• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.12
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• pp.1322-1329
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• 2004

End-milling has been used widely in industrial system because it is effective to a material manufacturing with various shapes. Recently the end-milling processing is needed the high-precise technique with good surface roughness and rapid time in precision machine part and electronic part. The optimum mechanical vibration of main spindle, surface roughness and cutting temperature have an effect on end-milling condition such as, cutting direction, revolution of spindle, feed rate and depth of cut, etc. Therefore, this study carried to decide the working condition for optimum mechanical vibration of main spindle, surface roughness and cutting temperature using design of experiments, ANOVA and characteristic function. From the results of experimentation, mechanical vibration has an effect on revolution of spindle, radial depth of cut, and axial depth of cut. The surface roughness has an effect on cutting direction, revolution of spindle and depth of cut. And then the optimum condition used design of experiments is upward cutting In cutting direction, 600 rpm in revolution of spindle, 240 mm/min in feed rate, 2 mm in axial depth of cut and 0.25 mm in radial depth of cut. By design of experiments and characteristic function, it is effectively represented shape characteristics of mechanical vibration, surface roughness and cutting temperature in end-milling.

• Proceedings of the Korea Concrete Institute Conference
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• 2008.04a
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• pp.969-972
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• 2008

This study investigated the effect of the fundamental condition such as release agent, form conditions and types to the surface of concrete with aluminum form on the various temperatures. On the observation with the naked eyes, coated plywood and aluminum form without a scratch showed similar result, and the surface quality of the concrete with aluminum form was gradually decreased corresponding to the increase of the temperature.For the surface roughness, there is no remarkable tendency according to the temperature. However, the difference in accordance with release agent occurred.As void on the surface corresponding to the various temperature, the micro voids ranged $0.1{\sim}1mm$ were increased corresponding to the increasing temperature, so it was confirmed that the chemical reaction wae accelerated. And the voids of the other range also increased. the fundamental condition such as release agent, form conditions and types

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Journal of Energy Engineering
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• v.26 no.2
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• pp.23-31
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• 2017

Numerical study was conducted for the effects of various burner array on the workpiece and the gas temperature in a continuos reheating furnace. Under the same conditions which were the total heat of combustion, the heat capacity of unit burner, the number of burner and burner array were changed to be applied the furnace. The behavior of workpiece temperature and gas temperature in a furnace were evaluated for the effects as function of the changed conditions. A continuous reheating furnace designed for 110 tons/day of production capacity was applied in this study. The furnace which has several gas burners is designed to heat a workpiece. By this study, the better condition was confirmed than the existing designed condition.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.1
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• pp.25-29
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• 1999

Time-temperature indicators (TTI) from three different companies obtained and were attached to food packages materials to evaluate degree of their color change according to storage time and temperature. Five temperature (-10 -5, 0, 5 and 10) was selected to represent standard freezing, refrigerating and room temperature, and evaluated performance by color change based on magnitude of color change and hunter system (L, a, b). Response end point was measured and recorded to find characteristic of each indicator. Comparison and discussion were conducted for accuracy and precision of each time-temperature. More research should be conducted at variable temperature and with various food to determine applicability of TTI on various storage condition.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.161-166
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• 2007

Various thermostatic valves have been used widely in Korea for conservation of heating energy and enhancement of thermal comfort in residential buildings. But heating control performances of thermostatic valves extensively vary with the design and operational conditions of the heating system, climate condition and others. An experimental method was carried out in this study to analyze heating control characteristics by temperature sensing methods of thermostatic valves for various parameters, such as supply temperatures and flow rate of hot water, the position of room thermostats and outdoor air temperatures. As a result, the heat flow rate per day of S-Valve($34^{\circ}C$-Type) of water temperature sensing method was liked that of C-Valve of indoor air temperature sensing method with stage 3.3 of room thermostat in case supply temperature of hot water was $45^{\circ}C$, flow rate was 1.3 L/min and outdoor air temperature was $7.8^{\circ}C$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.12
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• pp.1856-1863
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• 2004

In the last 50 years, lead-contained solder materials have been the most popular interconnect materials used in the electronics industry. Recently, lead-free solders are about to replace lead-contained solders for preventing environmental pollutions. However, the reliability of lead-free solders is not yet satisfactory. Several researchers reported that lead-contained solders have a good fatigue property. The others published that the lead-free solders have a longer thermal fatigue life. In this paper, the reason for the contradictory results published on the estimation of fatigue life of lead-free solder is investigated. In the present study, fatigue behavior of 63Sn37Pb, and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluating the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder ball joint in BGA packages. It was found that lead-free solder joints have a good fatigue property in the small temperature range condition. That condition induce small strain amplitude. However in the large temperature range condition, lead-contained solder joints have a longer fatigue life.

• Journal of Power System Engineering
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• v.8 no.3
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• pp.36-43
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• 2004

The effect of bath composition, plating condition and plating rate on the magnetic property of electroless Co-Cu-P deposits were investigated. With increasing $CuCl_2$ concentration in the bath, plating rate increased, while the Br value of deposit decreased sharply. Deposited surface were inferiority by the increase pH above 10.5, bath temperature higher than $80^{\circ}C$. Plating reaction had been ceased by the increase of pH above 11, bath temperature higher than $90^{\circ}C$ and under $40^{\circ}C$. The Br value of deposit was uniform with various concentration of complexing agent(sodium citrate) in the bath. The Br value of deposit was almost equal to that found by the addition of stabilizer (thiourea) and accelerator(NaF). The Br value of deposit was uniform in plating time(20min) and heat treatment temperature(below $200^{\circ}C$), and were confirmed to have adequate bath stability for practical use.

• Nuclear Engineering and Technology
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• v.33 no.5
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• pp.526-538
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• 2001

Fatigue tests in air and in room temperature water were performed to obtain comparable data and stable crack measuring conditions. In air environment, fatigue crack growth rate was increased with increasing temperature due to an increase in crack tip oxidation rate. In room temperature water, the fatigue crack growth rate was faster than in air and crack path varied on loading conditions. In simulated light water reactor (LWR) conditions, there was little environmental effect on the fatigue crack growth rate (FCGR) at low dissolved oxygen or at high loading frequency conditions. While the FCGR was enhanced at high oxygen condition, and the enhancement of crack growth rate increased as loading frequency decreased to a critical value. In fractography, environmentally assisted cracks, such as semi-cleavage and secondary intergranular crack, were found near sulfide inclusions only at high dissolved oxygen and low loading frequency condition. The high crack growth rate was related to environmentally assisted crack. These results indicated that environmentally assisted crack could be formed by the Electrochemical effect in specific loading condition.

• Journal of the Korean institute of surface engineering
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• v.57 no.2
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• pp.105-114
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• 2024

Tempering behavior and mechanical properties in AISI H13 steel, quenched and tempered from 300 ℃ to 700 ℃ for different tempering time (1, 2, 5, 10, 20 hr) were quantitatively investigated by scanning electron microscopy (SEM), x-ray diffractometer (XRD), impact test machine, rockwell apparatus, ball-on-disk tester. Under the condition that the tempering time is 2 hours, the hardness increases slightly as the tempering temperature increases, but decreases rapidly when the tempering temperature exceeds 500 ℃, while the impact energy increases in proportion to the tempering temperature. Friction tests were conducted in dry condition with a load of 30 N, and the friction coefficient and wear rate according to tempering conditions were measured to prove the correlation with hardness and microstructure. In addition, primary tempering from 300 ℃ to 700 ℃ was performed at various times to establish a kinetic model to predict hardness under specific tempering conditions.