• Applied Chemistry for Engineering
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• v.9 no.7
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• pp.956-960
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• 1998

Cu-Zn and Cu-Zn-Ti catalysts for the steam reforming of methanol were prepared. This reaction was carried out at atmospheric pressure, $250^{\circ}C$, steam/methanol molar ratio 1.5, and contact time 0.1 g-cat.hr/mL-feed. In case of the catalyst with 3 mol% of $TiO_2$, the activity was superior to that of catalysts without $TiO_2$. The reaction products were mainly hydrogen and carbon dioxide. It was found that catalytic activity was not related to specific surface area but affected by metallic copper area which was measured by $N_2O$ decomposition and increased with the addition of $TiO_2$ content. XPS and XRD showed that the oxidation state of zinc was not changed during reaction, but oxidation states of copper existed in Cu(0) or Cu(I).

• Journal of the Korean Society for Heat Treatment
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• v.20 no.1
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• pp.17-21
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• 2007

In this study, brazing characteristics of the dissimilar Ti and Cu metals using a Zr-base amorphous filler ($Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10.0}Be_{22.5}$ in at.%) have been investigated for various bonding temperatures. In the sample brazed at $790^{\circ}C$ for 10 min., the Ti-rich phases in the joint were observed, while the Cu-rich phases were obtained in the sample brazed at $825^{\circ}C$ for 10 min.. Such a different microstructure and composition in the joints could be explained by the degree of the dissolution reaction. At $790^{\circ}C$, the reaction between the Zr-rich liquid phase and the Ti base metal was actively occurred to form Ti-rich liquid phase in the joint. As the temperature increased to $825^{\circ}C$, however, the reaction between the Ti-rich liquid phase and the Cu base metal was promoted to form the Cu-rich liquid phase in the joint finally. Such a different interface reaction is attributed to the reactivity or solubility between the Zr as a main element in the filler and the Ti and Cu as a base metal element.

• Applied Chemistry for Engineering
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• v.24 no.6
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• pp.599-604
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• 2013

In this study, Ti added Mn-Cu mixed oxide catalysts were prepared by a co-precipitation method and used for the low temperature (< $200^{\circ}C$) selective catalytic reduction (SCR) of NOx with $NH_3$. Physicochemical properties of these catalysts were characterized by BET, XRD, XPS, and TPD. Mn-Cu mixed oxide catalysts were found to be amorphous with a large surface and they showed high SCR activity. Experimental results showed that the addition of $TiO_2$ to Mn-Cu oxide enhanced the SCR activity and $N_2$ selectivity. Ti addition led to the chemically adsorbed oxygen species that promoted the oxidation of NO to $NO_2$ and increased the number of $NH_3$ adsorbed-sites such as $Mn^{3+}$.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.23-29
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• 2000

We demonstrate the fabrication method of high-density and high-quality solder bump solving a copper (Cu) cross-contamination in Si-LSI laboratory. The Cu cross-contamination is solved by separating solder-bump process by two steps. Former is via-formation process excluding Cu/Ti under ball metallurgy (UBM) layer sputtering in Si-LSI laboratory. Latter is electroplating process including Ti-adhesion and Cu-seed layers sputtering out of Si-LSI laboratory. Thick photoresist (PR) is achieved by a multiple coating method. After TiW/Al-electrode sputtering for electroplating and via formation in Si-LSI laboratory, Cu/Ti UBM layer is sputtered on sample. The Cu-seed layer on the PR is etched during Cu-electroplating with low-electroplating rate due to a difference in resistance of UBM layer between via bottom and PR. Therefore Cu-buffer layer can be electroplated selectively at the via bottom. After etching the Ti-adhesion layer on the PR, Sn/Pb solder layer with a composition of 60/40 is electroplated using a tin-lead electroplating bath with a metal stoichiometry of 60/40 (weight percent ratio). Scanning electron microscope image shows that the fabricated solder bump is high-uniformity and high-quality as well as symmetric mushroom shape. The solder bumps with even 40/60 $\mu\textrm{m}$ in diameter/pitch do not touch during electroplating and reflow procedures. The solder-bump process of high-uniformity and high-density with the Cu cross-contamination free in Si-LSI laboratory will be effective for electronic microwave application.

• Proceedings of the KWS Conference
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• 1994.10a
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• pp.169-172
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• 1994

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.11a
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• pp.76-76
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• 2001

• Journal of the Korean Vacuum Society
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• v.5 no.2
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• pp.147-155
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• 1996

Optical properties of $TiO_2/M/Ag/M/TiO_2$ films have been changed with the diffusion barrier metal M. Optimum opticla properties of $TiO_2/M/Ag/M/TiO_2$ as the transparent heat mirror film, could be obtained with Ti among diffusion barrier metals of Ti, Cu, Zr and Al. $TiO_2/M/Ag/M/TiO_2$ film, which was fabricated by sputtering of 18 nm-thick $TiO_2$ and Ag, and 4nm-thick Ti, showed maximum transimittance of 89% at visible wavelength and infrared reflectance of 97% at wavelength of 3000 nm. Optical properties of this film was not degraded by Xenon-sunshine weather test for 240 hours. For specimens with barrier layers of Cu, Zr, and Al, degradation of optical properties by weather test was increased in a sequence of films with Cu, Zr, and Al barrier layers.

• Journal of Korean Society of Environmental Engineers
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• v.22 no.3
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• pp.511-521
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• 2000

Investigation was carried out lean burn de-NOx properties of Pt-$TiO_2$ bifunctional catalyst by propylene in order to get the high de-NOx activity and the wide temperature window under coexistence of $SO_2$ and $H_2O$. Only noncatalyst and carrier catalyst themselves had NOx conversion activity at high temperature over $400^{\circ}C$. NOx conversion activity of catalysts exchanged copper ion resulted in Cu-$TiO_2$>Cu-ZSM-5>Cu-$Al_2O_3$>CU-YZ>Cu-AZ. Catalysts impregnated with platinum based on titania gave the results of high NOx conversion activity at low temperature. $250^{\circ}C$. Bifunctional catalysts based on Pt-$TiO_2$ showed high NOx conversion activity both at a low zone of $300^{\circ}C$ and a high zone of $500^{\circ}C$. Pt-$TiO_2$/$Al_2O_3$ catalyst gave the highest NOx conversion activity at a low temperature zone. and Pt-$TiO_2$/$Mn_2O_3$(21) catalyst gave the highest NOx conversion activity at a high temperature zone. Under the coexistence of $SO_2$ and $H_2O$. NOx conversion activities of 0.55wt%Pt-$TiO_2$/5wt%Cu-ZSM-5 catalyst was high both at a low and high temperature zone, and increased depending on oxygen concentration. 0.55wt%Pt-$TiO_2$/5wt%Cu-ZSM-5 catalyst showed the best correlation between de-NOx activities and the propyl ere conversion rates to CO on the log function.

• Proceedings of the KWS Conference
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• 1994.10a
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• pp.163-165
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• 1994

• Journal of Korea Foundry Society
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• v.15 no.4
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• pp.368-376
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• 1995

An Al-composite material was fabricated with using the rheocompocasting process and the microstructure of the Al-Cu/SiCp composite material was investigated depending on the stirring times and the amount of Ti additions. The distribution of SiC dispersion shows the good result at the stirring time of 30 min. The degree of microdistribution of the $Al_2Cu$ and SiCp is improved when the amount of Ti addition is increased. At the compositon of 0.3%Ti, the primary solid is the compound of $Al_3Ti$ and no exist of the SiCp and $Al_2Cu$ phase around the primary $Al_3Ti$. In the process of compositization, SiCp is found at the primary and final solid parts and is found at the final solid part after remelting. $Al_2Cu$ and SiCp are distributed around and outside of dendrite or independently after remelting, which is different from the process of compositization.