• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.595-596
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• 2006

A novel Si via structure is suggested and fabricated for 3D MEMS package using the doped silicon as an interconnection material. Oxide isolations which define Si via are formed simultaneously when fabricating the MEMS structure by using DRIE and oxidation. Silicon Direct Bonding Multi-stacking process is used for stacked package, which consists of a substrate, MEMS structure layer and a cover layer. The bonded wafers are thinned by lapping and polishing. A via with the size of $20{\mu}m$ is fabricated and the electrical and mechanical characteristics of via are under testing.

• International Journal of Computer Science & Network Security
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• v.23 no.7
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• pp.32-38
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• 2023

This study deals with arbitration award via modern technical means; because e-Arbitration is deemed to be one of the most important substitute means for the settlement of disputes arising from electronic transactions. This type of arbitration is characterized by fast settlement of disputes, as well as fast enforcement of awards rendered thereon. The researcher seeks to indicate the content of the award, the conditions for rendering it, and to analyze the legal provisions related to its legal basis in the Saudi Law of Arbitration. This study shows that an arbitration award, rendered via modern technical means has a number of advantages, such as fast settlement, less cost, and keeping pace with modern technology, which is an aim of Saudi Arabia Vision 2030. The study also points out certain problems facing arbitration via technical means; however, the most important of which is the insufficiency of some legal rules associated with traditional arbitration, as contained in the Saudi Law of Arbitrator, which are incompatible with or applicable to an arbitration award which is rendered via modern means.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• Membrane Journal
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• v.17 no.2
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• pp.112-117
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• 2007

The application of membrane bioreactors for the depuration of wastewater coming from the washing of mineral oil storage tanks is described. Microfiltration hollow-fibre membranes were used in the submerged configuration. Filtration tests were carried out with a biomass concentration of about 15 g/L in order to assess the critical flux of the hollow fibre membrane used. Then particular care was taken in carrying out the performance runs in the sub-critical flux region. The reactor performance was very high, with removal efficiencies ranging between 93% and 97% also when the concentration of hydrocarbon was very high. Some kinetic parameters for the COD and the hydrocarbon removal were estimated.

• Membrane Journal
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• v.19 no.1
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• pp.72-82
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• 2009

A mathematical model was written for simulating the removal of phenol from wastewater in enzyme-loaded membrane reactor (EMR). The numerical simulation program was developed so as to predict the degradation of phenol through an EMR. Numerical model proves to be effective in searching for optimal operating conditions and creating an optimal microenvironment for the biocatalyst in order to optimize productivity. In this study, several dimensionless parameters such as Thiele Modulus (${\phi}^2$, dimensionless Michaelis-Menten constant ($\xi$), Peclet number (Pe) were introduced to simplify their effects on system efficiency. In particular, the study of phenol conversion at different feed compositions shows that low phenol concentrations and high Thiele Modulus values lead to higher reactant degradation.

• Journal of the Korea Society of Computer and Information
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• v.21 no.3
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• pp.1-8
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• 2016

The printed circuit board (PCB) can be used only 2 layers of front and back. Therefore, the wiring line segments are located in 2 layers without crossing each other. In this case, the line segment can be appear in both layers and this line segment is to resolve the crossing problem go through the via. The via minimization problem (VMP) has minimum number of via in layout design problem. The VMP is classified by NP-complete because of the polynomial time algorithm to solve the optimal solution has been unknown yet. This paper suggests polynomial time algorithm that can be solve the optimal solution of VMP. This algorithm transforms n-line segments into vertices, and p-crossing into edges of a graph. Then this graph is partitioned into 3-coloring sets of each vertex in each set independent each other. For 3-coloring sets $C_i$, (i=1,2,3), the $C_1$ is assigned to front F, $C_2$ is back B, and $C_3$ is B-F and connected with via. For the various experimental data, though this algorithm can be require O(np) polynomial time, we obtain the optimal solution for all of data.

• Research in Community and Public Health Nursing
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• v.30 no.4
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• pp.571-580
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• 2019

Purpose: The purpose of this study is to examine the mediating effects of emotional venting via instant messaging (IM) and positive emotion in the relationship between negative emotion and depression. Methods: Online survey was conducted in Korea between 2 April and 7 April 2019. To obtain samples with representativeness, data were gathered by the professional research firm. A total of 250 Koreans were participated in this study. The collected data were analyzed using descriptive statistics, Pearson's correlation coefficients, and SPSS PROCESS macro to test the mediating effects. Results: This study analyzed the direct/indirect effects of negative emotion on emotional venting via IM, in the relationship between positive emotion and depression. Negative emotion had indirect effects on depression through emotional venting via IM and positive emotion. Both emotional venting via IM and positive emotion had dual mediating effects in the influence of negative emotion on depression. Conclusion: These results suggest that it is important to manage negative emotion to prevent depression. Also, this study confirmed that emotional venting via IM is a powerful factor influencing emotional recovery.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.43-49
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• 2006

The properties, behavior and reliability of the residual void in blind via hole(BVH) were carried out for the shape of BVH using the void extraction process. The residual void was perfectly removed in the specimens applied by the void extraction process, which was improved by 40% rather than the conventional process. The residual void in BVH was to be eliminated under a condition of 1.5 atm for more 30 sec with regardless of the shape of BVH. It was also observed that the residual void in BVH was not formed after the reliability test with JEDEC standard.

• Proceedings of the Korean Society of Broadcast Engineers Conference
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• 2009.01a
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• pp.170-173
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• 2009

In this paper, we propose a fast intra prediction mode selection method in Scalable Video Coding(SVC) which is an emerging video coding standard as an extension of H.264/Advanced Video Coding(H.264/AVC). The proposed method decides a candidate intra prediction mode based on the characteristic of macroblock smoothness. Statistical analysis is applied to computing that smoothness in spatial enhancement layer. We also propose an early termination scheme for Intra_BL mode decision where the RD cost value of Intra_BL is utilized. Compared with JSVM software, our scheme can reduce about 55% of the computation complexity of intra prediction on average, while the performance degradation is negligible; For low QP values, the average PSNR loss is very negligible, equivalently the bit rate increases by 0.01%. For high QP values, the average PSNR loss is less than 0.01dB, which equals to 0.25% increase in bitrate on average.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.5
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• pp.351-355
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• 2001

Via for achieving reliable fabrication of MCM(Multichip Module) substrate was formed on photosensitive BCB layer. The MCM substrate consists of photosensitive BCB(Benzocyclobutene) interlayer dielectric and copper conductors. In order to form the vias in the photosensitive BCB layer, the process of forming the BCB layer and its via forming plasma etch using C$_2$F$\_$6//O$_2$ gas were evaluated. The thickness of the BCB layer after hard bake was shrunk down to 40% of the original. The resolution of vias formed on the BCB was 15㎛ and the slope after develop was 85 degree. AES analysis was done on two vias, one is etched in C$_2$F$\_$6/O$_2$ gas and the other isnot etched. On the via etched in C$_2$F$\_$6//O$_2$, native C was detected and the amount of native C was reduced after Ar sputter. On the via not etched in C$_2$F$\_$6//O$_2$, organic C was detected. As a result of AES, BCB residue was not removed by Ar sputter, so plasma etch is necessary for achieving reliable vias.