• Journal of Korea Foundry Society
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• v.20 no.5
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• pp.300-306
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• 2000

The objective of this work was to investigate the effects of SiC particle size(50, 100 ${\mu}m$) and additional elements such as Si, Cu and Ti on aging behavior in Al-5Mg-X(Si,Cu,Ti)/SiCp composites fabricated by pressureless infiltration method using hardness and wear test, scanning electron microscopy(SEM) and differential scanning calorimetry(DSC). The peak aging time in Al-5Mg-X(Si, Cu, Ti)/SiCp(50, 100 ${\mu}m$) composites is shorter than Al-5Mg-0.3Si alloy.The peak aging time of 50 ${\mu}m$ SiC particle reinforced Al-5Mg-X(Si,Cu,Ti) composites is shorter than those of 100 ${\mu}m$ SiC particle reinforced of Al-5Mg-X(Si,Cu,Ti) composites. The Al-5Mg-0.3Si-0.1Cu-0.1Ti/SiCp(50 ${\mu}m$) composites aged at $180^{\circ}C$ has higher hardness and better wear resistance than any other aged composite.The aging effect is promoted by the addition of Si and Cu in Al-5Mg/SiCp composites, so the wear resistance of Al-5Mg/SiCp composites with Si and Cu elements is enhanced by the aging treatment.

• Journal of the Korean Ceramic Society
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• v.25 no.3
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• pp.231-236
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• 1988

In order to investigate the effect of second phase on $Al_2O_3$ matrix, SiC particles were dispersed in $Al_2O_3$ matrix as a second phase over the content range of 5 vol.% to 20 vol.%. To this mixture, $Y_2O_3$ or $TiO_2$ powders were added as a sintering additive before isostatically pressing and pressurelessly sintering at 180$0^{\circ}C$ for 90 min in $N_2$ atmosphere. With increasing SiC content, relative densities of composites were decreased but mechanical properties of composites were improvjed. In the case of adding $Y_2O_3$ as a sintering additive, maximum values of flexural strength, hardness and fracture toughness were 525 MPa, 17.1 GPa, 4.1 MPa.m1/2 respectively. In the case of adding X$TiO_2$ as a sintering additive, maximum values of flexural strength, hardness were 285 MPa, 12.1 GPa respectively. Improved mechanical properties were found to be the results of grain growth control of $Al_2O_3$ matrix and crack deflection by the second phase SiC particles.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.7
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• pp.1713-1721
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• 1994

Intermetallic-matrix composites(IMCs) have the potential of combing matrix properties of oxidation resistance and high temperature stability with reinforcement properties of high specific strength and modulus. One of the major limiting factors for successful applications of these composite at high temperatures is the formation of interfacial reactions between matrix and ceramic reinforcement during composite process and during service. The purpose of the present investigation is to develop a better understanding of the nature of creep fracture mechanisms in a $Ni_{3}Al$ composite reinforced with both $TiB_{2}$ and SiC particulates. Emphasis is placed in the roles of the products of the reactions in determining the creep lifetime of the composite. In the present study, creep rupture specimens were tested under constant ranging from 180 to 350 MPa in vacuum at $760^{\cric}C$. The experimental data reveal that the stress exponent for power law creep for the composite is 3.5, a value close to that for unreinforced $Ni_{3}Al$. The microstructural observations reveal that most of the cavities lie on the grain boundaries of the $Ni_{3}Al$ matrix as opposed to the large $TiB_{2}/Ni_{3}Al$ interfaces, suggesting that cavities nucleate at fine carbides that lie in the $Ni_{3}Al$ grain boundaries as a result of the decomposition of the $SiC_{p}$. This observation accounts for the longer rupture times for the monolicthic $Ni_{3}Al$ as compared to those for the $Ni_{3}Al/SiC_{p}/TiB_{2} IMC$. Finally, it is suggested that creep deformation in matrix appears to dominate the rupture process for monolithic $Ni_{3}Al$, whereas growth and coalescence of cavities appears to dominate the rupture process for the composite.

• Journal of Korea Foundry Society
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• v.15 no.4
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• pp.368-376
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• 1995

An Al-composite material was fabricated with using the rheocompocasting process and the microstructure of the Al-Cu/SiCp composite material was investigated depending on the stirring times and the amount of Ti additions. The distribution of SiC dispersion shows the good result at the stirring time of 30 min. The degree of microdistribution of the $Al_2Cu$ and SiCp is improved when the amount of Ti addition is increased. At the compositon of 0.3%Ti, the primary solid is the compound of $Al_3Ti$ and no exist of the SiCp and $Al_2Cu$ phase around the primary $Al_3Ti$. In the process of compositization, SiCp is found at the primary and final solid parts and is found at the final solid part after remelting. $Al_2Cu$ and SiCp are distributed around and outside of dendrite or independently after remelting, which is different from the process of compositization.

• Journal of Powder Materials
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• v.10 no.1
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• pp.15-20
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• 2003

Hybrid $A1_2O_3-TiC$ ceramic particle reinforced 6061 and 5083 Al composite powders were prepared by the combination of twin rolling and stone mill crushing process, followed by consolidating processes of cold compaction, degassing and hot extrusion. The composite bar consists of lamellar structure of ceramic particle rich area and matrix area, in which the hybrid was decomposed into each TiC of about $3-4\mutextrm{m}$ and $AI_2O_3$ particles of about $1-2\mutextrm{m}$ in diameter. It also found that fine $Mg_2Si$ precipitates of about 30 nm were embedded in the matrix, which have grains of about 3 $\mutextrm{m}$. Higher UTS was measured at the 5083 composite bar compared to the conventionally fabricated composite, due to again refinement effect by the rapid solidification. No particle was shown to form in the interface between the matrix and reinforcement, whereas carbon was diffused into the matrix.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.8
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• pp.335-341
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• 2003

The composites were fabricated respectively 61vo1.% $\beta$ -SiC and 39vo1.% Ti $B_2$ spray-dried powders with the liquid forming additives of l2wt% $Al_2$ $O_3$＋ $Y_2$ $O_3$ by pressureless annealing at 1$700^{\circ}C$, 175$0^{\circ}C$, 180$0^{\circ}C$ for 4 hours. The result of phase analysis of composites by XRD revealed $\alpha$ -SiC(6H), Ti $B_2$, and YAG(A $l_{5}$ $Y_3$ $O_{12}$ ) crystal phase. The relative density, the Young's modulus and fracture toughness showed respectively the highest value of 92.97%, 92.88Gpa and 4.4Mpaㆍ $m^{\frac{1}{2}}$ for composites by pressureless annealing temperature 1$700^{\circ}C$ at room temperature. The electrical resistivity showed the lowest value of 8.09${\times}$10$^{-3}$ ㆍcm for composite by pressureless annealing temperature 1$700^{\circ}C$ at $25^{\circ}C$. The electrical resistivity of the SiC-Ti $B_2$ composites was all positive temperature cofficient resistance(PTCR) in the temperature ranges from $25^{\circ}C$ to $700^{\circ}C$.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1538-1540
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• 2003

The composites were fabricated respectively 61vol.% ${\beta}$-SiC and 39vol.% $TiB_2$ spray-dried powders with the liquid forming additives of 12wt% $Al_2O_3+Y_2O_3$ by pressureless annealing at $1700^{\circ}C,\;1750^{\circ}C\;1800^{\circ}C$ for 4 hours. The result of phase analysis of composites by XRD revealed ${\alpha}$-SiC(6H), $TiB_2$, and YAG($Al_5Y_3O_{12}$) crystal phase. The relative density, the Young's modulus and fracture toughness showed respectively the highest value of 92.97%, 92.88Gpa and $4.4Mpa{\cdot}m^{1/2}$ for composites by pressureless annealing temperature $1700^{\circ}C$ at room temperature. The electrical resistivity showed the lowest value of $8.09{\times}10^{-3}{\Omega}{\cdot}cm$ for composite by pressureless annealing tempe rature $1700^{\circ}C$ at $25^{\circ}C$. The electrical resistivity of the SiC-$TiB_2$ composites was all positive temperature cofficient resistance (PTCR) in the temperature ranges from $25^{\circ}C$ to $700^{\circ}C$.

• Structural Engineering and Mechanics
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• v.62 no.1
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• pp.43-54
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• 2017

In this study, the failure behavior of composite material in the biaxial and off-axis loading is studied based on a computational micromechanical model. The model is developed so that the combination of mechanical and thermal loading conditions can be considered in the analysis. The modified generalized plane strain assumption of the theory of elasticity is used for formulation of the micromechanical modeling of the problem. A truly meshless method is employed to solve the governing equation and predict the distribution of micro-stresses in the selected RVE of composite. The fiber matrix interface is assumed to be perfect until the interface failure occurs. The biaxial and off-axis loading of the SiC/Ti and Kevlar/Epoxy composite is studied. The failure envelopes of SiC/Ti and Kevlar/Epoxy composite in off-axis loading, biaxial transverse-transverse and axial-transverse loading are predicted based on the micromechanical approach. Various failure criteria are considered for fiber, matrix and fiber-matrix interface. Comparison of results with the available results in the litreture shows excellent agreement with experimental studies.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.10
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• pp.665-670
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• 2016

Prevailing dissemination of machine tools and cutting technology have caused drastic developments of high speed dry machining with work materials of high hardness, and demands on the high-hardness-materials with high efficiency have become increasingly important in terms of productivity, cost reduction, as well as environment-friendly issue. Addition of Si to TiAlN has been known to form nano-composite coating with higher hardness of over 30 GPa and oxidation temperature over $1,000^{\circ}C$. However, it is not easy to add Si to TiAlN by using conventional PVD technologies. Therefore, Ti-Al-Si-N have been prepared by hybrid process of PVD with multiple target sources or PVD combined with PECVD of Si source gas. In this study, a single composite target of Ti-Al-Si was prepared by powder metallurgy of MA (mechanical alloying) and SPS (spark plasma sintering). Properties of he resulting alloying targets were examined. They revealed a microstructure with micro-sized grain of about $1{\sim}5{\mu}m$, and all the elements were distributed homogeneously in the alloying target. Hardness of the Ti-Al-Si-N target was about 1,127 Hv. Thin films of Ti-Al-Si-N were prepared by unbalanced magnetron sputtering method by using the home-made Ti-Al-Si alloying target. Composition of the resulting thin film of Ti-Al-Si-N was almost the same with that of the target. The thin film of Ti-Al-Si-N showed a hardness of 35 GPa and friction coefficient of 0.66.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.1-5
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• 2006

We prepared 80 nm-thick TiSix on each 70 nm-thick amorphous silicon and polysilicon substrate using an RF sputtering with $TiSi_2$ target. TiSix composite silicide layers were stabilized by rapid thermal annealing(RTA) of $800^{\circ}C$ for 20 seconds. Line width of $0.5{\mu}m$ patterns were embodied by photolithography and dry etching process, then each additional annealing process at $750^{\circ}C\;and\;850^{\circ}C$ for 3 hours was executed. We investigated the change of sheet resistance with a four-point probe, and cross sectional microstructure with a field emission scanning electron microscope(FE-SEM) and transmission electron microscope(TEM), respectively. We observe an abrupt change of resistivity and voids at the silicide surface due to interdiffusion of silicide and composite titanium silicide in the amorphous substrates with additional $850^{\circ}C$ annealing. Our result implies that the electrical resistance of composite titanium silicide may be tunned by employing appropriate substrates and annealing condition.