• International journal of advanced smart convergence
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• v.12 no.4
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• pp.217-223
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• 2023

In this study, we compared the VacCAD and VacTran, commercial vacuum simulators, to investigate the simulation applicability and efficiency as vacuum simulation software. It was verified on reliability and simplicity of simulation modelling, and characteristics of the pump combinations, pumping down curves, and employed vacuum materials. First, usability of simulation schematics was estimated through the modeling tools and the overall simulation characteristics of each simulator were compared to evaluate the applicability in practice. Simulation reliability of each simulator was also probed by comparing the pumping performance characteristics of commercial high vacuum system models. In addition, the degree of tolerances on both simulators was also evaluated through pumping down analysis considering outgassing effect due to chamber material variations. The higher effectiveness and expediency of VacCAD than VacTran has been presented, and it was also expected that the utilization of VacTan in vacuum applications to be increased due to the higher availability of modelling variations.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.6
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• pp.449-457
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• 2011

Effect of pump combinations on the vacuum characteristics of vacuum system was simulated for optimum design of system. In this investigation, the feasibility of modelling mechanism for VacSimMulti simulator was proposed. Simulation results of various pumping combinations showed the possibilities and reliabilities of simulation for the performance of vacuum system in specific semiconductor processing. Simulation of roughing pump presented the expected pumping behaviors based on commercial specifications of employed pumps. Application of booster pump exhibited the high pumping efficiency for middle vacuum range. Combinations of optimum backing pump for diffusion and turbo vacuum system were obtained. And, the predictable characteristics of process application of both simulated systems were also acquired.

• Journal of the Semiconductor & Display Technology
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• v.8 no.1
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• pp.7-12
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• 2009

The outgassing effects of selected vacuum materials on the vacuum characteristics were simulated by the $VacSim^{Multi}$ simulation tool. This investigation examined the feasibility of reliably simulating the outgassing characteristics of common vacuum chamber materials (aluminum, copper, stainless steel, nickel plated steel, Viton A). The optimum design factors for these vacuum systems were suggested based on the simulation results. The baking-out effects of the modeled systems and materials on the performance of the vacuum system were also analyzed. The simulation predicted that the overall outgassing effect was more significant in the TMP system than in the DP system and that the utilization of a booster pump has a greater effect on the evacuation time than on the ultimate pressure.

• Transactions on Electrical and Electronic Materials
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• v.14 no.6
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• pp.334-338
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• 2013

In this study, the outgassing effects of selected vacuum materials on the vacuum characteristics were simulated by the $VacSim^{Multi}$ simulation tool. This investigation examined the feasibility of reliably simulating the outgassing characteristics of common vacuum chamber materials (aluminum, copper, stainless steel, nickel plated steel, Viton A). The optimum design factors for these vacuum systems were suggested based on the simulation results. The baking-out effects of the modeled systems and materials on the performance of the vacuum system were also analyzed. The simulation predicted that the overall outgassing effect was more significant in the turbomolecular pump system than in the diffusion pump system and that the utilization of a booster pump has a greater effect on the evacuation time than on the ultimate pressure.

• International journal of advanced smart convergence
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• v.8 no.4
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• pp.200-206
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• 2019

In this study, we compared the VacCAD and VacSim^(Multi), commercial vacuum simulators, to verify the advantages of VacCAD's efficiency. It was emphasized on immediacy and simplicity of simulation modelling, and characteristics of the pump combinations, pumping down curves, and vacuum materials. First, usability of simulation mechanism was estimated through the modeling schematics and obtained simulation results of each employed simulator were compared to evaluate the applicability in practice. Simulation reliability of each simulator was also probed by comparing the pumping characteristics of commercially available high vacuum systems. In addition, the degree of tolerances on VacCAD was also investigated through pumping down analysis considering outgassing effect due to chamber material variations. The higher effectiveness and expediency of VacCAD than VacSim^(Multi) has been presented, and it was expected that the utilization of VacCAD in vacuum applications to be increased.

• Journal of Power System Engineering
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• v.13 no.6
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• pp.110-116
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• 2009

In the present study, we proposed a simulation model of vacuum booster with AMESIM software to predict the output characteristic. And we performed the sensitivity analysis of output characteristic with main design parameters, such as diaphragm diameter. All of these parameters are main design parameters in the procedure of vacuum booster design. The simulation results of this paper offer qualitative information of vacuum booster output. Therefore, the simulation results of this paper will be used effectively for the design procedure of vacuum booster in the industrial field.

• International journal of advanced smart convergence
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• v.6 no.4
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• pp.1-8
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• 2017

In this work, the effects of fairly influential factors on performance of vacuum system, such as constant pressure and outgassing effect were simulated to propose the optimum design factors. Outgassing effects of selected vacuum materials on the vacuum characteristics were simulated by the $VacSim^{Multi}$ simulation tool. This investigation examined the feasibility of reliably simulating the outgassing characteristics of common vacuum chamber materials (aluminum, copper, stainless steel, nickel plated steel, Viton A). The optimum design factors for vacuum systems were suggested based on the simulation results. And, the effects of throttle valve applications on vacuum characteristics were also simulated to obtain the optimum design model of variable conductance on high vacuum system. Simulated vacuum characteristics of the proposed modelling were agreed with the observed experimental behaviour of real systems. Pressure limit valve and normally on-off control valve were schematized as the modelling of throttle valve for the constant process-pressure. Simulation results were plotted as pump-down curve of chamber and variable conductance of throttle valve. Simulated behaviors showed the applications of throttle valve sustained the process-pressure constantly, stably, and reliably.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.4
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• pp.287-292
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• 2010

Effect of conductance factors on performance of vacuum system was simulated for optimum design of vacuum system. In this investigation, the feasibility of modeling mechanism for VacSim$^{Multi}$ simulator was proposed. Application specific design of vacuum system is required to meet the particular process conditions for various industrial implementations of vacuum equipments. Geometry and length, diameter of exhaust pipeline were modeled as simulation modeling variables for conductance effects. Series vacuum system was modeled and simulated with varied dimensions and structures of exhaust pipeline. Variation of pipeline diameter showed the more significant effects on vacuum characteristics than that of pipeline length variations. It was also observed that the aperture structure of pipeline had the superior vacuum characteristics among the modeled systems.

• International journal of advanced smart convergence
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• v.5 no.2
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• pp.1-7
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• 2016

Recently, with the development of advanced thin film devices comes the need for constant high quality vacuum as the deposition pressure is more demanding. It is for this reason our research seeks to understand how the variable design factors are employed in such vacuum systems. In this study, the effects of design factor applications on the vacuum characteristics were simulated to obtain the optimum design modeling of variable models on an ultra high vacuum system. The commercial vacuum system simulator, $VacSim^{(multi)}$, was used in our investigation. The reliability of the employed simulator was verified by the simulation of the commercially available models of ultra high vacuum system. Simulated vacuum characteristics of the proposed modeling aligned with the observed experimental behavior of real systems. Simulated behaviors showed the optimum design models for the ideal conditions to achieve optimal pressure, pumping speed, and compression ratio in these systems.

• International journal of advanced smart convergence
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• v.10 no.1
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• pp.159-165
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• 2021

Electronic devices used in the mobile environments fabricated under the plasma conditions in high vacuum system. Especially for the development of advanced electronic devices, high quality plasma as the process conditions are required. For this purpose, the variable conductance throttle valves for controllable plasma employed to the high vacuum system. In this study, we analyzed the effects of throttle valve applications on vacuum characteristics simulated to obtain the optimum design modelling for plasma conditions of high vacuum system. We used commercial simulator of vacuum system, VacSim(multi) on this study. Reliability of simulator verified by simulation of the commercially available models of high vacuum system. Simulated vacuum characteristics of the proposed modelling agreed with the observed experimental behaviour of real systems. Pressure limit valve and normally on-off control valve schematized as the modelling of throttle valve for the constant process-pressure of below 10-3 torr. Simulation results plotted as pump down curve of chamber, variable valve conductance and conductance logic of throttle valve. Simulated behaviors showed the applications of throttle valve sustained the process-pressure constantly, stably, and reliably in plasma process.