• 제목/요약/키워드: Vacuum deposition

검색결과 1,947건 처리시간 0.028초

Filtered Plasma Deposition and MEVVA Ion Implantation

  • Liu, A.D.;Zhang, H.X.;Zhang, T.H.
    • 한국진공학회지
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    • 제12권S1호
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    • pp.46-48
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    • 2003
  • The modification of metal surface by ion implantation with MEVVA ion implanter and thin film deposition with filtered vacuum arc plasma device is introduced in this paper. The combination of ion implantation and thin film deposition is proved as a better method to improve properties of metal surface.

Low temperature deposition of carbon nanofilaments using vacuum-sublimated $Fe(CO)_5$ catalyst with thermal chemical vapor deposition

  • Kim, Nam-Seok;Kim, Kwang-Duk;Kim, Sung-Hoon
    • 한국결정성장학회지
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    • 제17권1호
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    • pp.18-22
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    • 2007
  • Carbon nanofilaments were deposited on silicon oxide substrate by thermal chemical vapor deposition method. We used $Fe(CO)_5$ as the catalyst for the carbon nanofilaments formation. Around $800^{\circ}C$ substrate temperature, the formation density of carbon nanofilaments could be enhanced by the vacuum sublimation technique of $Fe(CO)_5$, compared with the conventional spin coating technique. Finally, we could achieve the low temperature, as low as $350^{\circ}C$, formation of carbon nanofilaments using the sublimated Fe-complex nanograins with thermal chemical vapor deposition. Detailed morphologies and characteristics of the carbon nanofilaments were investigated. Based on these results, the role of the vacuum sublimation technique for the low temperature deposition of carbon nanofilaments was discussed.

Vacuum metal deposition의 직물에 잠재된 그립흔에 대한 현출 효과 (The effectiveness of vacuum metal deposition in developing latent grip impression on fabrics)

  • 서보길;최수현;전유경;유제설
    • 분석과학
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    • 제33권6호
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    • pp.240-244
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    • 2020
  • 장문의 또 다른 형태인 움켜쥔 흔적(grip impression, 이하 그립흔)은 사건이 일어난 당시 가해자와 피해자 사이에서 일어난 접촉을 증명해주는 증거로, 그립흔과 함께 남겨진 지문의 형태와 위치를 보고 손바닥의 어느 부분이 닿은 것인지 유추할 수 있다. 본 연구에서는 cotton, nylon, polyester 직물에 유류된 그립흔을 vacuum metal deposition (VMD)로 현출하여 그립흔의 융선 디테일로 개인을 식별할 수 있는지에 대하여 연구하였다. 그 결과 VMD로 현출된 그립흔은 개인식별에 한계가 있었으나 현장 재구성의 단서로 사용할 수 있는 새로운 가능성을 발견하였다.

Development of High Flux Metal Ion Plasma Source for the Ion Implantation and Deposition

  • Kim, Do-Yun;Lee, Eui-Wan
    • Journal of Korean Vacuum Science & Technology
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    • 제7권2호
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    • pp.45-56
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    • 2003
  • A high flux metal plasma pulse ion source, which can simultaneously perform ion implantation and deposition, was developed and tested to evaluate its performance using the prototype. Flux of ion source was measured to be 5 A and bi-polar pulse power supply with a peak voltage of 250 V, repetition of 20 Hz and width of 100 ${\mu}\textrm{s}$ has an output current of 2 kA and average power of 2 kW. Trigger power supply is a high voltage pulse generator producing a peak voltage of 12 kV, peak current of 50 A and repetition rate of 20 Hz. The acceleration column for providing target energy up to ion implantation is carefully designed and compatible with UHV (ultra high vacuum) application. Prototype systems including various ion sources are fabricated for the performance test in the vacuum and evaluated to be more competitive than the existing equipments through repeated deposition experiments.

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진공 환경에서 가열되는 반도체 웨이퍼로의 입자 침착에 관한 수치해석적 연구 (A Numerical Study on Particle Deposition onto a Heated Semiconductor Wafer in Vacuum Environment)

  • 박수빈;유경훈;이건형
    • 한국입자에어로졸학회지
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    • 제14권2호
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    • pp.41-47
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    • 2018
  • Numerical analysis was conducted to characterize particle deposition onto a heated horizontal semiconductor wafer in vacuum environment. In order to calculate the properties of gas surrounding the wafer, the gas was assumed to obey the ideal gas law. Particle transport mechanisms considered in the present study were convection, Brownian diffusion, gravitational settling and thermophoresis. Averaged particle deposition velocities on the upper surface of the wafer were calculated with respect to particle size, based on the numerical results from the particle concentration equation in the Eulerian frame of reference. The deposition velocities were obtained for system pressures of 1000 Pa~1 atm, wafer heating of 0~5 K and particle sizes of $2{\sim}10^4nm$. The present numerical results showed good agreement with the available experimental ones.