• Applied Science and Convergence Technology
• /
• 제25권2호
• /
• pp.25-27
• /
• 2016

The surface flatness of metal meshes in a deflector of particle beam mass spectrometer (PBMS) required ideally flat, and this can specify the particle trajectories which goes through the detector. In this research, charged particle current was measured using the different surface roughness deflectors. NaCl particles were generated monodispersed in its size by using differential mobility analyzer and the whole processes were followed the way calibrating PBMS. The results indicate that the mesh surface morphology in the deflector can affect to the particle size and the concentration errors, and sensitivity of PBMS.

• 한국진공학회지
• /
• 제14권4호
• /
• pp.186-194
• /
• 2005

정적법 고진공 표준기를 이용하여 스피닝 로터 게이지를 $4.04\times10^{-3}$ $Pa\~1.11\times10^{-2}$Pa에서 교정하였으며, 그 결과를 국제표준화기구에서 권고한 측정불확도 표현지침에 따라 불확도를 계산 및 평가하였다. 평가 결과 기준압력 $7.5488\times10^{-3}$ Pa에서 교정된 SRG의 합성표준불확도는 $95\%$ 신뢰수준, 포함인자 k = 1에서 $3.0035\times10^{-5}$ Pa로 나타났다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2010년도 제39회 하계학술대회 초록집
• /
• pp.18-18
• /
• 2010

Methods of the characteristics evaluation of turbo-molecular pumps (TMP) are well-defined in the international measurement standards such as ISO, PNEUROP, DIN, JIS, and AVS. The Vacuum Center in the Korea Research Institute of Standards and Science has recently designed, constructed, and established the integrated characteristics evaluation system of TMPs based on the international documents by continuously pursuing and acquiring the reliable international credibility through measurement perfection. The measurement of TMP pumping speed is normally performed with the throughput and orifice methods dependent on the mass flow regions. However, in the UHV range of the molecular flow region, the high uncertainties of the gauges, mass flow rates, and conductance are too critical to precisely accumulate reliable data. With UHV gauges of uncertainties less than 15% and a calculated conductance of the orifice, about 35% of pumping speed uncertainties are experimentally derived in the pressure range of less than $10^{-6}$ mbar. In order to solve the uncertainty problems of pumping speeds in the UHV range, we introduced an SRG with 1% accuracy and a constant volume flow meter (CVFM) to measure the finite mass flow rates down to $10^{-3}$ mbar-L/s with 3% uncertainty for the throughput method. In this way we have performed the measurement of pumping speed down to less than $10^{-6}$ mbar with an uncertainty of 6% for a 1000 L/s TMP. In this article we suggest that the CVFM has an ability to measure the conductance of the orifice experimentally with flowing the known mass through the orifice chambers, so that we may overcome the discontinuity problem encountering during introducing two measurement methods in one pumping speed evaluation sequence.

• 한국진공학회지
• /
• 제22권5호
• /
• pp.231-237
• /
• 2013

본 연구에서는 분동식 기준압력계의 기준분동(reference weight)의 부피를 측정하는 새로운 측정방법인 기체용적계(gas pycnometer) 측정방법을 제안하였다. 제안된 측정방법에 의한 측정결과로서 기준분동 1 kg, 2 kg, 5 kg에 대한 부피 측정불확도는 신뢰수준 95%에서 0.2%를 나타내었다. 기체용적계의 주요 장치는 샘플용기와 팽창용기, 정밀압력계, 정밀온도계, 진공펌프로 구성되며, 측정 원리는 일정한 용기 내에 들어 있는 일정한 양의 기체의 압력과 부피는 서로 반비례한다는 보일(boyle's law)의 법칙을 용용하였다. 본 결과는 현재까지 문헌이나 제조사로부터 기준분동 재질에 대한 밀도값을 적용하여 오던 것을 기준분동의 부피를 직접 측정하여 밀도값을 적용함으로서 압력기준기의 압력 기준값에 대한 국가측정표준의 신뢰도 향상에 기여될 것이다.

• 반도체디스플레이기술학회지
• /
• 제21권3호
• /
• pp.74-79
• /
• 2022

In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y₂O₃ and Y₃Al₅O₁₂ (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF₄, O₂, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H₂SO₄(3):H₂O₂(1)) to remove the defect-causing surface fluorinated film. APS-Y₂O₃ and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.

• 한국초전도학회:학술대회논문집
• /
• 한국초전도학회 2009년도 Korea Superconductivity Society Meeting 2009
• /
• pp.67-67
• /
• 2009

• 한국진공학회지
• /
• 제5권3호
• /
• pp.181-187
• /
• 1996

The Ultrasonic Interferometer Manometer(UIM) which can calibrae from1 Pa to $10^5$Pa has been developed, and its uncertainty is evaluated less than $\pm$(30ppm of pressure+12mPa). We can calibrate Capacitance Diaphragm Gauge(DCG) used as a transfer standard gauge in the low vacuum field. TheUIM enables to maintain the measurement traceability for industries. In order to improve the UIM's accracy, we will perform the international intercomparison withother national standards laboratories.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
• /
• pp.223.1-223.1
• /
• 2013

Since sapphire single crystal is one of the materials that have excellent mechanical and optical properties, the single crystal is widely used in various fields, and the demand for the use of substrate of LED devices is increasing rapidly. However, crystal defects such as dislocations and stacking faults worsen the properties of the single crystal intensely. When sapphire wafer of single crystal is used as LED substrate, especially, crystal defects have a strong influence on the characteristics of a film deposited on the wafer. In such a case quantitative assessment of the defects is essential, and the evaluation technique is now becoming one of the most important factors in commercialization of sapphire wafer. Wet etching is comparatively easy and accurate method to estimate dislocation density of single crystal because etching reaction primarily takes place where dislocations reached crystal surface which are chemically weak points, and produces etch pit. In the present study, the formation behavior of etch pits and etching time dependence were studied systematically. Etch pit density(EPD) analysis using optical microscope was also conducted and measurement uncertainty of EPD was studied to confirm the reliability of the results. EPDs and measurement uncertainties for 4 inch sapphire wafers were analyzed in terms of 5 and 21 points EPD readings. EPDs and measurement uncertainties in terms of 5 points readings for 4 inch wafers were compared by 2 organizations. We found that the average EPD value in terms of 5 points readings for a 4 inch sapphire wafer may represent the EPD value of the wafer.

• Current Optics and Photonics
• /
• 제1권6호
• /
• pp.618-625
• /
• 2017

In the present research, a new bending system using a segmented vacuum chuck for Stressed Mirror Polishing (SMP) is developed. SMP is a special fabrication method for thin aspheric mirrors, where simple flat or spherical fabrication is applied while a mirror blank is deflected. Since a mirror blank is usually glued to a bending fixture in the conventional SMP process, there are drawbacks such as long curing time, inconvenience of mirror replacement, risk of mirror breakage, and stress concentration near the glued area. To resolve the drawbacks, a new bending system is designed to effectively hold a mirror blank by vacuum. For the developed bending system, the optimal bending load to achieve the designated mirror deflection is found by finite element analysis and an optimization algorithm. With the measurement results of the deflected mirror surfaces with the optimal bending loads, the feasibility of the developed bending system is investigated. As a result, it is shown that the bending system is appropriate for the SMP process.

• 한국진공학회지
• /
• 제15권4호
• /
• pp.347-353
• /
• 2006

국제도량형위원회의 질량 및 관련량 자문위원회 (CCM)가 주관하는 헬륨 투과형 표준리크(standard leak) 핵심측정표준 국제비교 (key comparison, KC)에 참여하기 위하여 기존의 정압형 리크표준기에 porous plug를 추가하여 측정범위를 $10^{-6}$ Pa L/s 까지 확장한 헬륨 미세리크 표준기를 개발하였다. 이를 위해 헬륨 기체에 대한 고진공 및 초고진공 표준기의 압력비와 porous plug의 콘덕턴스를 새롭게 측정하였으며, 개발된 장치를 이용하여 명목 값이 $5.6{\times}10^{-4}$ Pa L/s 인 투과형 표준리크를 직접 교정한 결과 표준기와 차이가 11.1 % 임을 알 수 있었다.