• 한국정보디스플레이학회:학술대회논문집
• /
• 2003.07a
• /
• pp.1038-1041
• /
• 2003

In the paper, we investigated silicon surface microstructures formed by reactive ion etching in hollow cathode system. Wet anisotropic chemical etching technique use to form random pyramidal structure on <100> silicon wafers usually is not effective in texturing of low-cost multicrystalline silicon wafers because of random orientation nature, but High density hollow cathode plasma system illustrates high deposition rate, better film crystal structure, improved etching characteristics. The etched silicon surface is covered by columnar microstructures with diameters form 50 to 100nm and depth of about 500nm. We used $SF_{6}$ and $O_{2}$ gases in HCP dry etch process. This paper demonstrates very high plasma density of $2{\times}10^{12}$ $cm^{-3}$ at a discharge current of 20 mA. Silicon etch rate of 1.3 ${\mu}s/min$. was achieved with $SF_{6}/O_{2}$ plasma conditions of total gas pressure=50 mTorr, gas flow rate=40 sccm, and rf power=200 W. Our experimental results can be used in various display systems such as thin film growth and etching for TFT-LCDs, emitter tip formations for FEDs, and bright plasma discharge for PDP applications. In this paper we directed our study to the silicon etching properties such as high etching rate, large area uniformity, low power with the high density plasma.

• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.36D no.5
• /
• pp.29-35
• /
• 1999

Inductively coupled plsama etching of platinum thin film was studied using $O_2$ addition to $Cl_2$/Ar gas plasma. In this study, Pt etching mechanism was investigated with Ar/$Cl_2$ /$O_2$ gas plasma by using XPS and QMS. Ion current density was measured with Ar/$Cl_2$ /$O_2$ gas plasma by using single Langmuir probe. It was confirmed by using QMS and single Langmuir probe that Cl and Ar species rapidly decreased and ion current density was also decreased with increasing $O_2$ gas ratios. These results implied that the decrease of Pt etch rate is due to the decrease of reactive species ans ion current density with increasing $O_2$ gas mixing ratios. A maximum etch rate of 150nm/min and the oxide selectivity of 2.5 were obtained at Ar/$Cl_2$ /$O_2$ flow rate of 50 seem, RF power of 600 W, dc bias voltage of 125 V, and the total pressure of 10 mTorr.

• Journal of the korean academy of Pediatric Dentistry
• /
• v.45 no.4
• /
• pp.445-454
• /
• 2018

The aim of this study was to measure the shear bond strength (SBS) of different adhesive systems to calcium silicate-based materials (Biodentine and RetroMTA). Eighty cylindrical acrylic blocks, with a hole (5.0 mm diameter, 2.0 mm height) in each, were prepared. The holes were filled with Biodentine (BD) and RetroMTA (RMTA), and the specimens were divided into 2 groups. Each group was classified into 4 subgroups: Clearfil$^{TM}$ SE (CSE) ; AQ bond (AQ) ; All bond universal Self-etch (ABU-SE) ; and All bond universal Total-etch (ABU-TE). After the application of different adhesive systems, composite resin (Z350) was applied over BD and RMTA. The SBS was measured using a universal testing machine, and the data were compared using the Kruskal-Wallis test and the Mann-Whitney test. The highest and lowest values of SBS were observed for BD-ABU-SE and RMTA-AQ, respectively. No significant differences were found in the SBS between ABU-TE and ABU-SE and between ABU-TE and CSE to BD and RMTA. According to the data, BD showed a higher SBS than did RMTA when BD and RMTA are compared in the same adhesive agents. Further, among all groups, composite resin with ABU-SE showed better bond strength to BD and RMTA.

• Journal of the korean academy of Pediatric Dentistry
• /
• v.44 no.1
• /
• pp.72-81
• /
• 2017

The aim of this study was to evaluate the effectiveness of artificial saliva contamination and decontamination procedures at different stages of a bonding procedure on the microtensile bond strength (MTBS) of two one-step self-etch adhesives and a two-step total-etch adhesive to dentin of primary teeth. Forty-two extracted sound primary molars were randomly divided into three groups depending on three adhesives, Scotchbond Universal Adhesive (SBU), All-Bond Universal (ABU) and Prime & Bond NT (PNT). For each adhesive, the teeth were allocated into seven groups. Except for control group, group 1, the groups were contaminated with artificial saliva at three different stages: the groups 2 and 3 - before adhesive application; the groups 4 and 5 - before adhesive polymerization; the groups 6 and 7 - after adhesive polymerization. Decontaminating procedures were rinsing, air-drying (group 2, 4, 6) and air-drying (group 3, 5, 7). The specimens were restored with composite resin (Filtek, Z350) and microtensile bond strength was measured. The data was analyzed with one-way ANOVA and Tukey HSD test (p < 0.05). In the control group, using PNT resulted in significantly higher bond strength than when ABU and SBU were used (p < 0.001). For three adhesives, the groups 2, 4 and 6 had greater bond strength than the groups 3, 5 and 7. Also, when the artificial saliva was contaminated before adhesive polymerization (group 4, 5), it showed a significantly lower bond strength. Generally the two-step total-etch adhesive generated a higher bond strength than the one-step self-etch adhesive. Artificial saliva contamination before adhesive polymerization led to a drastic decrease in bond strength, and rinsing with water followed by air-drying could not recover the bond strength.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.14 no.5
• /
• pp.566-571
• /
• 2014

Channel-stacked 3D NAND flash memory is very promising candidate for the next-generation NAND flash memory. However, there is an inherent issue on cell size variation between stacked channels due to the declined etch slope. In this paper, the effect of the cell variation on the incremental step pulse programming (ISPP) characteristics is studied with 3D TCAD simulation. The ISPP slope degradation of elliptical channel is investigated. To solve that problem, a new programming method is proposed, and we can alleviate the $V_T$ variation among cells and reduce the total programming time.

• Proceedings of the KACD Conference
• /
• 2001.11a
• /
• pp.560.1-560
• /
• 2001

To evaluate the micro-shear bond strength of current adhesive systems to cervical and mid-coronal enamel. Materials and Two commercially available resin adhesives were investigated; a self-etching primer system(Clearfil SE Bond, Kyraray) and a one-bottle adhesive system(Single Bond, 3M) intended for use with the total-etch wet-bonding technique were employed. Two regions of enamel, cervical and mid-coronal regions, were chosen from the buccal surface of extracted molars and were then bonded with each adhesive system and submitted to the micro-shear bond test.(중략)

• Journal of the Korean Ceramic Society
• /
• v.24 no.2
• /
• pp.170-178
• /
• 1987

Changes of the properties of PECVD-SiN film with the variation of deposition process parameters were investigated and optimum process parameters were determined. The refractive index of the film increased with increasing substrate temperature and pressure, and decreasing rf-power, NH3/SiH4 gas ratio and total gas flow. BHF etch rate and deposition rate show a decreasing tendency with increasing refractive index. The step coverage of the film was not affected much by deposition rate and pressure, but improved apparently with increasing rf-power and NH3/SiH4 gas ratio. Also the optimum process parameters were determined by considering the characteristic properties as well as thickness uniformity of films. The refractive index of the film deposited under this condition was 2.06.

• The Journal of Korean Academy of Prosthodontics
• /
• v.52 no.2
• /
• pp.74-81
• /
• 2014

Purpose: While studies have examined microleakage in endodontically treated teeth restored with posts, microleakage among post and adhesive systems remains a concern. This study compared the sealing properties of 3 adhesively luted post systems. Materials and methods: Thirty-six endodontically treated permanent maxillary central incisors were divided into 3 groups: Zirconia-glass fiber, Quartz-glass fiber, Polyethylene fiber posts. Post space was prepared and each post was adhesively luted with 3 systems. The specimens were separately immersed in freshly prepared 2% methylene blue solution for 1 week. The cleaned specimens were then embedded in autopolymerizing acrylic resin. The root portion of tooth were horizontally sectioned into three pieces (apical, middle, and coronal portions). An occlusal view of each section was digitally photographed with a stereomicroscope. The methylene blue-infiltrated surface for each specimen was measured. Dye penetration was estimated as the ratio of the methylene blue-infiltrated surface to the total dentin surface. Results: No significant differences were found among post types. The variables of middle section and 3-stage adhesive produced significant differences in microleakage between the following post pairs: zirconia-glass fiber versus quartz-glass fiber, zirconia-glass fiber versus polyethylene fiber, and quartz-glass fiber versus polyethylene fiber (P<.05). There were significant differences between the apical and coronal sections of each post type, and between apical versus middle sections of quarze-glass fiber and polyethylene fiber posts (P<.05). Conclusion: No significant differences were found among post types. The 3-stage adhesive produced significant differences in microleakage between the following post pairs.

• Journal of Dental Rehabilitation and Applied Science
• /
• v.27 no.2
• /
• pp.161-174
• /
• 2011

The purpose of this study was to evaluate the effect of ethanol addition on efficacy of two-step total-etch adhesive under over-wet condition by measurement of remaining volatile part (RVP), microtensile bond strength (${\mu}TBS$), and degree of conversion (DC). Two-step total-etch adhesive, Optibond Solo Plus (Kerr, Orange, USA), was used. Experimental groups were divided into 8 groups: Group 1 (only 10 ${\mu}l$ adhesive), Group 2 (mixture of 3 ${\mu}l$ distilled water and 10 ${\mu}l$ adhesive), From Group 3 to Group 8 (mixture of 3 ${\mu}l$ distilled water, 10 ${\mu}l$ adhesive, and ethanol added in 1 ${\mu}l$ increment from 1 ${\mu}l$ to 6 ${\mu}l$). The mixtures were placed on slide glass and evaporated for 10 s, 30 s, and 60 s by air-drying. The weight of RVP was measured by precision weight. Same procedures were performed for ${\mu}TBS$ test and measurement of DC. The condition of mixed solution was observed under light microscope. For RVP weight, the weights of experimental groups except for group 1 decreased with the increase of air-drying time (p<0.05). The DC increased with the increase of air-drying time in only group 5 and 6 (p<0.05). The ${\mu}TBS$ increased with the increase of air-drying time in group only 5, 6, and 7 (p<0.05). The phase separation was examined and water blisters were diminished with the increase of air-drying time in group 5, 6, 7, and 8. Within the limits of this study, ethanol additionally applied to adhesive decreased RVP and increased DC and ${\mu}TBS$ under over-wet condition. It was shown that the addition of ethanol to two-step total-etch adhesive under over-wet condition would remove water and increase the efficacy of adhesive.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.454-454
• /
• 2014

Silicon microwire array is one of the promising platforms as a means for developing highly efficient solar cells thanks to the enhanced light trapping efficiency. Among the various fabrication methods of microstructures, deep reactive ion etching (DRIE) process has been extensively used in fabrication of high aspect ratio microwire arrays. In this presentation, we show precisely controlled Si microwire arrays by tuning the DRIE process conditions. A periodic microdisk arrays were patterned on 4-inch Si wafer (p-type, $1{\sim}10{\Omega}cm$) using photolithography. After developing the pattern, 150-nm-thick Al was deposited and lifted-off to leave Al microdisk arrays on the starting Si wafer. Periodic Al microdisk arrays (diameter of $2{\mu}m$ and periodic distance of $2{\mu}m$) were used as an etch mask. A DRIE process (Tegal 200) is used for anisotropic deep silicon etching at room temperature. During the process, $SF_6$ and $C_4F_8$ gases were used for the etching and surface passivation, respectively. The length and shape of microwire arrays were controlled by etching time and $SF_6/C_4F_8$ ratio. By adjusting $SF_6/C_4F_8$ gas ratio, the shape of Si microwire can be controlled, resulting in the formation of tapered or vertical microwires. After DRIE process, the residual polymer and etching damage on the surface of the microwires were removed using piranha solution ($H_2SO_4:H_2O_2=4:1$) followed by thermal oxidation ($900^{\circ}C$, 40 min). The oxide layer formed through the thermal oxidation was etched by diluted hydrofluoric acid (1 wt% HF). The surface morphology of a Si microwire arrays was characterized by field-emission scanning electron microscopy (FE-SEM, Hitachi S-4800). Optical reflection measurements were performed over 300~1100 nm wavelengths using a UV-Vis/NIR spectrophotometer (Cary 5000, Agilent) in which a 60 mm integrating sphere (Labsphere) is equipped to account for total light (diffuse and specular) reflected from the samples. The total reflection by the microwire arrays sample was reduced from 20 % to 10 % of the incident light over the visible region when the length of the microwire was increased from $10{\mu}m$ to $30{\mu}m$.