modification by using silane coupling agent as a surface modifier on the flow characteristics, the wetting between resin and fiber, and void content were investigated. For the experiments of microscopic flow visualization and curing in a beam mold, glass fiber mats having plain weaving structure and epoxy resin were used. Modifying the fiber surface was found to result in a significant decrease of dynamic contact angle between resin and fiber and increase of wicking rate. Therefore, it was confirmed that the surface modification employed in this study could improve the wettability of reinforcing fibers as well as micro flow behavior. In addition, It was revealed that high temperature and low penetration rate of the resin are more favorable processing conditions to reduce the dynamic contact angle. However, surface modified fiber mat was found to have lower permeability than the unmodified one, which may be explained in terms of the decrease of contact time between resin and fiber owing to improvement of wetting. It was also exhibited that surface modification had a significant influence on void formation in RTM process, resulting in a decrease of overall void content due to the improvement of wetting in cured composite parts.

• Korean Journal of Materials Research
• /
• v.2 no.3
• /
• pp.228-238
• /
• 1992

An investigation on the step-coverage of PECVD and $O_3$ ThCVD oxides was undertaken to implement into the void-free inter metal dielectric planarization using multi-chamber system for the submicron double level metallization. At various initial aspect ratios the instantaneous aspect ratios were measured through modelling and experiment by depositing the oxides up to $0.9{\mu}m$ in thickness in order to monitor the onset of void formation. The modelling was found to be in a good agreement with the observed instantaneous aspect ratio of TEOS-based PECVD oxide whose re-entrant angle was less than $5^{\circ}$. It is demonstrated that either keeping the instantaneous aspect ratio of PECVD oxide as a first layer less than a factor of 0.8 or employing Ar sputter etch to create sloped oxide edge ensures the void-free planarization after$O_3$ ThCVD oxide deposition whose step-coverage is superior to PECVD oxide. It has been observed that $O_3$ ThCVD oxide etchback scheme has shown higher yield of via contact chain than non etchback process, with resistance per via contact of $0.1~0.3{\Omega}/{\mu}m^2$.

• Journal of Korean Neurosurgical Society
• /
• v.60 no.2
• /
• pp.225-231
• /
• 2017

Objective : Solid bone fusion is an essential process in spinal stabilization surgery. Recently, as several minimally invasive spinal surgeries have developed, a need of artificial bone substitutes such as demineralized bone matrix (DBM), has arisen. We investigated the in vivo bone growth rate of DBM as a bone void filler compared to a local autologous bone grafts. Methods : From April 2014 to August 2015, 20 patients with a one or two-level spinal stenosis were included. A posterior lumbar interbody fusion using two cages and pedicle screw fixation was performed for every patient, and each cage was packed with autologous local bone and DBM. Clinical outcomes were assessed using the Numeric Rating Scale (NRS) of leg pain and back pain and the Korean Oswestry Disability Index (K-ODI). Clinical outcome parameters and range of motion (ROM) of the operated level were collected preoperatively and at 3 months, 6 months, and 1 year postoperatively. Computed tomography was performed 1 year after fusion surgery and bone growth of the autologous bone grafts and DBM were analyzed by ImageJ software. Results : Eighteen patients completed 1 year of follow-up, including 10 men and 8 women, and the mean age was 56.4 (32-71). The operated level ranged from L3/4 to L5/S1. Eleven patients had single level and 7 patients had two-level repairs. The mean back pain NRS improved from 4.61 to 2.78 (p=0.003) and the leg pain NRS improved from 6.89 to 2.39 (p<0.001). The mean K-ODI score also improved from 27.33 to 13.83 (p<0.001). The ROM decreased below 2.0 degrees at the 3-month assessment, and remained less than 2 degrees through the 1 year postoperative assessment. Every local autologous bone graft and DBM packed cage showed bone bridge formation. On the quantitative analysis of bone growth, the autologous bone grafts showed significantly higher bone growth compared to DBM on both coronal and sagittal images (p<0.001 and p=0.028, respectively). Osteoporotic patients showed less bone growth on sagittal images. Conclusion : Though DBM alone can induce favorable bone bridging in lumbar interbody fusion, it is still inferior to autologous bone grafts. Therefore, DBM is recommended as a bone graft extender rather than bone void filler, particularly in patients with osteoporosis.

• The Bulletin of The Korean Astronomical Society
• /
• v.35 no.1
• /
• pp.82-82
• /
• 2010

We measure the topology of the galaxy distribution using the Seventh Data Release of the Sloan Digital Sky Survey (SDSS DR7), examining the dependence of galaxy clustering topology on galaxy properties. The observational results are used to test galaxy formation models. A volume-limited sample defined by Mr<-20.19 enables us to measure the genus curve with amplitude of G=378 at 6h-1Mpc smoothing scale, with 4.8% uncertainty including all systematics and cosmic variance. The clustering topology over the smoothing length interval from 6 to 10h-1Mpc reveals a mild scale-dependence for the shift and void abundance (A_V) parameters of the genus curve. We find strong bias in the topology of galaxy clustering with respect to the predicted topology of the matter distribution, which is also scale-dependent. The luminosity dependence of galaxy clustering topology discovered by Park et al. (2005) is confirmed: the distribution of relatively brighter galaxies shows a greater prevalence of isolated clusters and more percolated voids. We find that galaxy clustering topology depends also on morphology and color. Even though early (late)-type galaxies show topology similar to that of red (blue) galaxies, the morphology dependence of topology is not identical to the color dependence. In particular, the void abundance parameter A_V depends on morphology more strongly than on color. We test five galaxy assignment schemes applied to cosmological N-body simulations to generate mock galaxies: the Halo-Galaxy one-to-one Correspondence (HGC) model, the Halo Occupation Distribution (HOD) model, and three implementations of Semi-Analytic Models (SAMs). None of the models reproduces all aspects of the observed clustering topology; the deviations vary from one model to another but include statistically significant discrepancies in the abundance of isolated voids or isolated clusters and the amplitude and overall shift of the genus curve. SAM predictions of the topology color-dependence are usually correct in sign but incorrect in magnitude.