• 전기전자학회논문지
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• 제20권2호
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• pp.192-195
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• 2016

본 논문에서는 저항과 BJT를 사용하지 않고 sub-threshold 영역에서 동작하는 저전압, 저전력 기준전압 발생기를 설계하였다. CTAT 전압 발생기는 두 개의 NMOS 트랜지스터를 이용하여 구성하였고, 충분한 영역의 CTAT 전압을 발생시키기 위해 바디 바이어스 회로를 이용하였다. PTAT 전압 발생기는 PTAT 전압을 생성하기 위해 MOS 트랜지스터 입력 쌍의 서로 다른 사이즈 비를 이용하는 차동증폭기 형태로 구성하였다. 제안한 회로는 $0.18-{\mu}m$ 표준 CMOS 공정으로 설계되었다. 시뮬레이션 결과로 290mV의 출력 기준 전압을 가지며, -$20^{\circ}C$ 에서 $120^{\circ}C$의 온도 변화에서 92 ppm/$^{\circ}C$의 전압 변화 지수와 전원전압 0.63V에서 15.7nW의 소모 전력을 갖는 것을 확인하였다.

• Asian-Australasian Journal of Animal Sciences
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• 제28권7호
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• pp.943-950
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• 2015

Heat stress has adverse effects on fertility of dairy animals. Decline in fertility is linearly associated with an increase in combination of both temperature and humidity. The purpose of this study was to investigate the relationship between temperature humidity index (THI) and the pregnancy rate of Murrah buffaloes in a subtropical climate. The effects of genetic and non-genetic factors viz., sire, parity, period of calving and age group at first calving were found non-significant on pregnancy rate. The effect of THI was found significant (p<0.001) on pregnancy rate of Murrah buffaloes calved for first time and overall pregnancy rate. The threshold THI affecting the pregnancy rate was identified as THI 75. The months from October to March showed THI<75 and considered as non heat stress zone (NHSZ), while months from April to September were determined as heat stress zone (HSZ) with $THI{\geq}75$. The lowest overall pregnancy rate (0.25) was obtained in July with THI 80.9, while the highest overall pregnancy rate (0.59) was found in November with THI 66.1. May and June were identified as critical heat stress zone (CHSZ) within the HSZ with maximum decline (-7%) in pregnancy rate with per unit increase in THI. The highest overall pregnancy rate was estimated as 0.45 in NHSZ with THI value 56.7 to 73.2. The pregnancy rate was found to have declined to 0.28 in HSZ with THI 73.5 to 83.7. However, the lowest pregnancy rate was estimated as 0.27 in CHSZ with THI value 80.3 to 81.6.

• 한국세라믹학회지
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• 제49권2호
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• pp.173-178
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• 2012

The $Y_2O_3$ ceramics have been widely used as plasma resistant materials in the semiconductor industry. In this study, composites made of plasma resistant $Y_2O_3$ and electrically conductive carbon have been produced. The electrical properties of this composite were measured with respect to the size, volume fraction of the conductive carbon phase, and sintering temperature. When micro-sized carbon was used, the composites were insulating up to 5 wt% addition of the carbon. However, when nano-sized carbon of around 60 ~100 nm was used, the composites became conductive over threshold volume fraction of carbon, which increased with increasing sintering temperature. This behavior of electrical conductivity of the composites was discussed in terms of the percolation theory. The percolation threshold of the conductivity seemed to be affected by the grain growth and coalescences of dispersed conductive carbon phases with grain growth of matrix $Y_2O_3$.

• E2M - 전기 전자와 첨단 소재
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• 제9권1호
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• pp.30-37
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• 1996

Previously, crystallization of a-Si:H films on glass substrates were limited to anneal temperature below 600.deg. C, over 10 hours to avoid glass shrinkage. Our study indicates that the crystallization is strongly influenced by anneal temperature and weakly affected by anneal duration time. Because of the high temperature process and nonconducting substrate requirements for poly-Si TFTs, the employed substrates were limited to quartz, sapphire, and oxidized Si wafer. We report on poly-Si TFT's using high temperature anneal on a Si:H/Mo structures. The metal Mo substrate was stable enough to allow 1000.deg. C anneal. A novel TFT fabrication was achieved by using part of the Mo substrate as drain and source ohmic contact electrode. The as-grown a-Si:H TFT was compared to anneal treated poly-Si TFT'S. Defect induced trap states of TFT's were examined using the thermally stimulated current (TSC) method. In some case, the poly-Si grain boundaries were passivated by hydrogen. A-SI:H and poly-Si TFT characteristics were investigated using an inverted staggered type TFT. The poly -Si films were achieved by various anneal techniques; isothermal, RTA, and excimer laser anneal. The TFT on as grown a-Si:H exhibited a low field effect mobility, transconductance, and high gate threshold voltage. Some films were annealed at temperatures from 200 to >$1000^{\circ}C$ The TFT on poly-Si showed an improved $I_on$$I_off$ ratio of $10_6$, reduced gate threshold voltage, and increased field effect mobility by three orders. Inverter operation was examined to verify logic circuit application using the poly Si TFTs.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2001년도 추계학술대회 논문집
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• pp.282-286
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• 2001

In this study, CT specimens were prepared from spring steel(SUP9) processed shot peening which was room temperature, low temperature and high temperature experiment. And we got the following characteristics from fatigue crack growth test carried out in the environment of room, low temperature and high temperature at $25^{\circ}C$,$-30^{\circ}C$,$-50^{\circ}C$,$-70^{\circ}C$ and $-100^{\circ}C$ in the range of stress ratio of 0.05 by means of opening mode displacement. The threshold stress intensity factor range $\Delta K_{th}$ in the early stage of fatigue crack growth (Region I ) and stress intensity factor range $\Delta K$ in the stable of fatigue crack growth (Region II) was decreased in proportion to descend temperature. It assumed that the fatigue resistance characteristics and fracture strength at low temperature and high temperature is considerable higher than that of room temperature in the early stage and stable of fatigue crack growth region.

• 대한원격탐사학회:학술대회논문집
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• 대한원격탐사학회 2006년도 Proceedings of ISRS 2006 PORSEC Volume II
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• pp.574-577
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• 2006

In this paper, we developed a forest fire detection algorithm which uses a regression function between NDVI and land surface temperature. Previous detection algorithms use the land surface temperature as a main factor to discriminate fire pixels from non-fire pixels. These algorithms assume that the surface temperatures of non-fire pixels are intrinsically analogous and obey Gaussian normal distribution, regardless of land surface types and conditions. And the temperature thresholds for detecting fire pixels are derived from the statistical distribution of non-fire pixels’ temperature using heuristic methods. This assumption makes the temperature distribution of non-fire pixels very diverse and sometimes slightly overlapped with that of fire pixel. So, sometimes there occur omission errors in the cases of small fires. To ease such problem somewhat, we separated non-fire pixels into each land cover type by clustering algorithm and calculated the residuals between the temperature of a pixel under examination whether fire pixel or not and estimated temperature of the pixel using the linear regression between surface temperature and NDVI. As a result, this algorithm could modify the temperature threshold considering land types and conditions and showed improved detection accuracy.

• 한국응용곤충학회지
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• 제61권4호
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• pp.577-590
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• 2022

콩줄기명나방은 콩과작물 특히 팥을 가해하는 해충으로 알려져 있다. 본 연구는 온도가 콩줄기명나방의 발육단계별 발육기간, 성충의 수명과 산란특성에 미치는 영향을 파악하고자 7, 10, 13, 16, 19, 22, 25, 28, 31, 34, 36℃ 항온조건에서 조사하였다. 알과 유충은 7, 10, 13℃를 제외한 항온조건에서 다음 생애단계로 성공적으로 발육하였다. 알, 유충, 번데기의 발육기간은 온도가 상승할수록 짧아지는 경향을 보였다. 콩줄기명나방 발육단계별 발육 최저, 최고 한계는 LRF와 SSI모델을 이용하여 계산하였고 발육영점온도와 유효적산온일도는 선형회귀분석을 이용하였다. 1령 유충 부화부터 성충출현까지의 발육영점온도와 유효적산온일도는 13.5℃와 384.5DD로 추정되었다. SSI모델을 이용한 부화부터 성충출현까지 발육 최저 및 최고온도는 19.4℃과 39.8℃였고 이들간의 차이 즉 발육적정온도범위는 20.4℃였다. 성충은 16℃와 34℃ 범위에서 부화하는 알을 생산하였고, 25℃에서 최대 약 416마리의 자손을 낳았다. 노화율, 나이별 생존율, 나이별 누적산란율, 온도의존 산란수에 관련된 성충모델들이 작성되었다. 본 연구에서 제시한 온도발육모형과 산란모형은 야외에서 콩줄기명나방의 개체군동태를 이해하고 콩과작물의 종합적인 해충군관리체계를 마련하는데 기초기반자료로 활용될 것으로 기대된다.

• 터널과지하공간
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• 제6권2호
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• pp.101-121
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• 1996

The thermomechanical characteristics of rocks such as temperature dependency of strength and deformation were experimentally investigated using Iksan granite, Cheonan tonalite and Chung-ju dolomite for proper design and stability analysis of underground structures subjected to temperature changes. For the temperature below critical threshold temperature $T_c$, the variation of uniaxial compressive strength, Young's modulus, Brazilian tensile strength and cohesion with temperature were slightly different for each rock type, but these mechanical properties decreased at the temperatures above $T_c$ by the effect of thermal cracking. Tensile strength was most affected by $T_c$, and uniaxial compressive strength was least affected by $T_c$. To the temperature of 20$0^{\circ}C$ with the confining prressure to 150 kg/$\textrm{cm}^2$, failure limit on principal stress plane and failure envelope on $\sigma$-$\tau$ plane of Iksan granite were continuously lowered with increasing temperature but those of Cheonan tonalite and Chung-ju dolomite showed different characteristics depending on minor principal stress on principal stress plane and normal stress on $\sigma$-$\tau$ plane. The reason for this appeared to be the effect of rock characteristics and confining pressure. Young's modulus was also temperature and pressure dependent, but the variation of Young's modulus was about 10%, which was small compared to the variation of compressive strength. In general, Young's modulus increased with increasing confining pressure and increased or decreased with increasing temperature to 20$0^{\circ}C$ depending on the rock type.

• Journal of Advanced Marine Engineering and Technology
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• 제25권6호
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• pp.1228-1236
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• 2001

In this study, CT specimens were prepared from ASTH A5l6 steel which was used for pressure vessel plates for moderate and lower temperature service. And we got the fellowing characteristics from fatigue crack growth test carried out in the environment of room and low temperature at $25^{\circ}C$ , $-30^{\circ}C$, $-60^{\circ}C$, $-80^{\circ}C$, $-100^{\circ}C$ and $-120^{\circ}C$ and in the range of stress ratio of 0.1, 0.3 by means of opening mode displacement. At the constant stress ratio, the Threshold stress intensity factor range ΔAKth in the early stage of fatigue crack growth (Region I) and stress intensity factor range $\DeltaK$ in the stable of fatigue crack growth (Region II) was increased in proportion to descend temperature. It assumed that the fatigue resistance characteristics and fracture strength at low temperature is considerable higher than that of room temperature in the early stage and stable of fatigue crack growth region. The straight line slope relation of logarithm da/dN-$\Delta$K in Region II that is, the fatigue clack growth exponent m increased with descending temperature at the constant stress ratio. It assumed that the fatigue crack growth rate da/dN is rapid in proportion to descend temperature in Region II and the cryogenic-brittleness greatly affect a material with decreasing temperature.

• 대한임베디드공학회논문지
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• 제4권2호
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• pp.55-62
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• 2009

The power consumption of a high-end microprocessor increases very rapidly. High power consumption will lead to a rapid increase in the chip temperature as well. If the temperature reaches beyond a certain level, chip operation becomes either slow or unreliable. Therefore various approaches for Dynamic Thermal Management (DTM) have been proposed. In this paper, we propose a learning based temperature prediction scheme for a multi-core system. In this approach, from repeatedly executing an application, we learn the thermal patterns of the chip, and we control the temperature in advance through DTM. When the predicted temperature may go beyond a threshold value, we reduce the temperature by decreasing the operation frequencies of the corresponding core. We implement our temperature prediction on an Intel's Quad-Core system which has integrated digital thermal sensors. A Dynamic Frequency System (DFS) technique is implemented to have four frequency steps on a Linux kernel. We carried out experiments using Phoronix Test Suite benchmarks for Linux. The peak temperature has been reduced by on average $5^{\circ}C{\sim}7^{\circ}C$. The overall average temperature reduced from $72^{\circ}C$ to $65^{\circ}C$.