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Three-Dimensional Microstructures Fabricated by Multi-Step Electrochemical Aluminum-Foil Etching

알루미늄 박판의 다단 전해식각 공정을 이용한 3 차원 마이크로 구조물의 제작

  • Kim, Yoon-Ji (Dept. of Bio and Brain Engineering, KAIST) ;
  • Youn, Se-Chan (Dept. of Bio and Brain Engineering, KAIST) ;
  • Han, Won (Dept. of Bio and Brain Engineering, KAIST) ;
  • Cho, Young-Ho (Dept. of Bio and Brain Engineering, KAIST) ;
  • Park, Ho-Joon (Advanced Materials Laboratory, Central R&D Institute, Samsung Electromechanics) ;
  • Chang, Byeung-Gyu (Advanced Materials Laboratory, Central R&D Institute, Samsung Electromechanics) ;
  • Oh, Yong-Soo (Advanced Materials Laboratory, Central R&D Institute, Samsung Electromechanics)
  • 김윤지 (한국과학기술원, 바이오및뇌공학과) ;
  • 윤세찬 (한국과학기술원, 바이오및뇌공학과) ;
  • 한원 (한국과학기술원, 바이오및뇌공학과) ;
  • 조영호 (한국과학기술원, 바이오및뇌공학과) ;
  • 박호준 (삼성전기 중앙 R&D 연구소, AM 랩) ;
  • 장병규 (삼성전기 중앙 R&D 연구소, AM 랩) ;
  • 오용수 (삼성전기 중앙 R&D 연구소, AM 랩)
  • Received : 2010.03.03
  • Accepted : 2010.10.08
  • Published : 2010.12.01

Abstract

We present a simple, cost-effective, and fast fabrication process for three-dimensional (3D) microstructures; this process is based on multi-step electrochemical etching of metal foils which facilitates the mass production of 3D microstructures. Compared to electroplating, this process maintains uniform and well-controlled material properties of the microstructure. In the experimental study, we perform single-step electrochemical etching of aluminum foils for the fabrication of 2D cantilever arrays. In the single-step etching, the depth etch rate and bias etch rate are measured as $1.50{\pm}0.10 {\mu}m/min$ and $0.77{\pm}0.03 {\mu}m/min$, respectively. Using the results of single-step etching, we perform two-step electrochemical etching for 3D microstructures with probe tips on cantilevers. The errors in height and lateral fabrication in the case of the fabricated structures are $15.5{\pm}5.8% $ and $3.3{\pm}0.9%$, respectively; the surface roughness is $37.4{\pm}9.6nm$.

본 논문에서는 알루미늄 박판의 다단 전해식각을 공정을 이용한 3 차원 마이크로 구조물 제작방법을 제안한다. 본 공정은 기존 전해가공 공정들에 비해 3 차원 구조물의 대량생산이 용이하며, 기존 3 차원 마이크로 금속 구조물의 제작을 위한 다단 도금방법에 비해 간단하고, 경제적일 뿐만 아니라, 성형된 금속 박판을 이용하므로 구조물의 물성이 안정적이다. 본 논문에서는 단일 전해식각 공정을 통한 2 차원 외팔보 열과 다단 전해식각 공정을 통한 3 차원 마이크로 구조물의 제작을 수행하였다. 단일 전해식각 공정에서 평균 수직방향 식각률 $1.50{\pm}0.10 {\mu}m/min$ 와 평균 수평방향 식각률 $0.77{\pm}0.03 {\mu}m/min$을 얻었으며, 이를 이용한 3 차원 마이크로 구조물을 제작한 결과, 수직방향으로 $15.5{\pm}5.8 %$, 수평방향으로 $3.3{\pm}0.9 %$의 제작오차와 $37.4{\pm}9.6 nm$의 표면조도를 보였다.

Keywords

References

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