• Restorative Dentistry and Endodontics
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• v.40 no.1
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• pp.30-36
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• 2015

Objectives: This study was performed to determine whether the combined use of one-bottle self-etch adhesives and composite resins from same manufacturers have better bond strengths than combinations of adhesive and resins from different manufacturers. Materials and Methods: 25 experimental micro-shear bond test groups were made from combinations of five dentin adhesives and five composite resins with extracted human molars stored in saline for 24 hr. Testing was performed using the wire-loop method and a universal testing machine. Bond strength data was statistically analyzed using two way analysis of variance (ANOVA) and Tukey's post hoc test. Results: Two way ANOVA revealed significant differences for the factors of dentin adhesives and composite resins, and significant interaction effect (p < 0.001). All combinations with Xeno V (Dentsply De Trey) and Clearfil $S^3$ Bond (Kuraray Dental) adhesives showed no significant differences in micro-shear bond strength, but other adhesives showed significant differences depending on the composite resin (p < 0.05). Contrary to the other adhesives, Xeno V and BondForce (Tokuyama Dental) had higher bond strengths with the same manufacturer's composite resin than other manufacturer's composite resin. Conclusions: Not all combinations of adhesive and composite resin by same manufacturers failed to show significantly higher bond strengths than mixed manufacturer combinations.

• Journal of the korean academy of Pediatric Dentistry
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• v.44 no.1
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• pp.72-81
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• 2017

The aim of this study was to evaluate the effectiveness of artificial saliva contamination and decontamination procedures at different stages of a bonding procedure on the microtensile bond strength (MTBS) of two one-step self-etch adhesives and a two-step total-etch adhesive to dentin of primary teeth. Forty-two extracted sound primary molars were randomly divided into three groups depending on three adhesives, Scotchbond Universal Adhesive (SBU), All-Bond Universal (ABU) and Prime & Bond NT (PNT). For each adhesive, the teeth were allocated into seven groups. Except for control group, group 1, the groups were contaminated with artificial saliva at three different stages: the groups 2 and 3 - before adhesive application; the groups 4 and 5 - before adhesive polymerization; the groups 6 and 7 - after adhesive polymerization. Decontaminating procedures were rinsing, air-drying (group 2, 4, 6) and air-drying (group 3, 5, 7). The specimens were restored with composite resin (Filtek, Z350) and microtensile bond strength was measured. The data was analyzed with one-way ANOVA and Tukey HSD test (p < 0.05). In the control group, using PNT resulted in significantly higher bond strength than when ABU and SBU were used (p < 0.001). For three adhesives, the groups 2, 4 and 6 had greater bond strength than the groups 3, 5 and 7. Also, when the artificial saliva was contaminated before adhesive polymerization (group 4, 5), it showed a significantly lower bond strength. Generally the two-step total-etch adhesive generated a higher bond strength than the one-step self-etch adhesive. Artificial saliva contamination before adhesive polymerization led to a drastic decrease in bond strength, and rinsing with water followed by air-drying could not recover the bond strength.

• Korean Journal of Materials Research
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• v.9 no.1
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• pp.86-91
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• 1999

We have fabricated high-$\textrm{T}_c$ superconducting $\textrm{YBa}_{2}\textrm{Cu}_{3}\textrm{O}_{7-x}$(YBCO) grain boundary junctions at a step-edge on (001) $\textrm{SrTiO}_3$(STO) substrates. A diamond-like carbon (DLC) film grown by plasma enhanced chemical vapor deposition were used as an ion milling mask to make steps on the STO (100) single crystal and was removed by an oxygen reactive ion etch process. The c-axis oriented YBCO and TO thin films were deposited epitaxially on the STO substrate with a step-edge by pulsed laser deposition. The grain boundary junctions were formed at the top and the bottom of the step. The junctions worked at temperatures above 77 K, and had I\ulcornerR\ulcorner products of 7.5mV at 16K and 0.3 mV at 77K, respectively. The I-V characteristics of these junctions showed the shape of the two noisy resistively shunted junction model.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.12
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• pp.1805-1810
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• 2010

We present a simple, cost-effective, and fast fabrication process for three-dimensional (3D) microstructures; this process is based on multi-step electrochemical etching of metal foils which facilitates the mass production of 3D microstructures. Compared to electroplating, this process maintains uniform and well-controlled material properties of the microstructure. In the experimental study, we perform single-step electrochemical etching of aluminum foils for the fabrication of 2D cantilever arrays. In the single-step etching, the depth etch rate and bias etch rate are measured as $1.50{\pm}0.10 {\mu}m/min$ and $0.77{\pm}0.03 {\mu}m/min$, respectively. Using the results of single-step etching, we perform two-step electrochemical etching for 3D microstructures with probe tips on cantilevers. The errors in height and lateral fabrication in the case of the fabricated structures are $15.5{\pm}5.8% $ and $3.3{\pm}0.9%$, respectively; the surface roughness is $37.4{\pm}9.6nm$.

• The Journal of the Korean dental association
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• v.53 no.12
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• pp.958-966
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• 2015

Objective: Sodium hypochlorite (NaOCl) decreases the bond strength of resin composite. The purpose of this study was to compare the effect of antioxidant and superficial dentin surface removal on the microtensile bond strength of NaOCl-treated dentin. Materials and Methods: Twenty non-carious human third molars were used in this study. The dentin surfaces were treated with 5.25% NaOCl for 10 min, followed either by treatment with 10% ascorbic acid or superficial dentin surface removal. Two-step self-etch adhesive and resin composite were used for restoration. The bonded specimens were subjected to the microtensile bond strength test. Statistical analysis was performed using one-way analysis of variance (ANOVA) and Tukey's test (p < 0.05). Results: The bond strength after removal of the superficial dentin surface following NaOCl irrigation was similar to that in the control group. The group treated with 10% ascorbic acid demonstrated significantly higher bond strength than the other groups. Conclusion: NaOCl irrigation-induced reduction in dentin bond strength could be recovered by either treatment with 10% ascorbic acid or simple removal of the superficial dentin surface.

• Journal of the Korean Vacuum Society
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• v.6 no.2
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• pp.103-108
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• 1997

Silicon field emitter arrays (FEAs) have been fabricated by a novel method employing a two-step tip etch and a spin-on-glass (SOG) etch-back process using double layered thermal/tetraethylortho-silicate (TEOS) oxides as a gate dielectric. A partial etching was performed by coating a low viscous photo resist and $O_2$ plasma ashing on order to form the double layered gate dielectric. A small gate aperture with low gate leakage current was obtained by the novel process. The hight and the end radius of the fabricated emitter was about 1.1 $\mu\textrm{m}$ and less than 100$\AA$, respectively. The anode emission current from a 256 tips array was turned-on at a gate voltage of 40 V. Also, the gate current was less than 0.1% of the anode current.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.2
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• pp.60-69
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• 1998

Polysilicon surface mdoification tecnique is developed to reduce the sticking of microstructures fabricated by micromachining. Modified anti-sticking grain holes are simply formed by two-step dry eth without additional photolithography nor deposition of thin films. Both process-induced sticking and in-use sticking are successfully reduced more than two times by adopting grain holed polysilicon substrate. A sticking model for cantilever beam is derived. This model includes bending moment stems from stress gradient along the thickness directionof structural polysilicon. Because the surface tension of rinse liquid and the surface energy of the solids to be stuk tend to decrease in recently developed anti-sticking techniques, the effect of stress gradient will play an important role to analyze the sticking phenomena. Effect of the temperature during post-release rinse and dry is modelled and verified experimentally. Based on developed anti-sticking polysilicon structure and the sticking model, sticking of microstructure, fabricated by simple wet process including sacrificial layer etch and rinse with deionized water without special equimpment for post-release rinse and dry was alleviated more than 3.5 times.

• Restorative Dentistry and Endodontics
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• v.23 no.1
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• pp.468-476
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• 1998

The purpose of this study was to observe the morphologic change of dentinal surface, adhesion in interface between dentin and bonding agents, and penetration pattern of resin tags into dentinal tubles according to bonding procedure of ONE-STEP universal adhesive system. Ten extracted human molars were mounted in dental stone and sectioned to expose mid-coronal occlusal dentin and again sectioned tooth crown apically. Specimens were randomly assigned to three groups for dentin conditioning with 32% phoshoric acid, two coats of bonding agents after dentin conditioning, and bond of composite resin. The surfaces of dentin were treated with etch ant and applied bonding agent, and bonded composite resin according to the directions of manufacturer. Specimens which were boned composite were sectioned longitudinally for observing interfaces between resin and dentin. Two of specimens which were sectioned longitudinally were immersed in 6 N HCL for 30 seconds and 1% NaOCL for 12 hours to partially demineralize and deproteinize the dentin substrate. Each specimen was mounted on a brass stub, sputter-coated with gold and observed under SEM. The result were as follows : 1. On the dentinal surface which was conditioned with 32% phosphoric acid. the smear layer was completely removed. orifices of dentinal tubules were opened 3-$5{\mu}m$ wide. and dentinal surface was irregular. 2. On the dentinal surface which was applied ONE-STEP. bonding agent. resin particles were observed on the orifices of dentinal tubules and intertubular dentin. 3. There were close adaptation between dentin and resin and were the pattern which composite invaded into dentin. 4. 1-$3{\mu}m$-wide hybrid layer was visible in the interface between dentin and resin. 5. Long and funnel shaped resin tags were observed in demineralized specimens. and the surfaces of tags were rough.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1994-1996
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• 1996

This paper presents the fabrication and testing of a polysilicon piezoresistive accelerometer with p+ silicon diaphragm by simple process such as two step photolithography for the RIE process to form the cantilevers and a deep anisotropic etch process for the complete fabrication of the accelerometer. The fabricated accelerometer consists of a seismic mass and four cantilevers on which polysilicon piezoresistors are formed. The measurement of the output signal from the bridge circuit of the fabricated accelerometer is carried out with the HP 3582A spectrum analyzer. The analysis of the experimental result is showed in terms of the sensitivity and the resonant frequency. At atmospheric condition, the measurement values of the sensitivity and the resonant frequency are $11\;{\mu}V/Vg$ and 475 Hz, respectively.

• Journal of Dental Rehabilitation and Applied Science
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• v.27 no.2
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• pp.161-174
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• 2011

The purpose of this study was to evaluate the effect of ethanol addition on efficacy of two-step total-etch adhesive under over-wet condition by measurement of remaining volatile part (RVP), microtensile bond strength (${\mu}TBS$), and degree of conversion (DC). Two-step total-etch adhesive, Optibond Solo Plus (Kerr, Orange, USA), was used. Experimental groups were divided into 8 groups: Group 1 (only 10 ${\mu}l$ adhesive), Group 2 (mixture of 3 ${\mu}l$ distilled water and 10 ${\mu}l$ adhesive), From Group 3 to Group 8 (mixture of 3 ${\mu}l$ distilled water, 10 ${\mu}l$ adhesive, and ethanol added in 1 ${\mu}l$ increment from 1 ${\mu}l$ to 6 ${\mu}l$). The mixtures were placed on slide glass and evaporated for 10 s, 30 s, and 60 s by air-drying. The weight of RVP was measured by precision weight. Same procedures were performed for ${\mu}TBS$ test and measurement of DC. The condition of mixed solution was observed under light microscope. For RVP weight, the weights of experimental groups except for group 1 decreased with the increase of air-drying time (p<0.05). The DC increased with the increase of air-drying time in only group 5 and 6 (p<0.05). The ${\mu}TBS$ increased with the increase of air-drying time in group only 5, 6, and 7 (p<0.05). The phase separation was examined and water blisters were diminished with the increase of air-drying time in group 5, 6, 7, and 8. Within the limits of this study, ethanol additionally applied to adhesive decreased RVP and increased DC and ${\mu}TBS$ under over-wet condition. It was shown that the addition of ethanol to two-step total-etch adhesive under over-wet condition would remove water and increase the efficacy of adhesive.