• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.3
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• pp.317-326
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• 2016

In this study, running stability and ride quality analyses, applying the 'ISO 3888 (double lane change)' and 'ISO 2631-1' (mechanical vibration and shock) tests, were performed for the suspension optimization of the Korean personal rapid transit (PRT) vehicle. The suspension optimization results for running stability and ride quality were derived by applying the multiresponse surface method. From the comparisons of the optimization results for different ratios of the objective functions of running stability and ride quality, we derived the best objective function ratio of 3.9-to-6.1 to improve both the running stability and the ride quality. With the optimized results, the suspension stiffness became 30.68 N/mm, between the value of the $S_2$ and $S_3$ models, and the damping coefficient equaled that of the $D_1$ model. When compared with the suspension of the current PRT vehicle, the roll angle, yaw rate, sideslip angle, and ride comfort were improved by 0.37, 0.37, 2.8, and 5, respectively.

• Journal of Korean Tunnelling and Underground Space Association
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• v.20 no.2
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• pp.331-346
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• 2018

In the tunnel of domestic high - speed railway, the main fire - fighting facility, fire - extinguishing passageway, is installed. However, due to the high pressure of the high - speed train, frequent breakage and maintenance are caused by strong shock and long - term vibration. In order to solve these problems, it is necessary to improve the fire door, but in Korea, it is installed by submitting a certificate by simple KS F 2296 performance test. At present, it is developed as a simple test certification by producing a real scale fireproof door without the theoretical examination in advance, so that a high cost for improvement is occurring in Korea. Therefore, through this study, structural analysis study which can preliminary structure review was carried out in order to design the refuge connection passage fire door and to improve the performance improvement. In order to secure the reliability of the result value, the official authentication test (KS F 2296) were compared.

• Smart Media Journal
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• v.11 no.5
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• pp.75-81
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• 2022

In order to respond to carbon neutrality and climate change in agriculture, agricultural machinery, which has been developed centered on internal combustion engines, needs to be converted to an electric-based technology that does not emit greenhouse gases. In this study, simulations for electric UTV suspension design were performed to reduce vibration and shock of electric UTV for agricultural use and to improve driving stability and control performance of the vehicle. The simulation was performed by dividing the tolerance load of the vehicle body and the loaded load state. The range of motion of the suspension spring of UTV is within 30% of the range of motion under condition B under tolerance, the displacement of the UTV suspension with full load is reduced from 264mm to 121mm, and the damping speed is 260mm/s to 300mm/s that it can be seen that the range of motion is within 60%. Suspension design of electric UTV for multi-purpose agricultural work is a very important factor for maintaining agricultural work ability in towing work such as tillage as well as driving and terrain adaptation. The results of this study can be usefully used to determine the spring parameters with the appropriate damping range so that the electric UTV can be used for various agricultural tasks.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.2
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• pp.55-60
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• 2015

Packaging of export cut lilies reduces physical damage during distribution like dropping, shock, vibration, compression and serves to protect from necrosis, microbial contamination and decomposition. Study on which packaging materials must be selected is necessary because it serves to direct effect maintaining quality and the degree of freshness. newspaper, perforated OPP film, Oriented Nylon film (ON), punched OPP film, OPP films are used in this study. Plant senescence of lilies was happened rapidly during storage at $25^{\circ}C$ rather than at $5^{\circ}C$. Also, water absorption, fresh weight at during storage $25^{\circ}C$ rather than at $5^{\circ}C$ In addition, fresh weight of lilies storage at $25^{\circ}C$ appears higher than at $5^{\circ}C$ all of the packaging materials except OPP because water absorption of lily storage at $5^{\circ}C$ appears higher than at $25^{\circ}C$, thereby suppressing the fresh weight reducing Also, effect on biological activity of lilies from shape of packaging material appears higher during storage at $5^{\circ}C$ than at $25^{\circ}C$. Compared with each packaging materials, newspaper packaging is the smallest effect on changes in biological activity of cut lilies during storage. Thus, the results demonstrate that flowering date are affected mainly by the storage temperature rather than packaging materials.

• Journal of the Korean Geotechnical Society
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• v.18 no.1
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• pp.101-112
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• 2002

In this study, a new methodology fur the assessment of liquefaction potential is proposed and characteristics of the proposed methodology are verified. The experimental parameter of this methodology, that is, the plastic shear strain trajectory, is compared with the dissipated energy. It is shown that this parameter can express the liquefaction behavior which is generated by excess pore water pressure. This methodology takes advantage of the shear strain time history determined from the site response analysis based on the real time history of earthquake. In this site response analysis, shock type and vibration type records of similar predominant frequency are inputted. The liquefaction safely factors based on the proposed methodology and Korean detailed assessment related to the classical method are calculated from the results of the site response analysis and laboratory dynamic tests. Through this study, it is found that the proposed methodology can not only simulate the liquefaction behavior of saturated soils hut also express the seismic characteristics reasonably : leading type, predominant frequency, maximum acceleration, duration time.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.