• 한국초전도학회:학술대회논문집
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• v.9
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• pp.87-90
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• 1999

We have studied the annealing effects of 570 (SrTiO$_3$) single crystal substrate and the I-V properties of step-edge junctions after Ar ion milling. YBa$_2Cu_3O_7$ (YBCO) thin films are fabricated on the substrates by using pulsed laser deposition (PLD) and photolithography. The surface of Ar ion milled substrate was characterized with atomic force microscope (AFM) and scanning electron microscope (SEM) images. After the substrate was damaged by milling, the critical current density of YBCO thin films deposited on the substrate was lowered. The annealing of the damaged substrate at about 1000 $^{\circ}C$ recovered the critical current density to that before the milling. Futhermore the annealing helped junction formation due to high quality film and increased the yield rate for the fabrication of high quality step-edge junction.

• Korean Journal of Materials Research
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• v.24 no.7
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• pp.344-350
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• 2014

Metal films (i.e., Ti, Al and SUH310S) were prepared in a magnetron sputtering apparatus, and their cross-sectional structures were investigated using scanning electron microscopy. The apparatus used consisted of a cylindrical metal target which was electrically grounded, and two anode rings attached to the top and to the bottom of the target. A wire was placed along the center-line of the cylindrical target to provide a substrate. When the electrical potential of the substrate was varied, the metal-film formation rate depended on both the discharge voltage and the electrical potential of the substrate. As we made the magnetic field stronger, the plasma which appeared near the target collected on the plasma wall surface and thereby decreased the bias current. The bias current on the conducting wire was different from that for cation collection. The bias current decreased because the collection of cations decreased when we increased the magnetic-coil current. When the substrate was electrically isolated, the films deposited showed a slightly coarse columnar structure with thin voids between adjacent columns. In contrast, in the case of the grounded substrate, the deposited film did not show any clear columns but instead, showed a densely-packed granular structure. No peeling region was observed between the film and substrate, indicating good adhesion.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.39 no.1
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• pp.22-30
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• 2002

The nucleation of copper(Cu) with (hfac)iu(VTMS) oganometallic precursor is investigated for Si, $Sio_2$, TiN, $W_2N$ substrates. As the deposition temperature is increased, the dominant growth mechanism is observed to change from the nucleation of Cu particles to the clustering of Cu nuclei around $180^{\ciec}C$, independent of the employed substrates. It is also observed that the cleaning of substrate surfaces with the diluted HF solution improves the selectivity of Cu nucleation between TiN and $Sio_2$ substrates. Dimethyldichlorosilane treatment is found to passivate the surface of TiN substrate, contrary to the generally accepted belief, when the TiN substrate is cleaned by $H_2O_2$ solution before the treatment.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.4
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• pp.133-137
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• 2001

The properties of TiC/Al surface alloy prepared using a high power $CO_2$-laser was investigated. To analyze this process, the physical properties between substrate [Al] and TiC powder were measured. Surface layer size profiles, optical absorption rate and powder efficiency were measured as afunction of the laser output in TiC/Al matrix. Regardless of TiC powder existence, the absorption rate in substrate Al was decreased when laser output increased. When the laser output increased in the range of 2kW to 4.5 kW, the powder efficiency increased from 4% to 12%. However, TiC powder were not melted in molten aluminum. As a result, increased powder particles easily penetrated to the surface layer and created a two phase states in the metal matrix.

• Korean Journal of Materials Research
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• v.15 no.7
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• pp.444-447
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• 2005

In this study, $Hydroxyapatite+TiO_2(HAp+TiO_2)$ composite sol coatings on Cp-Ti substrates were deposited by using a sol-gel derived precursor. Prior to hydroxyapatite coating, the samples were micropolished and divided into three sets. The first set was coated with hydroxyapatite (HAp) directly on Cp-Ti. The second set was first coated with intermediate titania layer and then coated with HAp. The third set samples were coated with $HAp+TiO_2$ (50:50) composite sol. Each samples were predried at $200^{\circ}C$, and heat treated at $600^{\circ}C$. The formation of hydroxyapatite has been confirmed by XRD analyses and the substrate material was found to be oxidized with negligible amount of CaO in the coating. The NaOH treated samples showed the presence of rutile crystal. The SEM studies revealed surface morphologies of each samples. $HAp+TiO_2$ composite sol coating layer was found to be smooth. The bonding strength of each samples were calculated using pull out tests. The bonding strength of the $HAp+TiO_2$ composite sol coating on substrate was 29.35MPa.

• Journal of the Korean institute of surface engineering
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• v.52 no.4
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• pp.187-193
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• 2019

Electroless Ni-P coatings are widely used in the chemical, mechanical, and electronic industries because of their excellent wear and abrasion resistance. In this study, the effect of $TiO_2$ particles of composite coating was investigated. To improve the corrosion resistance, electroless $Ni-P-TiO_2$composite coating was studied by varying the $TiO_2$ content. The morphology and phase structure of $Ni-P-TiO_2$ composite coatings were analyzed by scanning electron microscopy(SEM), X-ray diffractometry(XRD) and X-ray photoelectron spectroscopy(XPS). The result showed that $Ni-P-TiO_2$composite coating is composed of Ni, P, Ti and O. It exhibits an amorphous structure, high hardness and good corrosion resistance to the substrate. $Ni-P-TiO_2$ composite coatings have higher open circuit potential than that of the substrate, which obtained at $TiO_2$ content of 5.0 g/L optimal integrated properties.

• Journal of the Korean Ceramic Society
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• v.26 no.5
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• pp.670-676
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• 1989

The PbTiO3 is well known materials having remarkable ferroelectric, piezoelectric, and pyroelectric properties. PbTiO3 thin films with a perovskite structure were successfully fabricated on titanium substrate by chemical vapor deposition. These films were characterized according to composition, crystal structure, and electrical properties. Semi-quantitative compositional analysis of the deposited films was made by Auger Electron Spectroscopy(AES). The PbTiO3 film deposited on titanium substrate at the deposition temperature 75$0^{\circ}C$, the Ti(C2H5O)4 fraction 0.15, and O2 partial pressure 0.06atm, has a columnar structure and grows with(001) preferred orientation, and has stoichiometric composition. A clear dielectric transition and offset in the dc conductivity near the transition temperature(48$0^{\circ}C$) were observed in the deposited lead titanate film.

• Journal of the Korean Ceramic Society
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• v.30 no.7
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• pp.578-588
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• 1993

Highly c-axis oriented ferroelectric PbTiO3 thin films were deposited on MgO single crystal substrates by RF magnetron sputtering. We have studied the effects of substrate temperature, RF input power, gas comosition, gas pressure and deposition rate on the chemical and structural characteristics of PbTiO3 thin films. The epitaxy relationship of c-axis oriented films was found to be PbTiO3{100}//MgO(100) and their microstructures were highly mosaic. It was found that the most important parameter to achieve epitaxial PbTiO3 films was the substrate temperature. The activation energy for the epitaxy formation was about 0.92eV. Lower gas pressure and RF input power were favorable for the formation of epitaxial c-axis orientation. It was also found that the optimum oxygen content in Ar gas was 10% to obtain the stoichiometric PbTiO3 composition.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.7
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• pp.537-542
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• 2012

DSSCs efficiency by thickness of $TiO_2$ photoelectrode and thickness differences between two substrates studied. DSSCs is made of the doctor blade method and photoelectrode annealing temperature elevated in a different ways. In addition, cells efficiencies of according to the different thickness between $TiO_2$ photoelectrode substrate and Pt counter electrode was measured. Efficiency of DSSCs made with $TiO_2$ photoelectrode of 18 ${\mu}m$ thickness and the gap difference between the substrate 28 ${\mu}m$ shows a highest 4.805% efficiency.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2001.11a
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• pp.331-340
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• 2001

Elastic-Plasitc Finite element analysis is peformed about the TiN coated medium. The normal contact is simulated by a rigid asperity pressing the surface of an elastic-plastic half-surface. The case of a surface film stiffer than the substrate is considered, and general solutions for the subsurface stress and deformation fields are presented for several coating thickness. Additionally, the critical normal loads for deformation in the substrate and coating fracture are calculated when the yield of TiN film follows the Maximum Principal Stress Theory and Von Mises Theory. The results can be subsumed in failure maps for TiN thin film on steel.