• Title/Summary/Keyword: Uniform Components

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Racing Girl Uniforms of Domestic and Foreign Automobile Brands at the Motor Shows (모터쇼에 나타난 국내외 자동차 브랜드 레이싱걸 유니폼 디자인 연구)

  • Kim, Sun Hye;Yoo, Young Sun
    • Journal of the Korean Society of Clothing and Textiles
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    • v.42 no.3
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    • pp.452-473
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    • 2018
  • This study analyzed the expressions of racing girl uniforms that promote automobile brands shown at Seoul and Busan motor shows. The results are as follows. In each of the design components expression, the glossy and plain material, the achromatic color, and the dress style appeared most frequently in the uniform design of both domestic and foreign automobile brands. In the fashion image expression, sexy image appeared the most, followed by modern image, romantic image, active image, elegance image and ethnic image. Based on the analysis results, the following expressive characteristics were identified: First, sexy images were used in uniform design to express the streamline and speedy feeling of a car metaphorically. Second, modern image, glossy material, and achromatic color were used for a uniform design to express advanced technology and the future orientation of an automobile. Third, fashion images that match the automobile type emphasized the brand image of the car. Fourth, some of the manufacturers that prevailed in the automobile market promoted several automobile brands exhibited with a unified uniform design that expressed the design philosophy and concept. As such, the motor show racing girl uniform contributed to promoting automobile brand identity and the automobile industry.

Novel Maskless Bumping for 3D Integration

  • Choi, Kwang-Seong;Sung, Ki-Jun;Lim, Byeong-Ok;Bae, Hyun-Cheol;Jung, Sung-Hae;Moon, Jong-Tae;Eom, Yong-Sung
    • ETRI Journal
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    • v.32 no.2
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    • pp.342-344
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    • 2010
  • A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out-gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 ${\mu}m$ and 150 ${\mu}m$.

A Study on Aerodynamic Loads of a Deploying Wing Launched from a Mobile Platform (이동식 플랫폼에서 발사되는 비행체의 날개 전개 공력 하중에 관한 연구)

  • Lee, Younghwan
    • Journal of the Korea Institute of Military Science and Technology
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    • v.22 no.3
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    • pp.353-359
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    • 2019
  • In this study, a aerodynamic loads prediction to design a deploying device of folded fin was introduced. In general, resultant flow conditions around the fin are used to obtain deploying moments and required energy. However, when it comes to the air vehicles launched from a mobile platform, more specific flow conditions can be provided. With the conditions, the design criteria can be calculated more realistically. In this study, therefore, aerodynamic moments induced by aerodynamic loads and energy required in deployment were calculated using wind-over-deck(WOD) velocity, combination of a platform velocity and a wind velocity. For the calculation, wind tunnel test was conducted on various angle of attack, side slip angles, and folding angles. It was found that the aerodynamic moments and the energy required in deployment using the non-uniform flow due to the velocity components were less than those using the uniform flow without the components.

Development of precision optical system and its application (납땜 검사용 정밀 광학 장치 개발과 응용)

  • 고국원;조형석;김재선;김성권
    • 제어로봇시스템학회:학술대회논문집
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    • 1997.10a
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    • pp.36-39
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    • 1997
  • In this paper, we described an approach to design of precision optical system for visual inspection of solder joint defects of SMC(surface mount components) on PCBs(Printed Circuit Board). The illumination system, consisting of three tiered LED lamps and one main camera and four side view camera, is implemented to generated iso-contour on the solder joint according to gradient of the soldered surface. We analyze LED design parameter such as incident angle, diameter of LED ring, and so on to acquire uniform illumination.

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Aesthetic Characteristics of Glocalism in Flight Attendants' Uniform Design

  • Kim, Ji U;Kim, Jang Hyeon;Kim, Young Sam
    • Fashion & Textile Research Journal
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    • v.17 no.1
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    • pp.42-52
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    • 2015
  • This study considers the expressive types of 'Glocalism' trends and its inherent aesthetic characteristics through the analysis of flight attendants' uniform design. The following is the conclusions regarding the glocalism trend according to the analysis of airline uniform design that reflect it. First, the design approach was developed appropriating the whole or parts of traditional attire and applying decorative items in terms of a formal aspect. Secondly, the colors of the airline's homeland symbols or natural environment were used while, thirdly, the fabrics represent glocalism by employing folk elements of the region and patterns of nature for a uniform design. Induced from these design analyses, the aesthetic characteristics of airline uniforms reflecting glocalism are traditionality, naturality, and compromisability. To begin with, traditionality is what is realized in interpreting the historical aesthetics in a contemporary perspective, contributing in inspiring the historical value of the homeland and contributing to the establishment of identity by applying forms and colors of traditional garments with folk patterns on a uniform design. In addition, naturality means the reorganization of unprocessed pure nature, expressing the image of nature through colors taken from the natural environment or motifs of the regional plants. Finally, combining general sensibilities with diverse cultural features, compromisability is realized as a modern design which combines a standardized uniform with the aesthetic components of the local environment and traditional garments.

An Experimental Study on the Effects of Non-uniform Inlet Flows upon Tonal Radiation from an Axial-type Propeller Fan (불균일 난류 유입유동이 프로펠러형 송풍기의 톤소음에 미치는 영향에 대한 실험적 연구)

  • Lee, Seungbae;Kim, Kwang-Yong;Yang, Gwi-Chul
    • The KSFM Journal of Fluid Machinery
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    • v.1 no.1 s.1
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    • pp.49-57
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    • 1998
  • The acoustic signatures from a propeller fan under non-uniform inlet flow conditions were measured to reveal the mechanism for tonal radiation. Experimental studies were carried out by generating non-uniform turbulent flows with circumferential and radial components of harmonic incoming gust deliberately. This paper reports the measured acoustic power exponents and cross-spectra for circumferential and radial disturbances at a specified flow-rate coefficient.

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A Study on Mixing Characteristics of Two-component Polyurethane for In-mold Coating (인몰드 코팅을 위한 이액형 폴리우레탄의 혼합특성에 관한 해석적 연구)

  • Lee, Ho Sang;Kim, Dong Mi
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.3
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    • pp.317-323
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    • 2013
  • In-mold coating is a reactive fluid designed to improve the surface quality of injection molded thermoplastic substrate in functional and cosmetic properties. In this study, a mixing head for in-mold coating was designed, and mixing characteristics of two-component polyurethane flowing through runner were investigated based on flow simulations. In order to achieve uniform mixing of two components injected through straight mixing head, an impingement aftermixer was used in runner design. Semi-circular cross-section was better than circular one for runners for uniform mixing. With increasing runner length and flow rate, mixing became more uniform. In addition, the degree of mixing was more improved with decreasing viscosity of isocyanate.

FITTED MESH METHOD FOR SINGULARLY PERTURBED REACTION-CONVECTION-DIFFUSION PROBLEMS WITH BOUNDARY AND INTERIOR LAYERS

  • Shanthi V.;Ramanujam N.;Natesan S.
    • Journal of applied mathematics & informatics
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    • v.22 no.1_2
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    • pp.49-65
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    • 2006
  • A robust numerical method for a singularly perturbed second-order ordinary differential equation having two parameters with a discontinuous source term is presented in this article. Theoretical bounds are derived for the derivatives of the solution and its smooth and singular components. An appropriate piecewise uniform mesh is constructed, and classical upwind finite difference schemes are used on this mesh to obtain the discrete system of equations. Parameter-uniform error bounds for the numerical approximations are established. Numerical results are provided to illustrate the convergence of the numerical approximations.

Heat Transfer Characteristics of Electronic Components in a Horizontal Channel According to Various Cooling Methods (다양한 냉각방법에 따른 수평채널 내 전자부품의 열전달 특성)

  • Son, Young-Seok;Shin, Jee-Young
    • Journal of Advanced Marine Engineering and Technology
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    • v.32 no.6
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    • pp.854-861
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    • 2008
  • Heat transfer characteristics of protruding electronic components in a horizontal channel are studied numerically. The system consists of two horizontal channels formed by two covers and one printed circuit board which has three uniform protruding heat source blocks. A two-dimensional numerical model has been developed to predict the conjugate heat transfer. and the finite volume method is used to solve the problem. Five different cooling methods are considered to examine the heat transfer characteristics of electronic components according to the different cooling methods. The velocity and temperature of cooling medium and the temperature of the heat source blocks are obtained. The results of the five different cooling methods are compared to find out the most efficient cooling method in a given geometry and heat sources.

Novel Bumping Process for Solder on Pad Technology

  • Choi, Kwang-Seong;Bae, Ho-Eun;Bae, Hyun-Cheol;Eom, Yong-Sung
    • ETRI Journal
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    • v.35 no.2
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    • pp.340-343
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    • 2013
  • A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.