• Title/Summary/Keyword: Thin-film technology

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Synthesis and Characterization of Quinoxaline-Based Thiophene Copolymers as Photoactive Layers in Organic Photovoltaic Cells

  • Choi, Yoon-Suk;Lee, Woo-Hyung;Kim, Jae-Ryoung;Lee, Sang-Kyu;Shin, Won-Suk;Moon, Sang-Jin;Park, Jong-Wook;Kang, In-Nam
    • Bulletin of the Korean Chemical Society
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    • v.32 no.2
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    • pp.417-423
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    • 2011
  • A series of new quinoxaline-based thiophene copolymers (PQx2T, PQx4T, and PQx6T) was synthesized via Yamamoto and Stille coupling reactions. The $M_ws$ of PQx2T, PQx4T, and PQx6T were found to be 20,000, 12,000, and 29,000, with polydispersity indices of 2.0, 1.2, and 1.1, respectively. The UV-visible absorption spectra of the polymers showed two distinct absorption peaks in the ranges 350 - 460 nm and 560 - 600 nm, which arose from the ${\pi}-{\pi}^*$ transition of oligothiophene units and intramolecular charge transfer (ICT) between a quinoxaline acceptor and thiophene donor. The HOMO levels of the polymer ranged from -5.37 to -5.17 eV and the LUMO levels ranged from -3.67 to -3.45 eV. The electrochemical bandgaps of PQx2T, PQx4T, and PQx6T were 1.70, 1.71, and 1.72 eV, respectively, thus yielding low bandgap behavior. PQx2T, PQx4T, and PQx6T had open circuit voltages of 0.58, 0.42, and 0.47 V, and short circuit current densities of 2.9, 5.29 and 9.05 mA/$cm^2$, respectively, when $PC_{71}BM$ was used as an acceptor. For the solar cells with PQx2T-PQx6T:$PC_{71}BM$ (1:3) blends, an increase in performance was observed in going from PQx2T to PQx6T. The power conversion efficiencies of PQx2T, PQx4T, and PQx6T devices were found to be 0.69%, 0.73%, and 1.80% under AM 1.5 G (100 mW/$cm^2$) illumination.

A Study of Photoelectrolysis of Water by Use of Titanium Oxide Films (산화티타늄 피막의 광 전기분해 특성에 관한 연구)

  • Park, Seong-Young;Cho, Byung-Won;Ju, Jeh-Beck;Yun, Kyung-Suk;Lee, Eung-Cho
    • Applied Chemistry for Engineering
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    • v.3 no.1
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    • pp.88-99
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    • 1992
  • For the development of semiconducting photoelectrode to be more stable and efficient in the process of photoelectrolysis of the water, pure titanium rods were oxidized by anodic oxidation, furance oxidation and flame oxidation and used as electrodes. The Indium islands were formed by electrodeposition of "In" thin film on $TiO_2$ and Ti by electrodeposition. Also $A1_2O_3$ and NiO islands were coated on Ti by the electron-beam evaporation technique. The maximum photoelectrochemical conversion efficiency(${\eta}$) was 0.98% for flame oxidized electrode($1200^{\circ}C$ for 2min in air). Anodically oxidized electrodes have photoelectrochemical conversion efficiency of 0.14%. Furnace oxidized electrode($800^{\circ}C$ for 10min in air) has 0.57% of photoelectrochemical efficiency and shows a band-gap energy of about 2.9eV. The $In_2O_3$ coated $TiO_2$ exhibits 0.8% of photoelectrochemical efficiency but much higher value of ${\eta}$ was obtained with the Increase of applied blas voltage. However, $Al_2O_3$ or NiO coated $TiO_2$ shows much low value of ${\eta}$. The efficiency was dependent on the presence of the metallic interstitial compound $TiO_{0+x}$(x<0.33) at the metal-semiconductor interface and the thickness of the suboxide layer and the external rutile scale.

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Sn-Ag-Cu Solder Joint Properties on Plasma Coated Organic Surface Finishes and OSP (플라즈마 유기막과 OSP PCB 표면처리의 Sn-Ag-Cu 솔더 접합 특성 비교)

  • Lee, Tae-Young;Kim, Kyoung-Ho;Bang, Jung-Hwan;Park, Nam-Sun;Kim, Mok-Soon;Yoo, Sehoon
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.3
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    • pp.25-29
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    • 2014
  • Plasma organic thin film for PCB surface finish is a potential replacement of the conventional PCB finishes because of environment-friendly process, high corrosion-resistance and long shelf life over 1 year. In this study, solder joint properties of the plasma organic surface finish were estimated and compared with OSP surface finish. The plasma surface finish was deposited by chemical vapor deposition from fluorine-based precursors. The thickness of the plasma organic coating was 20 nm. Sn-3.0Ag-0.5Cu (SAC305) solder was used as solder joint materials. From a salt spray test, the plasma organic coating had higher corrosion resistance than the OSP surface finish. The spreadability of SAC305 on plasma organic coating was higher than that on OSP surface finish. SEM and TEM micrographs showed that the interfacial microstructure of the plasma surface finish sample were similar to that of the OSP sample. Solder joint strength of the plasma finish sample was also similar to that of the OSP finished sample.

Characteristics of Constructed SPR (Surface Plasmon Resonance) Sensor System for the Detection of Salmonella and hIgG Antigen-Antibody Reaction. (살모넬라와 면역글로블린(hIgG)의 항원-항체반응 감지를 위한 표면 플라즈몬 공명형 센서시스템의 특성)

  • Um, N.S.;Koh, K.N.;Hahm, S.H.;Kim, J.H.;Lee, S.H.;Kang, S.W.
    • Journal of Sensor Science and Technology
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    • v.7 no.4
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    • pp.263-270
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    • 1998
  • Surface Plasmon Resonance (SPR) sensor system, has rapid response and high sensitivity, can be applicable for detecting reaction times of many biospecific interactions. A SPR sensor system was constructed to detect the antigen-antibody reactions of salmonella and hIgG (human immunoglobulin G). Sensor chips made of gold thin film were used for detecting biological bindings of antigen and antibody reactions. The antigen and antibody reactions for salmonella and hIgG were carried out with various time intervals to observed characteristics of these reactions using SPR sensor system. The resonance angle shift changes were clearly observed at the time of salmonella or hIgG antibody injection into sample cell since each antibody was self-assembled on gold chip surface of the sensor. It was found that the antibodies of salmonella and hIgG reacted with its sensor chip surface in 10 minutes and 60 minutes respectively. And the antigens of both salmonella and hIgG were bound to its antibody within 1 minute.

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Fabrication of Poly(methyl methacrylate) Beads Monolayer Using Rod-coater and Effects of Solvents, Surfactants and Plasma Treatment on Monolayer Structure (Rod 코팅을 이용한 Poly(methyl methacrylate) 비드의 단일층 형성 및 단일층 구조에 미치는 용매, 계면활성제, 플라즈마 처리의 영향)

  • Kim, Da Hye;Ham, Dong Seok;Lee, Jae-Heung;Huh, Kang Moo;Cho, Seong-Keun
    • Journal of Adhesion and Interface
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    • v.20 no.1
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    • pp.1-8
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    • 2019
  • Fabrication of monolayer is important method for enhancing physical and chemical characteristics such as light shielding and antireflection while maintaining thin film properties. In previous studies, monolayers were fabricated by various methods on small substrates, but processes were complicated and difficult to form monolayers with large area. We used rod coating equipment with a small amount of coating liquid to form a HCP (hexagonal closed packing) coating of PMMA beads on PET(poly(ethylene terephthalate)) substrate with $20cm{\times}20cm$ size. We observed that changes in morphologies of monolayers by using the solvents with different boiling points and vapor pressures, by adapting surfactants on particles and by applying plasma treatment on substrates. The coverage was increased by 20% by optimizing the coating conditions including meniscus of beads, control of the attraction - repulsion forces and surface energy. This result can potentially be applied to optical films and sensors because it is possible to make a uniform and large-scale monolayer in a simple and rapid manner when it is compared to the methods in previous studies.

High Transparent Planar Dipole Antenna using Ionized Salt-water of ASA Structure (이온화된 소금물을 이용한 ASA 구조의 고 투명 평면형 다이폴 안테나)

  • Phan, Duy Tung;Jung, Chang Won
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.22 no.3
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    • pp.492-498
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    • 2021
  • This feasibility study evaluated an optically transparent planar antenna using liquid salt-water as the conducting material. The most significant reason behind using liquid salt-water for transparent antenna applications is its excellent average optical transparency (OTav) (> 95% at a salinity of 40 ppt) compared to other typical solid transparent thin-film electrodes, such as indium tin oxide (ITO:> 73%) or multi-layer films (MLF: > 78%). Each conductive arm of the proposed dipole is constructed from a salt-water layer held between two clear planar acrylic layers (��r = 2.61, tan�� = 0.01, OTav > 90%) (acrylic/salt-water/acrylic; ASA) due to surface tension. To examine the electrical and optical properties of the ASA structure, the surface tension was measured to determine the thickness of the salt-water layer that finalized its sheet resistance and OTav. The average gain and efficiency of the antenna were 1.72 dBi and 74%, respectively, in the operating UHF (Ultra high frequency) band (470-771 MHz). Therefore, the proposed antenna can be a good candidate for applications as a transparent planar antenna using salt-water.

Enhancements of Crystallization and Opto-Electrical performance of ZnO/Ti/ZnO Thin Films (ZnO/Ti/ZnO 박막의 결정성 및 전기광학적 완성도 개선 연구)

  • Jin-Kyu Jang;Yu-Sung Kim;Yeon-Hak Lee;Jin-Young Choi;In-Sik Lee;Dae-Wook Kim;Byung-Chul Cha;Young-Min Kong;Daeil Kim
    • Journal of the Korean institute of surface engineering
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    • v.56 no.2
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    • pp.147-151
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    • 2023
  • Transparent ZnO (100 nm thick) and ZnO/Ti/ZnO (ZTZ) films were prepared with radio frequency (RF) and direct current (DC) magnetron sputtering on the glass substrate at room temperature. During the ZTZ film deposition, the thickness of the Ti interlayer was varied, such as 6, 9, 12, and 15 nm, while the thickness of ZnO films was kept at 50 nm to investigate the effect of the Ti interlayer on the crystallization and opto-electrical performance of the films. From the XRD pattern, it is concluded that the 9 nm thick Ti interlayer showed some characteristic peaks of Ti (200) and (220), and the grain size of the ZnO (002) enlarged from 13.32 to 15.28 nm as Ti interlayer thickness increased. In an opto-electrical performance observation, ZnO single-layer films show a figure of merit of 1.4×10-11 Ω-1, while ZTZ films with a 9 nm-thick Ti interlayer show a higher figure of merit of 2.0×10-5 Ω-1.

Photocurrent study on the splitting of the valence band and growth of MgGa2Se4 single crystal thin film by hot wall epitaxy (Hot Wall Epitaxy(HWE)법에 의한 MgGa2Se4 단결정 박막 성장과 가전자대 갈라짐에 대한 광전류 연구)

  • Kim, Hyejeong;Park, Hwangseuk;Bang, Jinju;Kang, Jongwuk;Hong, Kwangjoon
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.23 no.6
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    • pp.283-290
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    • 2013
  • A stoichiometric mixture of evaporating materials for $MgGa_2Se_4$ single crystal thin films was prepared from horizontal electric furnace. To obtain the single crystal thin films, $MgGa_2Se_4$ mixed crystal was deposited on thoroughly etched semi-insulating GaAs(100) substrate by the Hot Wall Epitaxy (HWE) system. The source and substrate temperatures were $610^{\circ}C$ and $400^{\circ}C$, respectively. The crystalline structure of the single crystal thin films was investigated by double crystal X-ray diffraction (DCXD). The temperature dependence of the energy band gap of the $MgGa_2Se_4$ obtained from the absorption spectra was well described by the Varshni's relation, $E_g(T)=2.34 eV-(8.81{\times}10^{-4}eV/K)T^2/(T+251K)$. The crystal field and the spin-orbit splitting energies for the valence band of the $MgGa_2Se_4$ have been estimated to be 190.6 meV and 118.8 meV, respectively, by means of the photocurrent spectra and the Hopfield quasicubic model. These results indicate that the splitting of the ${\Delta}so$ definitely exists in the ${\Gamma}_5$ states of the valence band of the $MgGa_2Se_4$/GaAs epilayer. The three photocurrent peaks observed at 10 K are ascribed to the $A_{1^-}$, $B_{1^-}$exciton for n = 1 and $C_{27}-exciton$ peaks for n = 27.

Multi Layer Thin Film Deposition Using Rotatable Hexagonal Gun by Sputtering for the Insulating Glass

  • Park, Se-Yeon;Lee, Jong-Ho;Choi, Bum-Ho;Han, Young-Ki;Lee, Kee-Soo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.314-315
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    • 2012
  • 최근들어 반도체 및 디스플레이 소자의 구조가 복잡해짐에 따라 다층 박막 증착에 대한 중요성이 날로 증가하고 있다. 본 연구에서는 다층 박막을 효율적으로 증착하기 위해 회전이 가능한 육각건을 개발하였고, 이를 이용하여 에너지 절약형 단열 유리 증착 공정을 구현 하였다. 개발된 회전형 육각건은 기존 플래너형 스퍼터링 건의 확장형으로서 최대 6개의 물질을 하나의 챔버에서 증착이 가능하도록 구성되었다. 기존 공정의 경우 서로 다른 물질 증착을 위해서는 각각의 챔버가 필요한 반면, 회전형 육각건을 이용할 경우 하나의 챔버에서 공정을 진행할 수 있어 원가 절감이 가능하다. Fig. 1은 개발된 회전형 육각건의 모식도로서, 스퍼터링 타겟이 장착 가능한 건과, 회전부로 구성되어 있다. 이를 이용하여 투명전극-금속-투명전극-금속-절연체로 구성되어 있는 에너지 절약형 단열 유리용 다층 박막 증착 공정을 개발하였다. 이때 알루미늄이 도핑된 ZnO (AZO)는 RF 마그네트론 스퍼터로, 금속 박막은 DC 스퍼터, $SiO_2$ 및 SiN과 같은 절연 박막은 $O_2$$N_2$ 분위기에서 반응성 RF 스퍼터로 각각 증착하였다. Base pressure는 $10^{-7}$ torr였으며, 증착 시 공정 압력은 1~3 mTorr로 조정하였다. 증착 균일도 향상을 위해 20 rpm의 속도로 기판을 회전시켰다. Fig. 2(a)는 ZnO-Ag-ZnO 구조로 이루어진 다층 박막의 단면을 관찰한 투과전자 현미경 사진으로 각 층간의 계면이 뚜렷하게 나타남을 확인할 수 있으며, 각 층간의 intermixing 현상이 발생하지 않음을 확인 가능하다. 이를 보완하기 위해 Fig. 2(b)에서 보는 바와 같이 XPS를 이용하여 depth profile을 측정하였다. 각 층에서 서로 다른 물질이 발견되는 현상, 즉 교차 오염이 발생함에 따라 나타나는 intermixing 없이 거의 순수한 형태의 ZnO, Ag 박막 성분이 검출되었다. 이는 6개의 서로 다른 물질이 장착된 회전형 육각건을 이용하여 고 품질의 다층 박막 증착이 가능함을 제시하는 결과이다. 증착된 다층 박막의 균일도는 3.8%, 가시광선 영역에서 80% 이상의 투과도, 면저항 값은 3 ${\Omega}/{\Box}$ 이하를 보임으로서 에너지 절약형 단열 유리로서의 사양을 만족시키는 결과를 제시하였다.

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Laser crystallization in active-matrix display backplane manufacturing

  • Turk, Brandon A.;Herbst, Ludolf;Simon, Frank;Fechner, Burkhard;Paetzel, Rainer
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.1261-1262
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    • 2008
  • Laser-based crystallization techniques are ideally-suited for forming high-quality crystalline Si films on active-matrix display backplanes, because the highly-localized energy deposition allows for transformation of the as-deposited a-Si without damaging high-temperature-intolerant glass and plastic substrates. However, certain significant and non-trivial attributes must be satisfied for a particular method and implementation to be considered manufacturing-worthy. The crystallization process step must yield a Si microstructure that permits fabrication of thin-film transistors with sufficient uniformity and performance for the intended application and, the realization and implementation of the method must meet specific requirements of viability, robustness and economy in order to be accepted in mass production environments. In recent years, Low Temperature Polycrystalline Silicon (LTPS) has demonstrated its advantages through successful implementation in the application spaces that include highly-integrated active-matrix liquid-crystal displays (AMLCDs), cost competitive AMLCDs, and most recently, active-matrix organic light-emitting diode displays (AMOLEDs). In the mobile display market segment, LTPS continues to gain market share, as consumers demand mobile devices with higher display performance, longer battery life and reduced form factor. LTPS-based mobile displays have clearly demonstrated significant advantages in this regard. While the benefits of LTPS for mobile phones are well recognized, other mobile electronic applications such as portable multimedia players, tablet computers, ultra-mobile personal computers and notebook computers also stand to benefit from the performance and potential cost advantages offered by LTPS. Recently, significant efforts have been made to enable robust and cost-effective LTPS backplane manufacturing for AMOLED displays. The majority of the technical focus has been placed on ensuring the formation of extremely uniform poly-Si films. Although current commercially available AMOLED displays are aimed primarily at mobile applications, it is expected that continued development of the technology will soon lead to larger display sizes. Since LTPS backplanes are essentially required for AMOLED displays, LTPS manufacturing technology must be ready to scale the high degree of uniformity beyond the small and medium displays sizes. It is imperative for the manufacturers of LTPS crystallization equipment to ensure that the widespread adoption of the technology is not hindered by limitations of performance, uniformity or display size. In our presentation, we plan to present the state of the art in light sources and beam delivery systems used in high-volume manufacturing laser crystallization equipment. We will show that excimer-laser-based crystallization technologies are currently meeting the stringent requirements of AMOLED display fabrication, and are well positioned to meet the future demands for manufacturing these displays as well.

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