• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.29-33
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• 2010

UV laser micromachining of metallic materials has been used in microelectronic and other industries. This paper shows on experimental investigation of micromachining of copper using a 355nm UV laser with 50ns pulse duration. A finite element model with high strain rate effect is especially suggested to investigate the phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. In order to consider the strain rate effect, Cowper-Symonds model was used. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, a commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computational simulation of the UV laser micro machining behavior for thin copper material. From these computational results, depth of the dent (from one to six pulsed) were observed and compared with previous experimental results. This will help us to understand interaction between UV laser beam and material.

• Laser Solutions
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• v.15 no.3
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• pp.7-10
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• 2012

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

• Journal of Electrical Engineering and Technology
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• v.6 no.2
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• pp.275-279
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• 2011

Sterilization of Escherichia coli (E. coli) is examined using a unique pulsed ultra-violet (UV) elliptical reactor based on Nd:YAG laser resonator, UV radiation from a pulsed xenon flashlamp. The light from the discharge has a broadband emission spectrum extending from the UV to the infrared region with a rich UV contained. Sterilization method by using the UV light is fast, environment-friendly and it does not cause secondary pollution. A Nd:YAG laser resonator having elliptical shape has advantage of concentrating the radiation of the UV light at two foci as the quart sleeve filled with E. coli. The primary objective of this research is to determine the important parameters such as pulse per second (pps), the applied voltage for sterilizing E. coli by using an UV elliptical reactor. From the experiment result, the sterilization effect of UV elliptical reactor is better than that of UV cylindrical reactor, and it can be 99.9% of sterilization at 800V regardless of the pps within 10 minutes.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.5
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• pp.2979-2984
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• 2015

This paper has presented a new foaming technology of selective hybrid-structured polymer film with expanded pores. The porous structure of closed pore was firstly fabricated by applying the 355nm UV-pulsed laser to 0.1mm thick film that was uniformly mixed with PP pellets, copper powder, and CBA (Chemical Blowing Agent). In order to expand pore size of closed-cell shape, LAMO(Laser Aided Micro pore Opening) processing was conducted to heat the copper powder, and then the bigger pore size of closed-cell more than existing pore size was successfully formed because of rapid conduction of heated metal powder. From the experimental results, various process parameters such as laser fluence, intensity, scan rate, spot size and density of powder and CBA were considerably considered to reveal the correlation among the pore characteristics. In the future, a function experiment will be carried out to use the hybrid film of industrial applications.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.299-300
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.565-566
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.417-418
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.609-610
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• 2011

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.613-614
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• 2011

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.31-36
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• 2009

In this paper, the laser cutting characteristics of the flexible PCB using high power Nd:YAG UV laser were investigated. A specific FPCB model was selected for the experiment. Test sheets were made, which had equal materials and layer structure to those of the outline (OL) region and the contact pad (CP) region in the FPCB. The experiment is made up of two stages. In the first stage of the experiment, the laser cutting fluence was found, which is the threshold fluence to cut the test sheets completely. The laser cutting fluence of the OL sheet is $1781.26{\sim}1970.16\;J/cm^2$ and that of the CP sheet is $2109.34{\sim}2134.34\;J/cm^2$. In the second stage, cutting performance and its qualities were analyzed by the experiment. The laser cutting performance remained almost unchanged for all laser and process parameter sets. The average cutting width (top side/bottom side) of the OL sheet was $40.45\;{\mu}m/11.52\;{\mu}m$ and that of the CP sheet was $22.14\;{\mu}m/10.93\;{\mu}m$. However, the laser cutting qualities were different according to the parameters. The adjacent region of the cutting line on the OL sheet was carbonized as the beam speed was low and the overlap coefficient was high. The surface quality around the cutting line of the CP sheet was about the same. Carbonization and debris occurred on the surface of the cutting line. As a result of the experiment, the cutting qualities were better as the overlap coefficient was made low and beam speed high. Therefore, the overlap coefficient 2 or 3 is proper for the FPCB laser cutting.