• 제목/요약/키워드: UV 레이저 가공

검색결과 89건 처리시간 0.03초

소비자 지향 3차원 헬멧제품 제작을 위한 UV레이저 기반의 폴리머/금속적층에 대한 기초연구 (A Fundamental Study on Polymer/Metal Additive Method using a UV Laser for Consumer-oriented 3D Helmet Products)

  • 강보석;안동규;신보성;신종국
    • 한국기계가공학회지
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    • 제15권6호
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    • pp.89-94
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    • 2016
  • Consumer orientation requires that companies understand consumer needs and produce products that meet their expectations. This study proposes a new additive method that creates a polymer/metal bonding layer and thus can lighten the weight of helmets to develop a consumer-oriented 3D printing helmet. The composite solution is experimentally prepared with copper formate and a photopolymer resin. Stereolithography apparatus and photothermal reactions are introduced to fabricate an adhesive hybrid layer of copper metal and polymer. A UV pulse laser with a 355 nm wavelength was installed to simplify this process. Resistance, adhesion, and accuracy were investigated to evaluate the properties of the layer produced.

Laser Direct Writing 방법을 이용한 광도파로 제작 (Fabrication of waveguide using UV Ar-ion laser direct writing)

  • 강희신;서정;이제훈;김정오
    • 한국레이저가공학회지
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    • 제8권1호
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    • pp.9-18
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    • 2005
  • The laser direct writing method using a UV Argon-ion laser is studied for fabrication of waveguide. The laser direct writing system is constructed with a vision camera, a xy-stage, a motion controller and the delivery components of a laser beam. The UV Argon-ion laser has wavelength range of $333.6\~363.8$ nm. A photo-active UV curable polymer for a planar light-wave circuit(PLC) of single mode is used. This polymer is irradiated by Argon-ion laser and developed by a solvent after a post-baking. The optimum laser direct writing condition is obtained experimentally by changing various process parameters such as laser power, writing speed and focal length. The propagation and coupling loss of a optical waveguide was measured as 1dB/cm and 0.6dB/cm, respectively. Also, the minimum width of waveguide of $100{\mu}m$(ZPLW-207) is obtained. Finally, the waveguides of line, bend and branch type are successfully fabricated.

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355nm UV 레이저를 이용한 마이크로 렌즈 어레이 쾌속 제작 (Rapid Fabrication of Micro Lens Array by 355nm UV Laser Irradiation)

  • 제순규;박강수;오재용;김광렬;박상후;고정상;신보성
    • 한국레이저가공학회지
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    • 제11권2호
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    • pp.26-32
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    • 2008
  • Micro lens array (MLA) is widely used in information technology (IT) industry fields, for examples such as a projection display, an optical power regulator, a micro mass spectrometer and for medical appliances. Recently, MLA have been fabricated and developed by using a reflow method, micro etching, electroplating, micromachining and laser local heating. Laser local thermal-expansion (LLTE) technology demonstrates the formation of microdots on the surface of polymer substrate, in this paper. We have also investigated the new direct fabrication method of placing the MLA on the surface of a SU-8 photoresist layer. We have obtained the 3D shape of the micro lens processed by UV laser irradiation and have experimentally verified the optimal process conditions.

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엑시머 레이저를 이용한 PMMA와 PET의 가공 (Excimer laser induced ablation of PMMA and PET)

  • 신동식;이제훈;서정;김도훈
    • 한국레이저가공학회지
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    • 제6권1호
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    • pp.33-40
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    • 2003
  • The ablative decomposition mechanism of PMMA(polymethyl methacrylate) and PET(polyethylene terephthalate) with KrF excimer laser(λ : 248nm, pulse duration: 5㎱) is investigated. The UV/Vis spectrometer analysis showed that PMMA is a weak absorber and PET is a strong absorber at the wavelength of 248nm. The results(surface debris, melt, etch depth, etching shape) from drilling and direct writing experiments imply that ablation mechanism of PMMA is dominated by photothermal process, while that of PET is dominated by photochemical process.

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UV 레이저에 의한 블라인드 비아홀 가공 (Blind via Hole manufacturing technology using UV Laser)

  • 장정원;김재구;신보성;장원석;황경현
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.160-163
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    • 2002
  • Micro via hole Fabrication is studied by means of minimizing method to circuit size as many electric products developed to portable and minimize. Most of currently micro via hole fabrication using laser is that fabricate insulator layer using CO2 Laser after Cu layer by etching, or fabricate insulator layer using IR after trepanning Cu by UV. In this paper, it was performed that a metal layer and insulator layer were worked upon only one UV laser, and increase to processing speed by experiment.

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이중화된 패턴을 참조하는 평면 변위 측정 방법 (Measuring Method of Planar Displacement Referring to The Double Linear Patterns)

  • 박성준;정광석
    • 한국산학기술학회논문지
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    • 제16권7호
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    • pp.4405-4410
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    • 2015
  • 두 개의 1차원 주기 패턴을 수직으로 중첩시켜 상하층 패턴으로부터 이축 변위 정보를 각각 디코딩할 수 있는 방법을 제안한다. 투명한 상층 패턴 판별은 굴절률차에 기인한 레이저 빔의 디플렉션 검출을 통해 이뤄지고 하층 패턴 판별은 수광 전압 차의 검출를 통해 이뤄진다. 빌드 업 필름 재질의 상층 패턴은 UV 레이저 가공에 의해 미세가공되고 그리고 알루미늄 하층 패턴은 초정밀 머시닝에 의한 트렌치 가공과 불투명 소재 증착 그리고 폴리싱 과정을 통해 제작된다. 10마이크로미터 간격으로 제작된 샘플 패턴과 이를 인코딩할 수 있는 전용 광학계에 의한 변위 측정 방법은 대면적 스테이지에 장착되어 레이저 간섭계를 이용한 측정데이터와 비교하여 검증된다.

빌드업 필름의 선폭 6㎛급 패턴 가공을 위한 직접식 UV 레이저 프로젝션 애블레이션 (Direct UV laser projection ablation to engrave 6㎛-wide patterns in a buildup film)

  • 손현기;박종식;정수정;신동식;최지연
    • 한국레이저가공학회지
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    • 제17권3호
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    • pp.19-23
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    • 2014
  • To directly engrave circuit-line patterns as wide as $6{\mu}m$ in a buildup film to be used as an IC substrate, we applied a projection ablation technique in which an 8 inch dielectric ($ZrO_2/SiO_2$) mask, a DPSS 355nm laser instead of an excimer laser, a ${\pi}$-shaper and a galvo scanner are used. With the ${\pi}$-shaper and a square aperture, the Gaussian beam from the laser is shaped into a square flap-top beam. The galvo scanner before the $f-{\theta}$ lens moves the flat-top beam ($115{\mu}m{\times}105{\mu}m$) across the 8 inch dielectric mask whose patterned area is $120mm{\times}120mm$. Based on the results of the previous research by the authors, the projection ratio was set at 3:1. Experiments showed that the average width and depth of the engraved patterns are $5.41{\mu}m$ and $7.30{\mu}m$, respectively.

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355nm UV 레이저를 이용한 구리 박판 가공 시 어블레이션에 관한 연구 (A Study on Laser Ablation of Copper Thin Foil by 355nm UV Laser Processing)

  • 오재용;신보성
    • 한국정밀공학회지
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    • 제24권2호
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    • pp.134-139
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    • 2007
  • Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.