In this paper has proposed to the recognition of the disease on medical images using neural network. The neural network is constructed as three-layers of the input-layer, the hidden-layer and the output-layer. The training method applied for the recognition of disease region is adaptive error back-propagation. The low-frequency region analyzed by DWT are expressed by matrix. The coefficient-values of the characteristic polynomial applied are n+1. The normalized maximum value +1 and minimum value -1 in the range of tangent-sigmoid transfer function are applied to be use as the input vector of the neural network. To prove the validity of the proposed methods used in the experiment with a simulation experiment, the input medical image recognition rate the evaluation of areas of disease. As a result of the experiment, the characteristic polynomial coefficient of low-frequency area matrix, conversed to 4 level DWT, was proved to be optimum to be applied to the feature parameter. As for the number of training, it was marked fewest in 0.01 of learning coefficient and 0.95 of momentum, when the adaptive error back-propagation was learned by inputting standardized feature parameter into organized neural network. As to the training result when the learning coefficient was 0.01, and momentum was 0.95, it was 100% recognized in fifty-five times of the stomach image, fifty-five times of the chest image, forty-six times of the CT image, fifty-five times of ultrasonogram, and one hundred fifty-seven times of angiogram.
Proceedings of the Korean Vacuum Society Conference
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2012.02a
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pp.431-432
/
2012
In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.
Kim, K.H.;Choi, K.H.;Kum, J.S.;Kim, B.C.;Kim, J.R.
Solar Energy
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v.19
no.4
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pp.45-53
/
1999
This report Introduces a total heat exchanger in a solar air-conditioning system using Lithium Chloride(LiCl) solution. The hot and humid outside air is cooled and dehumidified by LiCl solution that is sprayed on the packed layer of the total heat exchanger. LiCl solution once diluted is concentrated again in a regenerator using solar energy. Three types as the packed materials were used in this experiment and the dehumidification performance was evaluated by the value of $k_xa(kg/h{\cdot}m^3{\cdot}{\Delta}x)$, overall mass transfer coefficient based on a humidity ratio potential difference, the influence of inlet LiCl solution flow rate, air flow rate, packed layer height on $k_xa$ was investigated. It was found that air flow rate, LiCl solution flow rate, packed layer height for all types had a great influnce on the value of $k_xa$.
Kim, Do-Hwan;Im, Jung-Gyu;Lee, Sang-Shin;Ahn, Seh-Won;Lee, Ki-Dong
Korean Journal of Optics and Photonics
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v.16
no.4
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pp.384-391
/
2005
A polymer optical microring resonator, which is laterally coupled to a straight bus waveguide, has been proposed and demonstrated using a nanoimprint technique. The propagation loss of the ring waveguide and the optical power coupling between the ring and bus waveguides was calculated by using a beam propagation method, then the dependence of the device performance on them was investigated using a transfer matrix method. We have especially introduced an imprint stamp incorporating a smoothing buffer layer made of a silicon nitride thin film. This layer played an efficient role in improving the sidewall roughness of the waveguide pattern engraved on the stamp and thus reducing the scattering loss. As a result the overall Q factor of the resonator was greatly increased. Also it reduced the gap between the ring and bus waveguides effectively to enhance the coupling between them, without relying on the direct writing method based on an e-beam writer. As for the achieved device performance at the wavelength of 1550 nm, the quality factor, the extinction ratio, and the free spectral range were ~103800, ~11 dB, and 1.16 m, respectively.
To develop a membrane electrode assembly (MEA) with lower Pt loading and higher performance in proton exchange membrane fuel cells (PEMFCs), it is an important research issue to understand interfacial structure of Pt/C catalyst and ionomer and design the catalyst layer structure. In this study, we prepared short-side-chain Nafion-based ionomer dispersion using propylene glycol (PG) as a solvent instead of water which is commonly used as a solvent for commercially available ionomers. Cathode catalyst layers with different ionomer content from 20 to 35 wt% were prepared using the ionomer dispersion for the fabrication of four different MEAs, and their fuel cell performance was evaluated. As the ionomer content increased to 35 wt%, the performance of the prepared MEAs increased proportionally, unlike the commercially available water-based ionomer, which exhibited an optimum at about 25 wt%. Small size micelles and slow evaporation of PG in the ionomer dispersion were effective in proton transfer by inducing the formation of a uniformly structured catalyst layer, but the low oxygen permeability problem of the PG-based ionomer film should be resolved to improve the MEA performance.
The pristine fluorine-doped $SnO_2$ (abbreviated as FTO) inverse opal (IO) was developed using a 410 nm polystyrene bead template. The nanolayered copper tungsten oxide ($CuWO_4$) was decorated on the FTO IO film using a facile electrochemical deposition, subsequently followed by annealing at $500^{\circ}C$ for 90 min. The morphologies, crystalline structure, optical properties and photoelectrochemical characteristics of the FTO and $CuWO_4$-decorated FTO (briefly denoted as $FTO/CuWO_4$) IO film were investigated by field emission scanning electron microscopy, X-ray diffraction, UV-vis spectroscopy and electrochemical impedance spectroscopy, showing FTO IO in the hexagonally closed-pack arrangement with a pore diameter and wall thickness of about 300 nm and 20 nm, respectively. Above this film, the $CuWO_4$ was electrodeposited by controlling the cycling number in cyclic voltammetry, suggesting that the $CuWO_4$ formed during 4 cycles (abbreviated as $CuWO_4$(4 cycles)) on FTO IO film exhibited partial distribution of $CuWO_4$ nanoparticles. Additional distribution of $CuWO_4$ nanoparticles was observed in the case of $FTO/CuWO_4$(8 cycles) IO film. The $CuWO_4$ layer exhibits triclinic structure with an indirect band gap of approximately 2.5 eV and shows the enhanced visible light absorption. The photoelectrochemical (PEC) behavior was evaluated in the 0.5 M $Na_2SO_4$ solution under solar illumination, suggesting that the $FTO/CuWO_4$(4 cycles) IO films exhibit a photocurrent density ($J_{sc}$) of $0.42mA/cm^2$ at 1.23 V vs. reversible hydrogen electrode (RHE, denoted as $V_{RHE}$), while the FTO IO and $FTO/CuWO_4$(8 cycles) IO films exhibited a $J_{sc}$ of 0.14 and $0.24mA/cm^2$ at $1.23V_{RHE}$, respectively. This difference can be explained by the increased visible light absorption by the $CuWO_4$ layer and the favorable charge separation/transfer event in the cascading band alignment between FTO and $CuWO_4$ layer, enhancing the overall PEC performance.
The external weather conditions including temperature and wind speed in the Saemangeum reclaimed land is different from that of the inland, affecting the internal environment of the greenhouse. Therefore, it is important to select an appropriate covering material considering the insulation effect according to the type and characteristics of the covering material considering the weather condition in the Saemangeum reclaimed land. A hexahedral insulation chamber was designed to evaluate the insulation efficiency of each glass-clad material in the outside weather condition in reclaimed land. In order to evaluate the insulation effect of each covering material, a radiator was installed and real-time power consumption was monitored. 16-mm PC (polycarbonate), 16-mm PMMA (polymethyl methacrylate), 4-mm greenhouse glass, and 16-mm double-layered glass were used as the covering materials of the chamber. In order to understand the effect of the external wind directions, the windward and downwind insulation properties were evaluated. As a result of comparing the thermal insulation effect of each greenhouse cover material to single-layer glass, the thermal insulation effect of double-layer glass was 16.9% higher, while PMMA and PC were 62.5% and 131.2% higher respectively. On average the wind speed on the windward side was 53.1% higher than that on the lee-wind side, and the temperature difference between the inside and outside of the chamber at the wind ward side was found to be 52.0% larger than that on the lee ward side. During the experiment period, the overall heating operation time for PC was 39.2% lower compared to other insulation materials. Showing highest energy efficiency, and compared to PC, single-layer glass power consumption was 37.4% higher.
Recently, the intensive rainstorm possibly induced by global warming plays a key role on the instability of railway adjacent slopes. The instability of slopes results as covering and loss of railway lines induced by slided soil mass. According to the site investigation on the failed slopes triggered by rainfall, low types of slope failure were observed: shallow, intermediate, gully erosion, and soil-rock interface failures. The observation reveals the different characteristics of slope failure depending on the thickness of soil layer, morphological features of slope, etc. Based upon the observations, flume tests were conducted to analyze the sliding mechanism of each failure. The variables of flume test are soil layer thickness, rainfall intensity, and morphology of slope under the constant condition of the percentage of fine, initial soil moisture content, slope angle and compaction energy. Test results show that shallow failure was mostly observed from the surface of the slope and caused by the soil erosion; in addition, compared to the other types of failure, the occurrence of initial erosion is late, however, the development of erosion is fast. In gully erosion failure, the collected water from the water catchment area helps erosion of the upper soil layer and transfer of residual corestone, which impedes the erosion process once the upper soil layers are eroded and corestone are exposed. The soil-rock interface failure shows the most fast initial erosion process among the failure types. Interestingly, the common feature observed from the different types of failure was the occurrence of the initial deformation near the toe of slopes which implies the existence of surbsurface flow along the downslope direction.
The multi-layer insulating curtains used in the experiment was produced in six combinations using non-woven fabric containing aerogel and compared and analyzed by measuring heat flux and heat perfusion rates due to weight, thickness and temperature changes. Using silica aerogel, which have recently been noted as new material insulation, this study tries to produce a new combination of multi-layer insulating curtains that can complement the shortcomings of the multi-layer insulating curtains currently in use and maintain and improve its warmth, and analyze the thermal properties. The heat flux means the amount of heat passing per unit time per unit area, and the higher the value, the more heat passing through the multi-layer insulating curtain, and it can be judged that the heat retention is low. The weight and thickness of multi-layer insulation curtains were found to be highly correlated with thermal insulation. In particular, insulation curtains combined with aerogel meltblown non-woven fabric had relatively higher thermal insulation than insulation curtains with the same number of insulation materials. However, the aerogel meltblown non-woven fabric is weak in light resistance and durability, and there is a problem that the production process and aerogel are scattering. In order to solve this problems, the combination of expanded aerogel non-woven fabric and hollow fiber non-woven fabric, which are relatively simple manufacturing processes and excellent warmth, are suitable for use in real farms.
Kwon, Soon Jin;Song, Hoon Sub;Im, Hyo Been;Nam, Jung Eun;Kang, Jin Kyu;Hwang, Taek Sung;Yi, Kwang Bok
Clean Technology
/
v.20
no.3
/
pp.306-313
/
2014
Nanoporous $TiO_2$ films are commonly used as working electrodes in dye-sensitized solar cells (DSSCs). So far, there have been attempts to synthesize films with various $TiO_2$ nanostructures to increase the power-conversion efficiency. In this work, vertically aligned rutile $TiO_2$ nanorods were grown on fluorinated tin oxide (FTO) glass by hydrothermal synthesis, followed by deposition of an anatase $TiO_2$ film. This new method of anatase $TiO_2$ growth avoided the use of a seed layer that is usually required in hydrothermal synthesis of $TiO_2$ electrodes. The dense anatase $TiO_2$ layer was designed to behave as the electron-generating layer, while the less dense rutile nanorods acted as electron-transfer pathwaysto the FTO glass. In order to facilitate the electron transfer, the rutile phase nanorods were treated with a $TiCl_4$ solution so that the nanorods were coated with the anatase $TiO_2$ film after heat treatment. Compared to the electrode consisting of only rutile $TiO_2$, the power-conversion efficiency of the rutile-anatase hybrid $TiO_2$ electrode was found to be much higher. The total thickness of the rutile-anatase hybrid $TiO_2$ structures were around $4.5-5.0{\mu}m$, and the highest power efficiency of the cell assembled with the structured $TiO_2$ electrode was around 3.94%.
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