Effects of Sintering Temperature on the Electrical Conductivities of the Y2O3-Carbon Composites
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Choi, Kwan-Young
(School of Materials Science & Engineering, Inha University)
Oh, Yoon-Suk (Korea Institute of Ceramic Engineering and Technology) Kim, Sung-Won (Korea Institute of Ceramic Engineering and Technology) Kim, Hyung-Sun (School of Materials Science & Engineering, Inha University) Park, Chong-Hun (Komico) Lee, Sung-Min (Korea Institute of Ceramic Engineering and Technology) |
1 | Y. Kobayashi, "Current Status and Needs in the Future of Ceramics Used for Semiconductor Production Equipment," p. 17, Osaka, Japan, July, 2005, The 37th Seminar on High Temperature Ceramics, 2005. |
2 | N. Ito, T. Moriya, F. Uesugi, M. Matsumoto, S. Liu, and Y. Kitayama, "Reduction of Particle Contamination in Plasma-Etching Equipment by Dehydration of Chamber Wall,'' Jpn. J. Appl. Phys., Part I, 47 [5] 3630-4 (2008). DOI |
3 | M. Schaepkens, R. C. M. Bosch, T. E. F. M. Standaert, G. S. Oehrlein, and J. M. Cook, ''Influence of Reactor Wall Conditions on Etch Processes in Inductively Coupled Fluorocarbon Plasmas,'' J. Vac. Sci. Technol. A., 16 [4] 2099-107 (1998) |
4 | D. M. Kim, S. H. Lee, W. B. Alexander, K. B. Kim, Y. S. Oh, and S. M. Lee, "X-Ray Photoelectron Spectroscopy Study on the Interaction of Yttrium-Aluminum Oxide with Fluorine-Based Plasma," J. Am. Ceram. Soc., 94 [10] 3455-9 (2011). DOI |
5 | D. M. Kim, S. Y. Yoon, K. B. Kim, H. S. Kim, Y. S. Oh, and S. M. Lee, "Plasma Resistance of Yttria Deposited by EBPVD Method (in Korean)," J. Kor. Ceram. Soc., 45 [11] 707-12 (2008). DOI |
6 | K. B. Kim, D. M. Kim, J. K. Lee, Y. S. Oh, H. T. Kim, H. S. Kim, and S. M. Lee, ''Erosion Behavior of YAG Ceramics under Fluorine Plasma and their XPS Analysis (in Korean),'' J. Kor. Ceram. Soc., 46 [5] 456-61 (2009). DOI |
7 |
D. M. Kim, Y. S. Oh, S. W. Kim, H. T. Kim, D. S. Limand, and S. M. Lee, "The Erosion Behaviors of |
8 |
D. M. Kim, K. B. Kim, S. Y. Yoon, Y. S. Oh, H. T. Kim, and S. M. Lee, "Effects of Artificial Pores and Purity on the Erosion Behaviors of Polycrystalline |
9 | J. Iwasawa, R. Nishimizu, M. Tokita, M. Kiyohara, and K. Uematsu, "Plasma Resistant Dense Yttrium Oxide Film Prepared by Aerosol Deposition Process," J. Am. Ceram. Soc., 90 [8] 2327-32 (2007). DOI |
10 | B. K. Lee, D. S Park, W. H. Yoon, J. h. Ryu, B. D. Hahn, and J. J. Choi, "Microstructure and Properties of Yttria Film Prepared by Aerosol Deposition (in Korean)," J. Kor. Ceram. Soc., 46 [5] 441-7 (2009). DOI |
11 |
W. J. Kim, M. Taya, K. Yamada, and N. Kamiya, "Percolation Study on Electrical Resistivity of |
12 | R. P. Kusy "Influence of Particle Size Ratio on the Continuity of Aggregates," J. Appl. Phys., 48 [12] 5301-5 (1977). DOI |
13 | Da He and N. N. Ekere "Effect of Particle Size Ratio on the Conducting Percolation Threshold of Granular Conductive- Insulating Composites," J. Appl. Phys., 37 [13] 1848-52 (2004). |
14 | W. W. Mullins, "The Statistical Self-Similarity Hypothesis in Grain Growth and Particle Coarsening," J. Appl. Phys., 59 [4] 1341-49 (1986). DOI |
15 | A. Malliaris and D. Turner, "Influence of Particle Size on the Electrical Resistivity of Compacted Mixtures of Polymeric and Metallic Powders," J. Appl. Phys., 42 [2] 614-18 (1971). DOI |
16 |
L. C. Stearns, J. h. Zhao, and M. P. Harmer "Processing and Microstructure Development in |
17 | S. J. Kang, Sintering : Densification, Grain Growth, and Microstructure, pp. 95-6, Elsevier Butterworth-Heinemann, London, 2005. |
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