• 제목/요약/키워드: Through-thickness property

검색결과 143건 처리시간 0.025초

기밀성 분석을 통한 RFID 태그 패키지 에폭시 몰딩 연구 (A Study on the RFID Tag Package Epoxy Molding through Leak Detection)

  • 반창우;홍석기;장동영
    • 한국생산제조학회지
    • /
    • 제21권2호
    • /
    • pp.297-304
    • /
    • 2012
  • Recently RFID (Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve reliability. In this paper, reliability comparison among 11 types of most commonly used epoxy molding in electrical/electronic components packaging has been made through analysis of confidentiality using a humidity sensor. Consequently, the variation of moisture penetration time causes has been verified by the changes in molding thickness for 3 types of epoxy, and from the result, the best experimental results were observed in terms of confidentiality. Moreover we have been confirmed the relationship between confidentiality, the molding thickness, and thermal property of epoxy through thermal analysis.

실리콘 다층절연막의 전기전도 특성 (The electrical conduction characteristics of the multi-dielectric silicon layer)

  • 정윤해;한원열;박영걸
    • E2M - 전기 전자와 첨단 소재
    • /
    • 제7권2호
    • /
    • pp.145-151
    • /
    • 1994
  • The multi-dielectric layer SiOz/Si3N4/SiO2(ONO) is used to scale down the memory device. In this paper, the change of composition in ONO layer due to the process condition and the conduction mechanism are observed. The composition of the oxide film grown through the oxidation of nitride film is analyzed using auger electron spectroscopy(AES). AES results show that oxygen concentration increases at the interface between oxide and nitride layers as the thickness -of the top oxide layer increases. Results of I-V measurement show that the insulating properties improve as the thickness of the top oxide layer increases. But when the thickness of the nitride layer decreases below 63.angs, insulating peoperties of film 28.angs. of top oxide and film 35.angs. turn over showing that insulating property of film 28.angs. of top oxide is better than that of film 35.angs. of top oxide. This phenomenon of turn over is thought as the result of generation of surface state due to oxygen flow into nitride during oxidation process. As the thickness of the top oxide and nitride increases, the electrical breakdown field increases, but when the thickness of top oxide reaches 35.angs, the same phenomenon of turn over occurs. Optimum film thickness for scaled multi-layer dielectric of memory device SONOS is estimated to be 63.angs. of nitride layer and 28.angs. of top oxide layer. In this case, maximum electrical breakdown field and leakage current are 18.5[MV/cm] and $8{\times}{10^-12}$[A], respectively.

  • PDF

ELECTRO-MICROSCOPE BASED 3D PLANT CELL IMAGE PROCESSING METHOD

  • Lee, Choong-Ho;Umeda Mikio;Takesi Sugimoto
    • 한국농업기계학회:학술대회논문집
    • /
    • 한국농업기계학회 2000년도 THE THIRD INTERNATIONAL CONFERENCE ON AGRICULTURAL MACHINERY ENGINEERING. V.II
    • /
    • pp.227-235
    • /
    • 2000
  • Agricultural products are easily deformable its shape because of some external forces. However, these force behavior is difficult to measure quantitatively. Until now, many researches on the mechanical property was performed with various methods such as material testing, chemical analysis and non-destructive methods. In order to investigate force behavior on the cellular unit of agricultural products, electro-microscope based 3D image processing method will contribute to analysis of plant cells behavior. Before image measurement of plant cells, plant sample was cut off cross-sectioned area in a size of almost 300-400 ${\mu}$ m units using the micron thickness device, and some of preprocessing procedure was performed with fixing and dyeing. However, the wall structure of plant cell is closely neighbor each other, it is necessary to separate its boundary pixel. Therefore, image merging and shrinking algorithm was adopted to avoid disconnection. After then, boundary pixel was traced through thinning algorithm. Each image from the electro-microscope has a information of x,y position and its height along the z axis cross sectioned image plane. 3D image was constructed using the continuous image combination. Major feature was acquired from a fault image and measured area, thickness of cell wall, shape and unit cell volume. The shape of plant cell was consist of multiple facet shape. Through this measured information, it is possible to construct for structure shape of unit plant cell. This micro unit image processing techniques will contribute to the filed of agricultural mechanical property and will use to construct unit cell model of each agricultural products and information of boundary will use for finite element analysis on unit cell image.

  • PDF

구리 분말 첨가를 통한 도자타일 표면유약의 소수화 특성 (Hydrophobic property of surface glaze of ceramic tiles by copper powder addition)

  • 최청수;한규성;황광택;김진호
    • 한국결정성장학회지
    • /
    • 제29권5호
    • /
    • pp.215-221
    • /
    • 2019
  • 건축용 내외장재로 사용되는 도자타일은 최근에 오염 방지 기능에 대한 시장의 수요에 따라, $TiO_2$ 코팅을 통한 친수성(hydrophilic property) 표면개발 연구와 더불어 표면에서 물방울의 흐름성을 향상시켜 오염물질을 제거하는 소수성(hydrophobic property) 표면을 갖는 도자타일에 대한 연구가 진행되고 있다. 특히 추가적인 코팅 공정 적용 없이 $1000^{\circ}C$ 이상의 소결 과정을 통해서 소수성을 갖으며, 기존 도자타일의 기계적 물성의 저하가 나타나지 않는 표면유약의 개발이 매우 중요하다. 본 연구에서는 상용화 도자타일의 표면유약에 조성에 구리 분말을 첨가하여 기존 소결 공정을 적용하고, 추가 코팅 공정 없이 소수성 도자타일을 제작하고 표면유약의 두께에 따른 접촉각 특성 변화를 관찰하였다. 구리 분말이 첨가되지 않은 도자타일의 표면 접촉각은 $25^{\circ}$로 친수성을 보이는 반면에 구리 분말이 첨가된 표면유약이 $150{\mu}m$ 두께인 경우에 접촉각이 $109^{\circ}$까지 증가하는 것을 확인하였다. 이와 같은 구리 분말이 첨가된 표면유약의 우수한 소수성 발현은 유약 표면에서 구리 입자의 세포 구조(cellular structure) 분포에 의한 것으로 확인되었다. 또한 개발된 소수성 도자타일의 기계적 물성(꺽임강도, 내화학성, 내마모성, 내동해성)은 기존 도자타일과 거의 동일하고 'KS L 1001 도자타일'의 기준을 만족하는 결과를 얻을 수 있었다.

C0G 온도계수 특성을 가지는 고압용 적층 칩 캐패시티의 유전 및 내전압 특성 (Dielectric Breakdown Voltage and Dielectric Properties of High Voltage Mutilayer Ceramic Capacitor with C0G Temperature Coefficient Characteristics)

  • 윤중락;우병철;정태석
    • 한국전기전자재료학회논문지
    • /
    • 제21권2호
    • /
    • pp.137-143
    • /
    • 2008
  • High voltage MLCCs with C0G temperature coefficient characteristics could apply DC-DC invertor were investigated for its dielectric properties. Also we manufactured MLCC through various process and studied the characteristics of dielectric break down voltage [BDV] and dielectric property as the variation of thickness in the green sheet and how to pattern the internal electrode. As the thickness of green sheet is increase, the dielectric BDV per unit thickness is decreased. But as the pattern of internal electrodes were floated we could manufacture the high voltage MLCC maintained its dielectric BDV a unit.

이속압연된 Cu-3.0Ni-0.7Si 합금의 어닐링에 따른 두께방향으로의 미세조직 및 기계적 특성 변화 (Change in Microstructure and Mechanical Properties through Thickness with Annealing of a Cu-3.0Ni-0.7Si Alloy Deformed by Differential Speed Rolling)

  • 이성희
    • 한국재료학회지
    • /
    • 제28권5호
    • /
    • pp.295-300
    • /
    • 2018
  • Effects of annealing temperature on the microstructure and mechanical properties through thickness of a Cu-3.0Ni-0.7Si alloy processed by differential speed rolling are investigated in detail. The copper alloy with a thickness of 3 mm is rolled to a 50 % reduction at ambient temperature without lubricant and subsequently annealed for 0.5 h at $200-900^{\circ}C$. The microstructure of the copper alloy after annealing is different in the thickness direction depending on the amount of the shear and compressive strain introduced by the rolling; the recrystallization occurs first in the upper roll side and center regions which are largely shear-deformed. The complete recrystallization occurs at an annealing temperature of $800^{\circ}C$. The grain size after the complete recrystallization is finer than that of the conventional rolling. The hardness distribution of the specimens annealed at $500-700^{\circ}C$ is not uniform in the thickness direction due to partial recrystallization. This ununiformity of hardness corresponds well to the amount of shear strain in the thickness direction. The average hardness and ultimate tensile strength has the maximum values of 250 Hv and 450 Mpa, respectively, in the specimen annealed at $400^{\circ}C$. It is considered that the complex mode of strain introduced by rolling directly affects the microstructure and the mechanical properties of the annealed specimens.

Property Changes of Woven Blouse Fabrics by bonding fusible interlinings for a 3D Virtual Try-on System

  • Kim, Myoung-Ok;Park, Myung-Ja
    • 한국의류산업학회지
    • /
    • 제16권6호
    • /
    • pp.1008-1016
    • /
    • 2014
  • This study aims to analyze the changes in the mechanical properties of woven fabrics(cotton, linen, wool, silk, and polyester) by bonding fusible interlinings with varying deniers(10D, 20D, and 30D) for a 3D virtual try-on system(one that a user to try garments through screens using Avatar) developed over the last decade. We experimented with four mechanical properties and thicknesses of twenty-three specimens of interlining bonded fabrics including face fabrics and interlinings by using the KES-FB-AUTO system. The results showed that the tensile property increased(LT and RT increased and WT decreased) as the denier of the interlining increased; however, the change was slight. In contrast, the bending and shear properties increased significantly as the denier of the interlining increased on both the warp and the weft. This showed evidence that the interlining gives the fabrics size stability. The compression property was slight changed as the tensile property varies depending on the fibers and the denier of interlining. As expected, the thickness increased by bonding the interlining as the denier of interlining increased. From these results, we conclude that 3D users need to reflect these changes of woven fabrics by bonding interlinings when they try screen fittings to accurately express the fabric reality of manufactured garment.

사출성형 공정에서 젯팅 현상에 관한 고찰 (A Study on the Jetting Phenomena in Injection Molding Process)

  • 류민영
    • 한국소성가공학회:학술대회논문집
    • /
    • 한국소성가공학회 2002년도 금형가공 심포지엄
    • /
    • pp.125-131
    • /
    • 2002
  • Surface defects in injection molded parts are due to the unsteady flow of polymer melt which are related to the geometries of cavity and gate, the operational conditions of injection and the rheological properties of polymer. In this study we have examined jetting phenomena in injection molding process for three kinds of PCs which have different molecular weight and structure, PBT and PC/ABS alloy with several injection speeds. We have used various cavity shapes that are tensile, flexural and impact test specimens with various gate and cavity thicknesses. Through this study we have observed that the formation of surface defect associated with jetting during filling stage in injection molding is strongly related to die swell. This means that the jetting is strongly affected by the elastic property rather than the viscous property in viscoelastic characteristics of molten polymer. Large die swell would eliminate jetting however, the retardation of die swell would stimulate jetting. In the point of mold design, reducing the thickness ratio of cavity to gate can reduce or eliminate jetting and associated surface defects regardless of magnitude of elastic property. It also enlarges process window that can produce steady flow of polymer melt in injection molding.

  • PDF

Ag 두께에 따른 IGZO/Ag/IGZO 다층 박막의 특성 연구 (Characteristics of IGZO/Ag/IGZO Multilayer Thin Films Depending on Ag Thickness)

  • 장야쥔;김홍배;이상렬
    • 한국전기전자재료학회논문지
    • /
    • 제26권7호
    • /
    • pp.510-514
    • /
    • 2013
  • In order to prevent heat loss that occurs through the glass, low-emissivity (Low-E) coating methods with good insulating properties and high transmittance were used. InGaZnO/Ag/InGaZnO (IGZO/Ag/IGZO) multilayer thin films have been deposited on XG glass substrate by RF magnetron sputtering. Depending on the different thickness of Ag in multilayer films, the structural and optical properties of Low-E multilayer films were analyzed. By XRD analysis results, the multilayer thin films were observed to be amorphous structure regardless of Ag thickness. According to the AFM results, surface morphology of the multilayer films was observed and compared. Using UV-VIS spectroscopy, low emissivity property has been observed clearly with the transmittance of higher than 85% at visible range and lower than 30% at IR range.

자동차용 유리섬유강화 매트 수지(GMT) 범퍼의 충돌성능 평가 수치모사 (Impact Simulation of Automotive GMT Bumper)

  • 백승훈;문종근;정우식;김승조
    • 한국복합재료학회:학술대회논문집
    • /
    • 한국복합재료학회 2003년도 추계학술발표대회 논문집
    • /
    • pp.137-140
    • /
    • 2003
  • Impact of Automotive GMT(Glassfiber reinforced Mat Thermoplastic) Bumper for '5Mhp Barrier Test'was simulated using ls-dyna. The FE model consists of foam which is energy absorber, bumper beam and stay etc. Bumper intrusion and deflection was compared with the experimental results. Effects of uncertainty of material property and deviation of impact velocity were considered and results were compared with those of base design. Effects of number of integration points through th thickness was also investigated.

  • PDF