• 제목/요약/키워드: Various Temperature Condition

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엔드밀 가공시 진동, 표면거칠기, 절삭온도에 미치는 최적가공조건에 관한 연구 (The Study on the Optimal Working Condition for Vibration, Surface Roughness and Cutting Temperature in End-milling)

  • 홍도관;김동영;안찬우
    • 한국소음진동공학회논문집
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    • 제14권12호
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    • pp.1322-1329
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    • 2004
  • End-milling has been used widely in industrial system because it is effective to a material manufacturing with various shapes. Recently the end-milling processing is needed the high-precise technique with good surface roughness and rapid time in precision machine part and electronic part. The optimum mechanical vibration of main spindle, surface roughness and cutting temperature have an effect on end-milling condition such as, cutting direction, revolution of spindle, feed rate and depth of cut, etc. Therefore, this study carried to decide the working condition for optimum mechanical vibration of main spindle, surface roughness and cutting temperature using design of experiments, ANOVA and characteristic function. From the results of experimentation, mechanical vibration has an effect on revolution of spindle, radial depth of cut, and axial depth of cut. The surface roughness has an effect on cutting direction, revolution of spindle and depth of cut. And then the optimum condition used design of experiments is upward cutting In cutting direction, 600 rpm in revolution of spindle, 240 mm/min in feed rate, 2 mm in axial depth of cut and 0.25 mm in radial depth of cut. By design of experiments and characteristic function, it is effectively represented shape characteristics of mechanical vibration, surface roughness and cutting temperature in end-milling.

알루미늄 거푸집을 이용한 콘크리트의 양생온도변화에 따른 표면마감성에 관한 연구 (Effect of the Various Curing Temperatures on the Finishability of Concrete using Aluminum Form)

  • 이동규;김태청;백대현;이승훈;한민철;한천구
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2008년도 춘계 학술발표회 제20권1호
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    • pp.969-972
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    • 2008
  • 본 연구는 온도변화에 따라 기초영향인자가 콘크리트와 알루미늄 거푸집간의 표면 마감성에 미치는 영향에 대하여 분석한 것으로 그 결과를 요약하면 다음과 같다. 육안관찰상 코팅합판과 무손상 알루미늄 거푸집의 경우 비슷한 결과를 나타냈으며, 온도변화에 따라서는 알루미늄 거푸집을 사용한 경우 온도가 높아질수록 표면품질이 약간씩 저하하는 것을 확인할 수 있었다. 표면조도의 경우 온도변화에 따른 차이는 거의 나타나지 않았으며, 박리제의 도포여부에 따른 차이가 발생하였다. 온도변화에 따른 표면공극분포는 온도가 증가할수록 $0.1{\sim}1mm$ 범위의 미세한 기포가 증가하여 화학반응이 촉진됨을 확인할 수 있었으며, 다른 범위의 공극도 증가하였다. 또한, 온도가 증가할수록 다른 인자들의 영향이 더욱 커지는 것을 확인할 수 있어 온도증가에 의해 알루미늄 거푸집을 이용하는 콘크리트의 표면품질이 저하함을 확인할 수 있었다.

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반도체 봉지수지의 파괴 인성치 측정 및 패키지 적용 (Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package)

  • 김경섭;신영의;장의구
    • E2M - 전기 전자와 첨단 소재
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    • 제10권6호
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    • pp.519-527
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    • 1997
  • The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

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연속식 가열로에서 버너배열에 따른 소재 및 가스온도의 영향 (The Effects of Various Burner Array on Workpiece and Gas Temperature in a Continuous Reheating Furnace)

  • 김강민;전충환;유인;김규보
    • 에너지공학
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    • 제26권2호
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    • pp.23-31
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    • 2017
  • 열전달 및 에너지평형모델을 적용하여 연속식 가열로에서의 버너 배열에 따른 소재 및 노내 가스 온도의 영향을 수치해석으로 분석하였다. 연속식 가열로에서의 최적화된 소재의 가열구간을 확보하기 위해 한정된 공간을 갖는 노 내에서 총 공급열량을 동일한 조건으로 하고 가열능력에 따른 버너의 출력, 대수 및 배열 등을 조절하여 소재의 온도와 노 내 가스온도에 미치는 영향을 수치 해석적 방법으로 살펴보았다. 수치 해석적 방법을 통해 110톤/일의 생산량을 가지도록 설계된 기존의 가스 연소식 버너를 포함하는 연속식 가열로의 성능을 유지하면서 가스온도가 가열대 및 균열대의 중간지점에서 최대 값의 차이가 약 $40^{\circ}C$ 낮아 설비에 부하가 적고 소재목표 추출온도에 도달하는 $1,175^{\circ}C$조건의 버너배열을 도출하였다.

저장 조건 감지 지표 장치의 특성 및 식품에의 응용 가능성 (Application of time-temperature indicators for cooling and frozen food storage and distribution)

  • 안덕준;유승석
    • 한국포장학회지
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    • 제5권1호
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    • pp.25-29
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    • 1999
  • 이미 개발이 완료됐거나 개발 중인 인디케이터 3가지를 이용하여 다양한 온도에서의 색 변화 여부 및 정도를 측정하였다. 각각의 인디케이터는 다른 반응 기작 및 화학 물질을 사용하고 있어, 색 변화에 필요한 활성화 에너지 값 및 반응 속도에 차이가 있었다. 이러한 특징은 내용물의 저장 및 유통 조건에 맞는 적절한 인디케이터를 이용하여 원하는 결과를 얻을 수 있다는 사실을 알게 되었다. 즉 제품의 주된 저장조건이 냉동인지 아니면 냉장인지 그리고 제품의 품질 변화 속도를 고려하여 각기 다른 인디케이터를 사용하면 내용물의 실제 저장 기간과 색 변화와의 상관관계 효과를 높일 수 있다. 또한 저장 및 유통 시 온도의 변화가 수반됨으로서 온도의 지속적인 변화에 다른 색 변화 가능성을 연구할 필요가 있으며 이와 아울러 실제 식품에 부착하여 내용물의 상태와 색 변화를 연관시키는 연구가 필요할 것으로 생각된다.

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비례제어식 자동온도조절기의 온도감지방식별 난방제어 특성 비교 (A Comparison of Heating Control Characteristics by Temperature Sensing Methods for Thermostatic Valves with the Proportional Control Mode)

  • 김용기;이태원;강성주
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2007년도 동계학술발표대회 논문집
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    • pp.161-166
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    • 2007
  • Various thermostatic valves have been used widely in Korea for conservation of heating energy and enhancement of thermal comfort in residential buildings. But heating control performances of thermostatic valves extensively vary with the design and operational conditions of the heating system, climate condition and others. An experimental method was carried out in this study to analyze heating control characteristics by temperature sensing methods of thermostatic valves for various parameters, such as supply temperatures and flow rate of hot water, the position of room thermostats and outdoor air temperatures. As a result, the heat flow rate per day of S-Valve($34^{\circ}C$-Type) of water temperature sensing method was liked that of C-Valve of indoor air temperature sensing method with stage 3.3 of room thermostat in case supply temperature of hot water was $45^{\circ}C$, flow rate was 1.3 L/min and outdoor air temperature was $7.8^{\circ}C$.

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무연솔더(SnAgCu)와 유연솔더(SnPb)의 피로 수명 비교 연구 (A Comparative Study of the Fatigue Behavior of SnAgCu and SnPb Solder Joints)

  • 김일호;박태상;이순복
    • 대한기계학회논문집A
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    • 제28권12호
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    • pp.1856-1863
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    • 2004
  • In the last 50 years, lead-contained solder materials have been the most popular interconnect materials used in the electronics industry. Recently, lead-free solders are about to replace lead-contained solders for preventing environmental pollutions. However, the reliability of lead-free solders is not yet satisfactory. Several researchers reported that lead-contained solders have a good fatigue property. The others published that the lead-free solders have a longer thermal fatigue life. In this paper, the reason for the contradictory results published on the estimation of fatigue life of lead-free solder is investigated. In the present study, fatigue behavior of 63Sn37Pb, and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluating the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder ball joint in BGA packages. It was found that lead-free solder joints have a good fatigue property in the small temperature range condition. That condition induce small strain amplitude. However in the large temperature range condition, lead-contained solder joints have a longer fatigue life.

무전해 Co-Cu-P 도금층의 자성에 미치는 도금조건과 도금속도의 영향 (Effect of Plating Condition and Plating Rate on the Magnetic Properties of Electroless Co-Cu-P Deposits)

  • 오이식;박승두
    • 동력기계공학회지
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    • 제8권3호
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    • pp.36-43
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    • 2004
  • The effect of bath composition, plating condition and plating rate on the magnetic property of electroless Co-Cu-P deposits were investigated. With increasing $CuCl_2$ concentration in the bath, plating rate increased, while the Br value of deposit decreased sharply. Deposited surface were inferiority by the increase pH above 10.5, bath temperature higher than $80^{\circ}C$. Plating reaction had been ceased by the increase of pH above 11, bath temperature higher than $90^{\circ}C$ and under $40^{\circ}C$. The Br value of deposit was uniform with various concentration of complexing agent(sodium citrate) in the bath. The Br value of deposit was almost equal to that found by the addition of stabilizer (thiourea) and accelerator(NaF). The Br value of deposit was uniform in plating time(20min) and heat treatment temperature(below $200^{\circ}C$), and were confirmed to have adequate bath stability for practical use.

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Fatigue Crack Growth Characteristics of the Pressure Vessel Steel SA 508 Cl. 3 in Various Environments

  • Lee, S. G.;Kim, I. S.;Park, Y. S.;Kim, J. W.;Park, C. Y.
    • Nuclear Engineering and Technology
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    • 제33권5호
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    • pp.526-538
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    • 2001
  • Fatigue tests in air and in room temperature water were performed to obtain comparable data and stable crack measuring conditions. In air environment, fatigue crack growth rate was increased with increasing temperature due to an increase in crack tip oxidation rate. In room temperature water, the fatigue crack growth rate was faster than in air and crack path varied on loading conditions. In simulated light water reactor (LWR) conditions, there was little environmental effect on the fatigue crack growth rate (FCGR) at low dissolved oxygen or at high loading frequency conditions. While the FCGR was enhanced at high oxygen condition, and the enhancement of crack growth rate increased as loading frequency decreased to a critical value. In fractography, environmentally assisted cracks, such as semi-cleavage and secondary intergranular crack, were found near sulfide inclusions only at high dissolved oxygen and low loading frequency condition. The high crack growth rate was related to environmentally assisted crack. These results indicated that environmentally assisted crack could be formed by the Electrochemical effect in specific loading condition.

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H13 강의 템퍼링 조건에 따른 템퍼링 거동 및 기계적 물성 효과 (Effect of tempering conditions on the tempering behavior and mechanical properties of tempered H13 steel)

  • 권기훈;최병호;손윤호;이영국;문경일
    • 한국표면공학회지
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    • 제57권2호
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    • pp.105-114
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    • 2024
  • Tempering behavior and mechanical properties in AISI H13 steel, quenched and tempered from 300 ℃ to 700 ℃ for different tempering time (1, 2, 5, 10, 20 hr) were quantitatively investigated by scanning electron microscopy (SEM), x-ray diffractometer (XRD), impact test machine, rockwell apparatus, ball-on-disk tester. Under the condition that the tempering time is 2 hours, the hardness increases slightly as the tempering temperature increases, but decreases rapidly when the tempering temperature exceeds 500 ℃, while the impact energy increases in proportion to the tempering temperature. Friction tests were conducted in dry condition with a load of 30 N, and the friction coefficient and wear rate according to tempering conditions were measured to prove the correlation with hardness and microstructure. In addition, primary tempering from 300 ℃ to 700 ℃ was performed at various times to establish a kinetic model to predict hardness under specific tempering conditions.