• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.673-674
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• 2012

• Journal of the Korean Electrochemical Society
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• v.2 no.4
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• pp.237-241
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• 1999

The characteristics of copper thin films and via hole filling capability were investigated by pulsed electrodeposition method. Especially, the effects of additives on the properties of copper thin films were studied. Copper films, which were deposited by pulsed electrodeposition using commercial additives, had low tensile stress value under 83.4 MPa and high preferred Cu (111) texture. Via holes with $0.25{\mu}m$ in diameter and 6 : 1 aspect ratio were successfully filled without any defects by superfilling. It was observed that copper microstructure deformed by twining. After heat treatment at $500^{\circ}C$ for 1 k in vacuum furnace, grain size was 1 or 2 times as large as film thickness and the bamboo structure was formed. Heat treated copper films showed good resistivities of $1.8\~2.0{\mu}{\Omega}{\cdot}cm$.

• Journal of the Semiconductor & Display Technology
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• v.22 no.1
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• pp.94-98
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• 2023

In the case of high-speed data transmission on high multilayer boards, signal coherence is a problem, especially due to the via hole, and a solution to improve return loss or insertion loss by applying a back drill to the via hole is being proposed. In this paper, Near-Field Electromagnetic measurements were made on a high multilayer board to determine how the presence or absence of back drill affects signal consistency. For this purpose, we used a signal generator, spectrum analyzer, and EMC scanner on a test board to determine if it is possible to distinguish between areas with and without back drill in the via holes of the stubs on the board. Also, we analyzed the measured value of S11, S21 and EMC etc. for how much it improves the signal attenuation of the stub with back drill. Through this, we knew that less electromagnetic waves are generated the stub via with back drill. At future research, we will analyze how much it improves the signal loss and electromagnetic waves due to the depth of back drill.

• Journal of Aerospace System Engineering
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• v.4 no.1
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• pp.23-26
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• 2010

In this study, it was performed damage assesment of small scale composite aircraft developing. This aircraft adopted the sandwich structure to skin of wing. This study aims to investigate the residual strength of sandwich composites with Nomex honeycomb core and carbon fiber face sheets after the open hole damage by the experimental investigation. The 4-point bending tests were used to find the bending strength, and the open hole was applied to introduce the simulated damage on the specimen. The bending strength test results after open hole was compared with the results of no damaged specimen test. The FEM analysis is assessed via an experimental 4-point bending test.

• Ceramist
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• v.21 no.1
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• pp.98-111
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• 2018

The lead-based perovskite (CH3NH3PbI3) material has a high molar coefficient, high crystallinity at low temperature, and long range of balanced electron-hole transport length. In addition, PCE of perovskite solar cells (PSCs) has been dramatically improved by over 22% by amending the electronic quality of perovskite and by using state-of-the-art hole transporting materials (HTMs) such as tetrakis(N,N-di-p-methoxyphenylamine)-9,9'-spirobifluorene (spiro-OMeTAD) due to enhanced charge transport toward the electrode via properly aligned energy levels with respect to the perovskite. Replacing the spiro-OMeTAD with new HTMs with the desired properties of appropriate energy levels, high hole mobility in its pristine form, low cost, and easy processable materials is necessary for attaining highly efficient and stable PSCs, which are anticipated to be truly compatible for practical application. Furthermore, Recently Pb-free perovskite materials much attention as an alternative light-harvesting active layer material instead of lead based perovskite in photovoltaic cells. In this work, we demonstrate a Pb-free perovskite material for the light harvesting and emitter as optoelectronic devices.

• Korean Journal of Cognitive Science
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• v.27 no.3
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• pp.355-376
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• 2016

We used holes defined by color similarity (Experiment 1) and binocular disparity (Experiment 2) to study how the inner contour of an object (i.e., boundary of a hole in it) is encoded in visual working memory. Many studies in VWM have shown that an object's boundary properties can be integrated with its surface properties via their shared spatial location, yielding an object-based encoding benefit. However, encoding of the hole contours has rarely been tested. We presented objects (squares or circles) containing a bar under a change detection paradigm, and relevant features to be remembered were the color of objects and the orientation of bars (or holes). If the contour of a hole belongs to the surrounding object rather than to the hole itself, the object-based feature binding hypothesis predicts that the shape of it can be integrated with color of an outer object, via their shared spatial location. Thus, in the hole display, change detection performance was expected to better than in the conjunction display where orientation and color features to be remembered were assigned to different parts of a conjunction object, and comparable to that in a single bar display where both orientation and color were assigned into a single bar. However, the results revealed that performance in the hole display did not differ from that in the conjunction display. This suggests that the shape of holes is not automatically encoded together with the surface properties of the outer object via object-based feature binding, but encoded independently from the surrounding object.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.6
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• pp.1178-1182
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• 2011

The best methods for distribution controled of LED lighting fixtures is control to designed LED chip array, lens and reflector. However, lens design need distribution design to reflector for low-wattage LED lighting because of difficulty of production and reduction of light efficiency. In addition, it needs maximize of thermal performance to improve the efficiency and reliability of device. As a result, for the height of reflector 40[mm] and Inclination 25[$^{\circ}$], we can see the best distribution properties, and, in the thermal properties, junction temperature MCPCB 62.9 [$^{\circ}C$], FR4 PCB 89.6 [$^{\circ}C$], FR4 PCB from Via-hole is 63.1 [$^{\circ}C$]. it may improve for thermal properties for makes the Via-hole.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2002.11a
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• pp.63-68
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• 2002

본 논문에서는 관통형 고주파 노이즈 필터(noise filter)를 설계하고, 제작하였다. 분포정수형(distributed constant type) 노이즈 필터는 세라믹 다층 구조(multi-layer)를 가지며, 기존의 노이즈 억압 방법인 칩 페라이트 비드, 3단자 커패시터 그리고 집중 정수형(lumped constant type) 노이즈 필터에 비해 신호의 왜곡이 적고, 고주파 노이즈 억압특성이 우수하다. 본 논문에서는 기존의 분포정수형 노이즈 필터에 관통형 via-hole을 삽입하는 새로운 구조를 제안하였다. 제작된 노이즈 필터는 100MHz의 차단 주파수, 700MHz~1700MHz에서 20㏈이상의 감쇠 특성을 나타내었다. 또한, 기존의 노이즈 필터의 단점인 방향성 덴 공정에 대한 민감도를 개선시킴으로써 양산성이 향상되었다.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.227-229
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• 2006

3차원 실장을 하기 위해서 딥핑 방법으로 전기적 신호를 전달할 수 있는 비아를 가진 실리콘 웨이퍼를 제작하였다. 레이저를 이용하여 실리콘 웨이퍼에 개구부가 원형에 가까운 관통 홀을 형성하였다. 관통 홀의 벽에 도금 방법으로 시드 층을 형성하였다. 관통 홀의 충전 금속은 Sn-3.5Ag-0.7Cu 솔더를 사용하였다. 딥핑 방법으로 시드 층과 솔더 사이의 확산 현상 이용하여 전기적 신호를 전달 할 수 있는 비아를 형성하였다. 비아 내부에 일부 기공과 크랙이 발견되기도 했으나 딥핑 방법을 통해서 빠른 시간 내에 비아를 가진 실리콘 웨이퍼를 제작 할 수 있었다.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.6
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• pp.421-425
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• 2016

Micro-EDM is one of the recent fine-machining technologies. Micro-EDM is widely used in precision processes because products manufactured via EDM are free from workpiece hardness. However, the debris produced during the process cause many problems such as reduced precision of the process. The first solution of this problem involves using the milling hole process. Micro-EDM hole process involves an electrode moving rapidly in the vertical direction via a servo system to disperse debris. However, this process can cause reduced work efficiency owing to contact between the electrode and workpiece. In this study, ultrasonic vibration is added to micro-EDM channel machining. Ultrasonic vibration removes the debris during machining and enables precision machining. Consequently, a clean work environment for the subsequent processes is maintained.