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A Study on the Computational Analysis of 355nm UV Laser Multiple-Pulsed Micro Machining Considering the Strain Rate Effect  

Lee, Jung-Han (Department of Mechanical Engineering, Pusan Natl. Univ.)
Oh, Jae-Yong (ERC/NSDM, Pusan Natl. Univ.)
Park, Sang-Hu (Department of Mechanical Engineering, Pusan Natl. Univ.)
Nam, Gi-Jung (Jettech, LTD.)
Ryu, Gwang-Hyun (Jettech, LTD.)
Shin, Suk-Hun (Jettech, LTD.)
Shin, Bo-Sung (ERC/NSDM, Pusan Natl. Univ.)
Publication Information
Journal of the Korean Society for Precision Engineering / v.27, no.10, 2010 , pp. 29-33 More about this Journal
Abstract
UV laser micromachining of metallic materials has been used in microelectronic and other industries. This paper shows on experimental investigation of micromachining of copper using a 355nm UV laser with 50ns pulse duration. A finite element model with high strain rate effect is especially suggested to investigate the phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. In order to consider the strain rate effect, Cowper-Symonds model was used. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, a commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computational simulation of the UV laser micro machining behavior for thin copper material. From these computational results, depth of the dent (from one to six pulsed) were observed and compared with previous experimental results. This will help us to understand interaction between UV laser beam and material.
Keywords
UV Laser; Multiple Pulses; FEA; Strain Rate; Copper;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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