• Title/Summary/Keyword: Via

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A design of silicon based vertical interconnect for 3D MEMS devices under the consideration of thermal stress (3D MEMS 소자에 적합한 열적 응력을 고려한 수직 접속 구조의 설계)

  • Jeong, Jin-Woo;Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.2
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    • pp.112-117
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    • 2008
  • Vertical interconnection scheme using novel silicon-through-via for 3D MEMS devices or stacked package is proposed and fabricated to demonstrate its feasibility. The suggested silicon-through-via replaces electroplated copper, which is used as an interconnecting material in conventional through-via, with doped silicon. Adoption of doped silicon instead of metal eliminates thermal-mismatch-induced stress, which can make troubles in high temperature MEMS processes, such as wafer bonding and LP-CVD(low pressure chemical vapor deposition). Two silicon layers of $30{\mu}m$ thickness are stacked on the substrate. The through-via arrays with spacing $40{\mu}m$ and $50{\mu}m$ are fabricated successfully. Electrical characteristics of the through-via are measured and analyzed. The measured resistance of the silicon-through-via is $169.9\Omega$.

Characteristic of Through Silicon Via's Seed Layer Deposition and Via Filling (실리콘 관통형 Via(TSV)의 Seed Layer 증착 및 Via Filling 특성)

  • Lee, Hyunju;Choi, Manho;Kwon, Se-Hun;Lee, Jae-Ho;Kim, Yangdo
    • Korean Journal of Materials Research
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    • v.23 no.10
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    • pp.550-554
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    • 2013
  • As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidths and good power efficiency. 3D integration can be defined as a technology involving the stacking of multiple processed wafers containing integrated circuits on top of each other with vertical interconnects between the wafers. This type of 3D structure can improve performance levels, enable the integration of devices with incompatible process flows, and reduce form factors. Through silicon vias (TSVs), which directly connect stacked structures die-to-die, are an enabling technology for future 3D integrated systems. TSVs filled with copper using an electro-plating method are investigated in this study. DC and pulses are used as a current source for the electro-plating process as a means of via filling. A TiN barrier and Ru seed layers are deposited by plasma-enhanced atomic layer deposition (PEALD) with thicknesses of 10 and 30 nm, respectively. All samples electroplated by the DC current showed defects, even with additives. However, the samples electroplated by the pulse current showed defect-free super-filled via structures. The optimized condition for defect-free bottom-up super-filling was established by adjusting the additive concentrations in the basic plating solution of copper sulfate. The optimized concentrations of JGB and SPS were found to be 10 and 20 ppm, respectively.

Comparison between Visual Inspection of Cervix and Cytology Based Screening Procedures in Bangladesh

  • Nessa, Ashrafun;Nahar, Khadiza Nurun;Begum, Shirin Akhter;Anwary, Shahin Ara;Hossain, Fawzia;Nahar, Khairun
    • Asian Pacific Journal of Cancer Prevention
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    • v.14 no.12
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    • pp.7607-7611
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    • 2013
  • Background: Cervical cancer continues to be a major problem in Bangladesh with approximately 18,000 new cases annually of which over 10,000 women die from it. Visual inspection of the cervix after 3-5% acetic acid (VIA) application is a simple and easy to learn method for cervical cancer screening, although cytology-based screening is more often applied in developed countries where it has successfully reduced the prevalence of cervical cancer. Objective: To compare the efficacy of VIA and cytology-based primary methods for cervical cancer screening in Bangladesh. Materials and Methods: This hospital based comparative study was conducted at the VIA centre and Colposcopy Clinic of Bangabandhu Sheikh Mujib Medical University (BSMMU) from October 2008 to October 2010. Results: Among 650 women, 74 (11.4%) were VIA+ve and 8 (1.2%) had abnormalities in their Pap smear reports. During colposcopy, 38 (7.7%) women had different grades of CIN and 4 (0.6%) had cervical cancer. The gold standard histology findings proved 20 women had CIN I, 14 had CIN II/II and 4 had cervical cancer. Among the 38 histology diagnosed abnormalities, VIA test could identify 30 abnormalities including two cervical cancers. However, Pap smear could detect only 8 cases of histological abnormalities (2 low grade and 6 had high grade lesion) and it missed all the cervical cancer cases. The sensitivity and specificity of VIA were 88.9% and 52.1%. The positive predictive value (PPV) and negative predictive value (NPV) were 41.0%, and 92.6% respectively. Moreover, the sensitivity, specificity, PPV and NPV of Pap smear were 33.3%, 95.8%, 75.0% and 79.3%, respectively. Conclusions: VIA test should be used as the primary screening tool even with its low sensitivity and specificity in low resource countries like Bangladesh. False positive results may be greater, but overtreatment can be minimized by colposcopy evaluation of the VIA positive women.

A Distributed VOD Server Based on Virtual Interface Architecture and Interval Cache (버추얼 인터페이스 아키텍처 및 인터벌 캐쉬에 기반한 분산 VOD 서버)

  • Oh, Soo-Cheol;Chung, Sang-Hwa
    • Journal of KIISE:Computer Systems and Theory
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    • v.33 no.10
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    • pp.734-745
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    • 2006
  • This paper presents a PC cluster-based distributed VOD server that minimizes the load of an interconnection network by adopting the VIA communication protocol and the interval cache algorithm. Video data is distributed to the disks of the distributed VOD server and each server node receives the data through the interconnection network and sends it to clients. The load of the interconnection network increases because of the large amount of video data transferred. This paper developed a distributed VOD file system, which is based on VIA, to minimize cost using interconnection network when accessing remote disks. VIA is a user-level communication protocol removing the overhead of TCP/IP. This papers also improved the performance of the interconnection network by expanding the maximum transfer size of VIA. In addition, the interval cache reduces traffic on the interconnection network by caching, in main memory, the video data transferred from disks of remote server nodes. Experiments using the distributed VOD server of this paper showed a maximum performance improvement of 21.3% compared with a distributed VOD server without VIA and the interval cache, when used with a four-node PC cluster.

Role of Print and Audiovisual Media in Cervical Cancer Prevention in Bangladesh

  • Nessa, Ashrafun;Hussain, Muhammad Anwar;Ur Rashid, Mohammad Harun;Akhter, Nargis;Roy, Joya Shree;Afroz, Romena
    • Asian Pacific Journal of Cancer Prevention
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    • v.14 no.5
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    • pp.3131-3137
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    • 2013
  • Background: Visual inspection of cervix with acetic acid (VIA) is offered at 252 centers in 64 districts of Bangladesh. VIA+ve women are managed at colposcopy clinics of Bangabandhu Sheikh Mujib Medical University (BSMMU) and 14 Medical College Hospitals (MCHs). This research work has been supported by 'UICC Cancer Prevention Campaign' programme. Objectives: This study explored the role of print materials and electronic media to improve cervical cancer screening in the present socio-cultural context of Bangladesh. Methods: This study was performed from January to August 2011 at two upazilas of Bangladesh (Singair with screening facility and Sonargaon without screening facility). Data were collected by focus group discussion (FGD) with women, husbands and community people before and after intervention. Information on cervical cancer screening and VIA camps was disseminated using advertisement through local cable line of the television, microphone announcement, service providers and leaflet throughout the week prior to a VIA camp. Three-day VIA camps were organized at the upazila health complex (UHC) of both upazilas. Quantitative data was gathered from women at the camps on source of information on VIA and the best method of awareness creation. Results: The population was aware of "cancer" and a notable number knew about cervical cancer. Baseline awareness on prevention and VIA was low and it was negligible where screening services were unavailable. Awareness was increased fourfold in both upazilas after interventions and half of the women and the majority of the community people became aware of screening and available facilities. Cable line advertisement (25.5%), microphone announcement (21.4%), and discussion sessions (20.4%) were effective for awareness creation on VIA. Television was mentioned as the best method (37.4%) of awareness creation. Conclusion: Television should be used for nation-wide awareness creation. For local awareness creation, cable line advertisement, microphone announcements and health education at Uthan Baithaks/ EPI sessions can easily be adopted by the government.

THE VERIFICATION OF THE MTT ASSAY ON THE VIABILITY OF PERIODONTAL LIGAMENTAL CELLS IN RAT MOLARS THROUGH THE HISTOLOGIC EXAMINATION (쥐치아 치근면의 치주인대세포의 활성도를 평가하는 방법으로 MTT검색법의 적절성에 대한 조직학적인 검증)

  • Kim, Hyun-Ki;Kim, Eui-Seoung;Choi, In-Bok;Kim, Jin;Lee, Seung-Jong
    • Restorative Dentistry and Endodontics
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    • v.28 no.5
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    • pp.385-391
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    • 2003
  • The purpose of this study is to examine the viability of PDL cells in rat molars by using MTT assay and to verify the MTT assay through the histologic observation. Thirty of Sprague-Dawley white female rats of 4-weeks old with a body weight of about 100 grams were used. Groupings are as follows : Immediate Group : Positive control group(n=10)-after extraction immediately. Dried Group : Negative control group(n=10)-after drying for an hour under warm dry. $ViaSpan^{\circledR}$ Group : 1hour $ViaSpan^{\circledR}$ group(n=10)-after storing in $ViaSpan^{\circledR}{\;}at{\;}4^{\circ}C$ for 1hour. Ten teeth of each group were treated as same as above and replanted to the original socket of experimental animals. After two weeks of replantation. all the experimental animals were sacrificed. And after fixation, extracted maxillary jaw was dimineralized. After it was embedded in paraffin. serial section by $5\mu\textrm{m}$ was carried out and for construction of specimen, hematoxylin-eosin dye was used. The mean MTT measurement of immediate group(positive control) is 2.81 and the mean measurement of dried group(negative control) is 0.98 which is significantt differnt(P<0.05), The mean measurement of $ViaSpan^{\circledR}$ group is 2.65 and there is significant difference between dried group and $ViaSpan^{\circledR}$ group(P<0.05), However, there is no difference between immediate group and $ViaSpan^{\circledR}$ group. The average resorption points of immediate group is 3.03 points. In the dried group, average 6.44 points resorption and 2.68 points showed resorption in the $ViaSpan^{\circledR}$ group. Unlike with MTT assay, there was no significant difference between the immediate group and $ViaSpan^{\circledR}$ group. The usage of MTT assay as a viable cell marker may give us a better indication of the maintenance of periodontal ligament cell vitality.

A Study on the Thermal Behaviour of Via Design in the Ceramic Package (세라믹 패키지 내에서 비아에 따른 열적 거동에 관한 연구)

  • 이우성;고영우;유찬세;김경철;박종철
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.1
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    • pp.39-43
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    • 2003
  • Thermal management is very important for the success of high density circuit design in LTCC. In this paper, LTCC substrates containing thermal via and pad were fabricated in order to study the influence of the thermal dissipation. To realize the accurate thermal analysis for structure design, a series of simple thermal conductivity measurement by laser flash method and parametric numerical analysis have been carried out. The LTCC substrate including via and Ag pad has good thermal conductivity over 103 W/mK which is 44% value of pure Ag material. Thermal behaviors with via arrays, size and density in the LTCC substrate were studied by numerical method.

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Design of the Platform for a Nanoparticle thin Film Thermoelectric Device transforming Body Heat into Electricity (체온 이용이 가능한 나노입자 박막 열전소자의 플랫폼 개발연구)

  • Yang, Seunggen;Cho, Kyoungah;Choi, Jinyong;Kim, Sangsig
    • Journal of IKEEE
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    • v.20 no.2
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    • pp.174-176
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    • 2016
  • In this study, we maximize the temperature difference between the ends of a HgTe nanoparticle(NP) thin film on a thermoelectric platform with a through-substrate via. The thermoelectric characteristics of the HgTe NP thin film show p-type behavior and its Seebeck coefficient is $290{\mu}V/K$. In addition, we demonstrate the possibility of wearable thermoelectric devices transforming body heat into electricity from through-substrate via thermoelectric platforms on human skin.