• 제목/요약/키워드: Transfer resistance

검색결과 1,286건 처리시간 0.026초

수평채널 밑면에 부착된 단일 발열모듈에서 채널높이의 변화에 따른 냉각특성 연구 (The Study about Cooling Effect of a Heated module in a Horizontal Channel with a Variation of Channel Height)

  • 이진호;유갑종;장준영;김병하
    • 설비공학논문집
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    • 제13권5호
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    • pp.348-355
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    • 2001
  • The coupled conduction and convection heat transfer from a protruding heated module in a horizontal channel with a variation of channel height is experimentally investigated. The input power to the module is 3, 7W and thermal resistance of module support is 0.06 , 1.03 and 158K/W. the Reynolds number ranged from 350 to 4500 corresponding to the inlet velocity(0.4~1.3 m/s) and channel height(11~35 mm). The results were obtained that the decrease of thermal resistance of module support reduces the module temperature by redistributing the heat flux and the overall thermal resistance of the module. In the study the effect of channel height is very significant in the adiabatic condition, but negligible in the conjugate condition. Finally, correlations for Nusselt number and $Q_B$/Q with a variation of Reynolds number were developed respectively.

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철근콘크리트 기둥과 철골보의 접합부 개발 및 지압성능에 관한 시험적 연구 (A Study on the Development and Test on Bearing Resistance of R/C Column-Steel Girder Connection)

  • 최광호;이세웅;김재순;김상식
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 1997년도 봄 학술발표회 논문집
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    • pp.515-520
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    • 1997
  • This research is aimed at the development of the composite beam-column connection system by which the steel beam can be connected to the R/C column with smooth stress transfer. As the first step of the structural performance tests of the system, bearing resistance test has been carried out for actual size specimen. From the test, the connection system has been proved to take good bonding and stress transfer to the surrounding concrete with negligible relative displacements.

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Flexural behaviour and capacity of composite panels of light gage steel and concrete

  • Shi, L.;Liu, Y.;Dawe, J.L.;Bischoff, P.
    • Steel and Composite Structures
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    • 제9권5호
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    • pp.397-418
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    • 2009
  • Eight panel specimens were tested in one-way bending to study the behaviour and capacity of composite slab joists consisting of cold-formed steel C-sections and concrete. Various shear transfer mechanisms were implemented on the C-section flange embedded in the concrete to provide the longitudinal shear resistance. Results showed that all specimens reached serviceability limit state while in elastic range and failure was ductile. Shear transfer achieved for all specimens ranged from 42 to 99% of a full transfer while specimens employed with shear transfer enhancements showed a greater percentage and therefore a higher strength compared with those relying only on surface bond to resist shear. The implementation of pre-drilled holes on the embedded flange of the steel C-section was shown to be most effective. The correlation study between the push-out and panel specimens indicated that the calculated moment capacity based on shear transfer resistance obtained from push-out tests was, on average, 10% lower than the experimental ultimate capacity of the panel specimen.

그래핀 원스텝 전사(Graphene One-Step Transfer) 공정 기반 다층 그래핀 잔여분말 제거 기술 연구 (A Study on Residual Powder Removing Technique of Multi-Layered Graphene Based on Graphene One-Step Transfer Process)

  • 우채영;조영수;홍순규;이형우
    • 한국분말재료학회지
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    • 제26권1호
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    • pp.11-15
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    • 2019
  • In this study, a method to remove residual powder on a multi-layered graphene and a new approach to transfer multi-layered graphene at once are studied. A graphene one-step transfer (GOST) method is conducted to minimize the residual powder comparison with a layer-by-layer transfer. Furthermore, a residual powder removing process is investigated to remove residual powder at the top of a multi-layered graphene. After residual powder is removed, the sheet resistance of graphene is decreased from 393 to 340 Ohm/sq in a four-layered graphene. In addition, transmittance slightly increases after residual powder is removed from the top of the multi-layered graphene. Optical and atomic-force microscopy images are used to analyze the graphene surface, and the Ra value is reduced from 5.2 to 3.7 nm following residual powder removal. Therefore, GOST and residual powder removal resolve the limited application of graphene electrodes due to residual powder.

ResNet-Based Simulations for a Heat-Transfer Model Involving an Imperfect Contact

  • Guangxing, Wang;Gwanghyun, Jo;Seong-Yoon, Shin
    • Journal of information and communication convergence engineering
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    • 제20권4호
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    • pp.303-308
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    • 2022
  • Simulating the heat transfer in a composite material is an important topic in material science. Difficulties arise from the fact that adjacent materials cannot match perfectly, resulting in discontinuity in the temperature variables. Although there have been several numerical methods for solving the heat-transfer problem in imperfect contact conditions, the methods known so far are complicated to implement, and the computational times are non-negligible. In this study, we developed a ResNet-type deep neural network for simulating a heat transfer model in a composite material. To train the neural network, we generated datasets by numerically solving the heat-transfer equations with Kapitza thermal resistance conditions. Because datasets involve various configurations of composite materials, our neural networks are robust to the shapes of material-material interfaces. Our algorithm can predict the thermal behavior in real time once the networks are trained. The performance of the proposed neural networks is documented, where the root mean square error (RMSE) and mean absolute error (MAE) are below 2.47E-6, and 7.00E-4, respectively.

pEA 9::Tn5-Mob에 의한 nif-plasmid pEA 9의 transfer 성질 (Transfer properties of nif-plasmid pEA 9 by pEA 9::Tn5-Mob)

  • 민병환;이호자
    • 미생물학회지
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    • 제26권3호
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    • pp.181-187
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    • 1988
  • Using a Tn5-Mob system, pEA9 was characterized as a self-transmissible plasmid carrying a kanamycin resistance marker. The self-transfer frequencies of pEA9 varied greatly depending on pH values. The transfer frequency was about $4\times 10^{-5}$ at pH 5, that was 10 times higher than one at pH 6.5. With a helper plasmid, transfer frequencies were increased about $10^{4}$ times than the frequencies obtained without it.

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환승 저항을 고려한 운행시간표 기반 대중교통 다중 경로 탐색 알고리즘 (A schedule-based Public Transit Routing Algorithm for Finding K-shortest Paths Considering Transfer Penalties)

  • 전인우;남현우;전철민
    • 한국ITS학회 논문지
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    • 제17권3호
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    • pp.72-86
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    • 2018
  • 운행시간표 기반 대중교통 경로 탐색 알고리즘은 운행계획에 따른 정류장별 출 도착 시각을 이용하여 최소 이동 시간이 소요되는 단일 경로를 산출한다. 다만, 경로 계산 과정에서 환승 저항, 대안 경로 선택 등의 추가 요소들을 반영하는데 한계가 있다. 본 연구는 환승 저항 및 다중 경로 탐색이 반영된 개선된 RAPTOR 알고리즘을 제안한다. 환승 저항은 환승 시점에 적용되며, 교통수단 유형을 구분하여 적용하였다. 본 연구에서는 수도권 대중교통 이용승객의 실제 이동 경로를 기준으로 개선 전 후의 알고리즘 결과를 분석하였다. 이를 통해 제시한 알고리즘이 승객의 다양한 경로 선택 기준을 반영한다는 것을 확인하였다.

기성말뚝의 지지력 거동해석과 시공관리방안 (Bearing Capacity and Control Method of Driven Piles)

  • 박영호;김경석
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 1999년도 봄 학술발표회 논문집
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    • pp.249-258
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    • 1999
  • Dynamic load and static load tests are performed on steel pipe piles and concrete piles at five construction sites in highway to compare the difference of load bearing mechanisms. At each site, one steel pile is instrumented with electric strain gages and dynamic tests are performed on the pile during installation. Damages of strain gages due to the installation are checked and static test is performed upon the same pile after two or seven days as well. It shows that load transfer from side friction to base resistance behaves somewhat differently according to the results of load-settlement analysis obtained from PDA and static load test. Initial elastic stage of load settlement curves of two load tests is almost similar. But after the yielding point, dynamic resistance of pile behaves more stiffer than static resistance, thus, dynamic load test result might overestimate the real pile capacity compared with static result. Analysis of gage readings shows that unit skin friction increases exponentially with depth. The skin friction is mobilized at the 1∼2m above the pile tip and contributes to the considerable side resistance. Comparison of side and base resistances between the measured value and the calculated value by Meyerhof's bearing capacity equation using SPT N value shows that the calculated base resistance is higher than the measured. Therefore, contribution of side resistance to total capacity shouldn't be ignored or underestimated. Finally, based upon the overall test results, a construction control procedure is suggested.

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비대칭 슬림플로어 합성보의 내화성능 산정에 관한 해석적 방법 연구 (A Study on the Analytical Method for Fire Resistance Calculation of Asymmetric Slimfloor Beam)

  • 박수영;박원섭;김흥열;홍갑표
    • 한국화재소방학회논문지
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    • 제24권2호
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    • pp.31-37
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    • 2010
  • 비대칭 슬림플로어 합성보(Asymmetric Slimfloor Beam, 이하 ASB)는 비대칭 형강의 일부를 콘크리트 슬래브에 삽입한 합성보로서, 유럽에서 개발되었다. 근래 국내에서도 건축물의 층고저감, 물량감소, 내화 성능 증대 등의 목적으로 ASB의 연구가 진행되고 있다. 본 연구에서는 실험을 통하여 ASB의 내화성능을 확인하고, 열전달해석을 통하여 내화성능 시간에서의 모멘트 내력(Moment capacity)을 산정하였다. 그 결과를 바탕으로 방화석고보드와 ASB로 구성된 3시간 내화구조를 선정하고, 내화 성능을 검토하였다.

Effects of Thermal Contact Resistance on Film Growth Rate in a Horizontal MOCVD Reactor

  • Im Ik-Tae;Choi Nag Jung;Sugiyama Masakazu;Nakano Yoshiyaki;Shimogaki Yukihiro;Kim Byoung Ho;Kim Kwang-Sun
    • Journal of Mechanical Science and Technology
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    • 제19권6호
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    • pp.1338-1346
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    • 2005
  • Effects of thermal contact resistance between heater and susceptor, susceptor and graphite board in a MOCVD reactor on temperature distribution and film growth rate were analyzed. One-dimensional thermal resistance model considering thermal contact resistance and heat transfer area was made up at first to find the temperature drop at the surface of graphite board. This one-dimensional model predicted the temperature drop of 18K at the board surface. Temperature distribution of a reactor wall from the three-dimensional computational fluid dynamics analysis including the gap at the wafer position showed the temperature drop of 20K. Film growth rates of InP and GaAs were predicted using computational fluid dynamics technique with chemical reaction model. Temperature distribution from the three-dimensional heat transfer calculation was used as a thermal boundary condition to the film growth rate simulations. Temperature drop due to the thermal contact resistance affected to the GaAs film growth a little but not to the InP film growth.