• JSTS:Journal of Semiconductor Technology and Science
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• 제14권3호
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• pp.263-267
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• 2014

Super junction trench gate power MOSFETs have been receiving attention in terms of the trade-off between breakdown voltage and on-resistance. The vertical structure of super junction trench gate power MOSFETs allows the on-resistance to be reduced compared with conventional Trench Gate Power MOSFETs. The heat release of devices is also decreased with the reduction of on-resistance. In this paper, Lattice Temperature of two devices, Trench Gate Power MOSFET and Super junction trench gate power MOSFET, are compared in several temperature circumstance with the same Breakdown Voltage and Cell-pitch. The devices were designed by 100V Breakdown voltage and measured from 250K Lattice Temperature. We have tried to investigate how much temperature rise in the same condition. According as temperature gap between top of devices and bottom of devices, Super junction trench gate power MOSFET has a tendency to generate lower heat release than Trench Gate Power MOSFET. This means that Super junction trench gate power MOSFET is superior for wide-temperature range operation. When trench etching process is applied for making P-pillar region, trench angle factor is also important component. Depending on trench angle, characteristics of Super junction device are changed. In this paper, we focus temperature characteristic as changing trench angle factor. Consequently, Trench angle factor don't have a great effect on temperature change.

• 한국전기전자재료학회논문지
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• 제17권7호
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• pp.713-717
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• 2004

In this study, the etched trench properties including cross-sectional profile, surface roughness, and crystalline defects were investigated depending on the various silicon etching and additive gases, For the case of HBr$He-O_2SiF_4$ trench etching gas mixtures, the excellent trench profile and minimum defects in the silicon trench were achieved. Due to the residual oxide film grown by the additive oxygen gas, which acts as a protective layer during trench etching, the undercut and defects generation in the trench were suppressed. To improve the electrical characteristics of trench gate, the hydrogen annealing process after trench etching was also adopted. Through the hydrogen annealing, the trench corners might be rounded by the silicon atomic migration at the trench corners having high potential. The rounded trench corner can afford to reduce the gate electric field and grow a uniform gate oxide. As a result, dielectric strength and TDDB characteristics of the hydrogen annealed trench gate oxide were remarkably increased compared to the non-hydrogen annealed one.

• 한국광학회지
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• 제6권4호
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• pp.373-378
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• 1995

원통좌표계에서의 FD-BPM(finite difference-beam propagation method)을 이용하여 굽은 광도파로의 bending loss를 계산하였다. Bending loss를 최소화하기 위해 trench구조를 적용하였으며 다음의 세가지 측면에서 해석하였다. 1)trench구조가 없을때 곡률반경에 따른 bending loss, 2)폭과 위치가 일정한 trench구조가 있을때 곡률반경과 굴절율차에 따른 bending loss, 3)trench의 위치가 일정할 때 trench의 폭에 따른 bending loss를 계산하였다.

• 한국전기전자재료학회논문지
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• 제26권10호
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• pp.720-725
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• 2013

Power MOSFET operate voltage-driven devices, design to control the large power switching device for power supply, converter, motor control, etc. We have analyzed trench process, field limit ring process for fabrication of unified trench gate power MOSFET. And we have analyzed electrical characteristics of fabricated unified trench gate power MOSFET. The optimal trench process was based on SF6. After we carried out SEM measurement, we obtained superior trench gate and field limit ring process. And we compared electrical characteristics of planar and trench gate unified power MOSFET after completing device fabrication. As a result, the both of them was obtained 500 V breakdown voltage. However trench gate unified power MOSFET was shown improved Vth and on state voltage drop characteristics than planar gate unified power MOSFET.

• 한국지반공학회논문집
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• 제18권4호
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• pp.249-256
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• 2002

Slurry trench의 안정성은 안정액의 유압이 filter cake 막을 통하여 trench 벽에 전달됨으로서 확보될 수가 있다. 지반조건의 영향에 따른 slurry trench 공법에서 주변 공극수압의 변화를 수치해석(FEM)으로 추적하였다. 이러한 주변 공극수압의 변화 요인으로는 안정액의 밀도, filter cake의 상태, 토질조건, 시간, trench 심도, 주변지하수위로 조사되었으며, 가장 큰 영향력을 보인 요인으로는 토질조건과 filter cake 상태로 나타났다.

• 전기전자학회논문지
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• 제24권2호
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• pp.592-597
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• 2020

SiC는 Si에 비해서 Breakdown field가 10배 높고, Energy gap이 3배 높기 때문에 높은 Breakdown voltage를 갖는 우수한 전력 MOSFET을 제작할 수 있다. 하지만 낮은 Mobility로 인한 높은 On저항을 갖기 때문에 이를 낮추기 위해서 Trench MOSFET이 제안되었지만 동시에 BV가 감소한다는 문제점을 갖는다. 본 논문에서는 1200V급 Trench MOSFET 설계를 목적으로 하며, 이를 해결하기 위해서 BV와 Ron에 대한 중요한 변수인 Epi 깊이, Trench 깊이, Trench 깊이에서 Epi 깊이까지의 거리에 대한 Split을 진행하여 최대 전계, BV, Ron의 신뢰성 특성을 비교 분석하였다. Epi 깊이가 증가할수록, Trench 깊이가 감소할수록, Trench 깊이에서 Epi 깊이가 감소할수록 최대 전계 감소, BV 증가, Ron 증가를 확인하였다. 모든 결과는 Sentaurus TCAD를 통해 Simulation 되었다.

• 전기전자학회논문지
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• 제22권4호
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• pp.1234-1237
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• 2018

본 논문에서는 planar MOSFET 대비 on 저항 감소 및 스위칭 속도 개선의 장점이 있는 4H-SiC trench MOSFET응용을 위하여 trench MOSFET 중요 이슈 중 하나인 sub-trench의 개선연구를 수행하였다. sub-trench의 제거를 위하여 Ar reshape 공정을 수행하였고, 온도와 공정시간을 변화해가며 trench 형태의 변화를 관찰하였다. 그 결과 $1500^{\circ}C$, 20분 조건에서 가장 적절한 sub-trench 완화를 확인하였다. 또한 Ar reshape 공정 이후 건식/습식 산화공정을 진행하여 결정방향에 따른 산화막 두께변화에 대해 확인하였다.

• 복식
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• 제57권9호
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• pp.49-66
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• 2007

Trench coat derived from military uniforms was one of the classical fashion items and has been endeared as everyday outfits thanks to useful traits. Since 1990s classical design of trench coat began to be modified and many variant styles were appeared after 2000s. Trench coat designs after 2000s were appeared as tradition type that was stick to basic British classic style, variation type that was changed in details, colors, materials, and silhouettes, evolution type that was changed into new items, deconstruction type that was dissolved and open-structured. Modern trench coat expressed modern chic, elegance feminine, stylish casual, military and gangster images. The characteristics of trench coat as classic fashion were utility for everyday life style, excellent ability to express images, and strong visual effects of characteristic details. Trench coat was timeless as classic fashion, at the same time, changed into new fashion styles suitable for the sense of the times.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 하계종합학술대회 논문집
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• pp.911-913
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• 1999

Shallow Trench Isolation (STI) has become the most promising isolation scheme for ULSI applications. The stress of STI structure is one of several factors to degrade characteristics of a device. The stress contours or STI structure vary with the trench depth. Isolation characteristics of STI was analyzed as the depth of trench varied. And transistor characteristics was compared. Isolation punch-through voltage for n$^{＋}$ to pwell and p$^{＋}$ to nwell increased as trench depth increased. n$^{＋}$ to pwell leakage current had nothing to do with trench depth but n$^{＋}$ to pwell leakage current decreased as trench depth increased. In the case of transistor characteristics, short channel effect was independent on trench depth and inverse narrow width effect was greater for deeper trenches. Therefore in order to achieve stable device, it is important to minimize stress by optimizing trench depth.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권9호
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• pp.523-526
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• 2000

A dual gate trench emitter IGBT structure is proposed and studied numerically using the device simulator MEDICI. The on-state forward voltage drop latch-up current density turn-off time and breakdown voltage of the proposed structure are compared with those of the conventional DMOS-IGBT and trench gate IGBT structures. The proposed structure forms an additional channel and increases collector current level resulting in reduction of on -state forward voltage drop. In addition the trench emitter increases latch-up current density by 148% in comparison with that for the conventional DMOS-IGBT and by 83% compared with that for the trench gate IGBT without degradation in breakdown voltage when the half trench gate width(Tgw) and trench emitter depth(Ted) are fixed at $1.5\mum\; and\; 2\mum$, respectively