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http://dx.doi.org/10.6117/kmeps.2014.21.3.025

Sn-Ag-Cu Solder Joint Properties on Plasma Coated Organic Surface Finishes and OSP  

Lee, Tae-Young (Advanced Welding and Joining R&BD Group, Korea Institute of Industrial Technology)
Kim, Kyoung-Ho (Advanced Welding and Joining R&BD Group, Korea Institute of Industrial Technology)
Bang, Jung-Hwan (Advanced Welding and Joining R&BD Group, Korea Institute of Industrial Technology)
Park, Nam-Sun (Jesagi Hankook, Ltd.)
Kim, Mok-Soon (Department of Materials Science and Engineering, Inha University)
Yoo, Sehoon (Advanced Welding and Joining R&BD Group, Korea Institute of Industrial Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.21, no.3, 2014 , pp. 25-29 More about this Journal
Abstract
Plasma organic thin film for PCB surface finish is a potential replacement of the conventional PCB finishes because of environment-friendly process, high corrosion-resistance and long shelf life over 1 year. In this study, solder joint properties of the plasma organic surface finish were estimated and compared with OSP surface finish. The plasma surface finish was deposited by chemical vapor deposition from fluorine-based precursors. The thickness of the plasma organic coating was 20 nm. Sn-3.0Ag-0.5Cu (SAC305) solder was used as solder joint materials. From a salt spray test, the plasma organic coating had higher corrosion resistance than the OSP surface finish. The spreadability of SAC305 on plasma organic coating was higher than that on OSP surface finish. SEM and TEM micrographs showed that the interfacial microstructure of the plasma surface finish sample were similar to that of the OSP sample. Solder joint strength of the plasma finish sample was also similar to that of the OSP finished sample.
Keywords
Plasma organic coating; Surface finish; Sn-Ag-Cu; Solder; IMC;
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