• Title/Summary/Keyword: Through-hole

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Atomization Characteristics of Intermittent Multi-Hole Diesel Spray Using Time-Resolved PDPA Data

  • Lee, Jeekuen;Shinjae Kang;Park, Byungjoon
    • Journal of Mechanical Science and Technology
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    • v.17 no.5
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    • pp.766-775
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    • 2003
  • The intermittent spray characteristics of a multi-hole diesel nozzle with a 2-spring nozzle holder were investigated experimentally. Without changing the total orifice exit area, the hole number of the multi-hole nozzle varied from 3 (d$\_$n/=0.42 mm) to 5 (d$\_$n/=0.32 mm). The time-resolved droplet diameters of the spray including the SMD (Saute. mean diameter) and the AMD (arithmetic mean diameter), injected intormittently from the multi-hole nozzles into still ambient ai., were measured by using a 2-D PDPA (phase Doppler particle analyze.). The 5-hole nozzle spray shows the smaller spray cone angle, the decreased SMD distributions and the small difference between the SMD and the AMD, compared with that of the 3-hole nozzle spray. From the SMD distributions with the radial distance, the spray structure can be classified into the three regions : (a) the inner region showing the high SMD distribution , (b) the mixing flow region where the shea. flow structure would be constructed : and (c) the outer region formed through the disintegration processes of the spray inner region and composed of fine droplets. Through the SMD distributions along the spray centerline, it reveals that the SMD decreases rapidly after showing the maximum value in the vicinity of the nozzle tip. The SMD remains the constant value near the Z/d$\_$n/=166 and 156.3 for the 3-hole and 5-hole nozzles, which illustrate that the disintegration processes of the 5-hole nozzle spray proceed more rapidly than that of the 3-hole nozzle spray.

Analysis of Deformation Surrounding the Pierced Hole in the Tube Hydro-Piercing Process (하이드로 피어싱된 튜브 부위의 변형해석)

  • 최성기;김동규;문영훈
    • Transactions of Materials Processing
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    • v.13 no.2
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    • pp.154-159
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    • 2004
  • Deformation surrounding the hole in the tube during the hydropiercing process has been investigated in this study. The tube is expanded and internally pressurized between upper and lower dies, and a piercing punch is driven forcefully through a cross passage in the die and through the wall of the tube. The pressurized fluid within the tube provides support to the wall of the tube during a piercing step to form a hole in the tube having less deformation surrounding the hole in the tube. The deformation area may be fully retracted to a substantially flat form or partially retracted to a countersunk form. In this study, a mathematical model that can predict deformation surrounding the hole has been proposed and experimentally verified by actual hydropiercing test.

Analytical-numerical formula for estimating the characteristics of a cylindrical NaI(Tl) gamma-ray detector with a side-through hole

  • Thabet, Abouzeid A.;Badawi, Mohamed S.
    • Nuclear Engineering and Technology
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    • v.54 no.10
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    • pp.3795-3802
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    • 2022
  • NaI(Tl) scintillation materials are considered to be one of many materials that are used exclusively for γ-ray detection and spectroscopy. The gamma-ray spectrometer is not an easy-to-use device, and the accuracy of the numerical values must be carefully checked based on the rules of the calibration technique. Therefore, accurate information about the detection system and its effectiveness is of greater importance. The purpose of this study is to estimate, using an analytical-numerical formula (ANF), the purely geometric solid angle, geometric efficiency, and total efficiency of a cylindrical NaI(Tl) γ-ray detector with a side-through hole. This type of detector is ideal for scanning fuel rods and pipelines, as well as for performing radio-immunoassays. The study included the calculation of the complex solid angle, in combination with the use of various points like gamma sources, located axially and non-axially inside the through detector side hole, which can be applied in a hypothetical method for calibrating the facility. An extended γ-ray energy range, the detector, source dimensions, "source-to-detector" geometry inside the side-through hole, path lengths of γ-quanta photons crossing the facility, besides the photon average path length inside the detector medium itself, were studied and considered. This study is very important for an expanded future article where the radioactive point source can be replaced by a volume source located inside the side-trough hole of the detector, or by a radioactive pipeline passing through the well. The results provide a good and useful approach to a new generation of detectors that can be used for low-level radiation that needs to be measured efficiently.

A Study on Micro Hole Punching with Soft Die Plate (소프트 다이 플레이트를 이용한 미세 구멍 펀칭 연구)

  • Yoo J. H.;Joo B. Y.;Jeon B. H.;Oh S. I.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2002.02a
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    • pp.260-265
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    • 2002
  • In micro hole punching process, it is very difficult to align punch with die hole. Misalignment can cause a falling-on in hole quality and breakage of punch and die. Micro punching using soft die plate without a die hole has a big advantage because it is not necessary to align punch with die hole and to consider die clearance. Soft die plates are made by polymers or hard rubbers which are softer than metals. In this study, several micro punching experiments are conducted. Micro punching test with some materials shows that micro hole punching is feasible with some soft die plates. Through the section shape obtained by mounting and polishing, the punched hole quality is measured and the shapes of burr and dome we studied.

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An Experimental Investigation on the Flow Field around the Wing Having a Circular Damage Hole (원형 손상 구멍이 있는 날개 주위 유동장에 관한 실험적 연구)

  • Lee, Ki-Young
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.36 no.10
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    • pp.954-961
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    • 2008
  • An experimental study has been conducted to investigate the flow field around the wing having a circular damage hole. The damage was represented by a circular hole passing through the model with 10% airfoil chord diameter and normal to the chord. The hole was centered at quarter or half chord. The PIV flow fields and static pressure measurements on the wing upper and lower surface were carried out at Rec=2.85×105 based on the chord length. The PIV results showed the two types of flow structures around a damage hole were formed. The first one was a weak jet that formed an attached wake behind the damage hole. The second one resulted from increased incidence; this was a strong jet where the flow through the hole penetrates into the free-stream resulting in extensive separation of oncoming boundary layer flow and development of a separated wake with reverse flow. The surface pressure data showed a big pressure alteration near the circular damage hole. The severity of pressure alteration was increased as a damage hole located nearer to the leading edge.

The Cooling Characteristics for Circular Irradiation Hole under Suppressing Jet Flow at Guide Tube in HANARO (안내관 제트유동 억제시의 하나로 원형 조사공의 냉각특성)

  • Wu S. I.;Park P. C.
    • 한국전산유체공학회:학술대회논문집
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    • 2004.03a
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    • pp.208-213
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    • 2004
  • The HANARO, multi-purpose research reactor, 30 MWth open-tank-in- pool type, is under normal operation since it reached the initial critical in February 1995. The HANARO is planning to produce a fission moly-99 of radio isotopes, a mother nuclide of Tc-99m, a medical isotope and is under developing a target handling tool for loading and unloading it in a circular flow tube (OR-5). A guide tube is extended from the reactor core to the top of the reactor chimney for easily un/loading a target under the reactor normal operation. But active coolant through the core can be quickly raised up to the top of the chimney through the guide tube by jet flow. This paper is described an analytical analysis to calculate the hole size of a orifice inserted in the circular irradiation hole and to study the flow characteristics through the guide tube under reactor normal operation and loading the target. As results, the results show that the hole size of orifice was 31 mm of the inner diameter to suppress the guide tube jet flow and the coolant safely cooled the target of fission moly after inserting the orifice to the flow tube.

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Intermittent Atomization Characteristics of Multi-Hole and Single-Hole Diesel Nozzle

  • Lee, Jeekuen;Kang, Shin-Jae;Park, Byungjoon
    • Journal of Mechanical Science and Technology
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    • v.16 no.12
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    • pp.1693-1701
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    • 2002
  • The intermittent spray characteristics of a multi-hole and a single-hole diesel nozzle were experimentally investigated. The hole number of the multi-hole nozzle was 5, and the hole diameter of the 5-hole and the single-hole nozzle was the same as d$\_$n/=0.32 ㎜ with the constant hole length to diameter ratio(l$\_$n//d$\_$n/=2.81). The droplet diameters of the spray, including the time-resolved droplet diameter, SMD (Sauter mean diameter) and AMD (arithmetic mean diameter) , injected intermittently from the two nozzles into the still ambient were measured by using a 2-D PDPA (phase Doppler particle analyzer). Through the time-resolved evolutions of the droplet diameter, it was found that the structure of the multi-hole and the single-hole nozzle spray consisted of the three main parts : (a) the leading edge affected by surrounding air. and composed of small droplets; (b) the central part surrounded by the leading edge and mixing flow region and scarcely affected by the resistance of air, (c) the trailing edge formed by the passage of the central part. The SMD decreases gradually with the increase in the radial distance, and the constant value is obtained at the outer region of the radial distance (normalized by hole diameter) of 7-8 and 6 for the 5-hole and single-hole nozzle, respectively. The SMD along the centerline of the spray decrease shapely with the increase in the axial distance after showing the maximum value near the nozzle tip. The SMD remains the constant value near the axial distance(normalized by hole diameter) of 150 and 180 for the 5-hole and the single-hole nozzle, respectively.

Electrochemical Deburring System by the Electroplated CBN Wheel (입방정질화붕소입자 전착지석에 의한 전해디버링 시스템)

  • Choe, In-Hyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.21 no.3
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    • pp.430-438
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    • 1997
  • Deburring and edge finishing technology as the final process of machining operation is required for manufacturing of advanced precise conponents. But, deburring is considered as a difficult problem on going to the high efficient production and automation in the FMS. Removal of burr couldn't have a standard of its definition because of its various shapes, dimensions and properties and mostly depends on manual treatment. Especially, deburring for cross hole inside is very difficult owing to its shape passing through out perpendicular to a main hole. The electrochemical method is suggested as its solution in practical aspect. Therefore, electrochemical deburring technology needs to be developed for the high efficiency and automation of internal deburring in the cross hole. In this study, the new process in the eliminating burr inside cross hole, electrochemical deburring by the wheel electroplated with Cubic-Boron-Nitrade abrasives, is suggested. Its deburring mechanism is described and machining performances is investigated. Also, CBN electroplated wheel is designed and manufactured and then characteristics of electrochemical deburring are investigated through experiments. Overall electrochemical deburring performance against burr inside cross hole is examined in the various power sources such as peak current and direct current.

Determination of Residual Stress by the Hole Drilling Method Based on Displacement Measurement (변위 측정을 기본으로 한 구멍뚫기방법에 의한 잔류응력 측정 방법)

  • Shin, Dong Il;Joo, Jin Won
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.29 no.11 s.242
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    • pp.1542-1550
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    • 2005
  • This paper presents the numerical procedure for calculating non-uniform residual stresses based on relieved displacements obtained from incremental hole drilling. The relationship between the in-plane displacement produced by introducing a blind hole and the corresponding residual stress is established. Finite element calculations are described to evaluate the relieved coefficients required for the determination of non-uniform residual stresses. Validity of the proposed method has been tested through three axisymmetric test examples and two three-dimensional examples. As a result of . simulation on the test examples, it is found that this numerical procedure is well adopted to measuring non-uniform residual stress in the full hole depth range of the hole diameter from the surface. The accuracy of the hole drilling method with displacement measurement is discussed, comparing tile method with strain measurement

Fabrication of Through-hole Interconnect in Si Wafer for 3D Package (3D 패키지용 관통 전극 형성에 관한 연구)

  • Kim, Dae-Gon;Kim, Jong-Woong;Ha, Sang-Su;Jung, Jae-Pil;Shin, Young-Eui;Moon, Jeong-Hoon;Jung, Seung-Boo
    • Journal of Welding and Joining
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    • v.24 no.2
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    • pp.64-70
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    • 2006
  • The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.