• Title/Summary/Keyword: Thin-film technology

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Effect of Electrolyte Compositions on the Physical Property and Surface Morphology of Copper Foil (전해액 조성에 의한 구리 박막의 표면형상과 물성변화)

  • Woo, Tae-Gyu;Park, Il-Song;Jeon, Woo-Yong;Park, Eun-Kwang;Jung, Kwang-Hee;Lee, Hyun-Woo;Lee, Man-Hyung;Seol, Kyeong-Won
    • Korean Journal of Metals and Materials
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    • v.48 no.10
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    • pp.951-956
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    • 2010
  • This study examined the effect of copper and sulfuric acid concentrations on the surface morphology and physical properties of copper plated on a polyimide (PI) film. Electrochemical experiments with SEM and a four-point probe were performed to characterize the morphology and mechanical characteristics of copper electrodeposited in the composition of an electrolyte. The resistivity and peel strength were controlled using a range of electrolyte compositions. A lower resistivity and high flexibility were obtained when an electrolyte with 20 g/l of copper was used. However, a uniform surface was obtained when a high current density that exceeded $20mA/cm^2$ was applied, which was maintained at copper concentrations exceeding 40 g/l. Increasing sulfuric acid to >150 g/l decreased the peel strength and flexibility. The lowest resistivity and fine adhesion were detected at a $Cu^{2+}:H_2SO_4$ ratio of 50:100 g/l.

Effect of Plasma Treatment Times on the Adhesion of Cu/Ni Thin Film to Polyimide (폴리이미드와 Cu/Ni층과의 계면결합력에 미치는 플라즈마 처리 시간 효과)

  • Woo, Tae-Gyu;Park, Il-Song;Jung, Kwang-Hee;Jeon, Woo-Yong;Seol, Kyeong-Won
    • Korean Journal of Metals and Materials
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    • v.49 no.8
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    • pp.657-663
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    • 2011
  • This study represents the results of the peel strength and surface morphology according to the preprocessing times of polyimide (PI) in a Cu/Ni/PI structure flexible copper clad laminate production process based on the polyimide. Field emission scanning electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to analyze the surface morphology, crystal structure, and interface binding structure of sputtered Ni, Cu, and electrodeposited copper foil layers. The surface roughness of Ni, Cu deposition layers and the crystal structure of electrodeposited Cu layers were varied according to the preprocessing times. In the RF plasma times that were varied by 100-600 seconds in a preprocessing process, the preprocessing applied by about 300-400 seconds showed a homogeneous surface morphology in the metal layers and that also represented high peel strength for the polyimide. Considering the effect of peel strength on plastic deformation, preprocessing times can reasonably be at about 400 seconds.

CFD Analysis on the Flow Characteristics of Diffuser/Nozzles for Micro-pumps (마이크로 펌프용 디퓨져/노즐의 유동 특성에 관한 CFD 해석)

  • Kim Donghwan;Han Dong-Seok;Jeong Siyoung;Hur Nahmkeon;Yoon Seok-Jin
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.17 no.6
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    • pp.544-551
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    • 2005
  • The flow characteristics have been numerically investigated for various shapes of the diffuser/nozzles which are used for a valveless micro-pump. The important parameters considered in this study are the throat width ($15\~120\mu$m), the taper angle ($3.15\~25.2^{\circ}$), and the diffuser length ( $600\~4,800\mu$m), and the size of the middle chamber ($1\~16mm^2$). To find the optimal values for these parameters, steady state calculations have been performed assuming the constant pressure difference between the inlet and exit of the flow For the taper angle and the throat width, it is found that there exists an optimum at which the net flow rate is the greatest. The optimal taper angle is in the range of $10\~20^{\circ}$ for all the pressure differences; and the throat width indicates an optimal value near $75\mu$m for the case of 35 kPa pressure difference. The net flow rate is also influenced by the size of the middle chamber. With decreasing chamber size, the net flow rate is reduced because of the interference between two streams flowing into the middle chamber. The unsteady pulsating flow characteristics for a micro-pump with a given diffuser/nozzle shape have been also investigated to show the validity of the steady state parametric study.

The Effect of Plasma Gas Composition on the Nanostructures and Optical Properties of TiO2 Films Prepared by Helicon-PECVD

  • Li, D.;Dai, S.;Goullet, A.;Granier, A.
    • Nano
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    • v.13 no.10
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    • pp.1850124.1-1850124.12
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    • 2018
  • $TiO_2$ films were deposited from oxygen/titanium tetraisopropoxide (TTIP) plasmas at low temperature by Helicon-PECVD at floating potential ($V_f$) or substrate self-bias of -50 V. The influence of titanium precursor partial pressure on the morphology, nanostructure and optical properties was investigated. Low titanium partial pressure ([TTIP] < 0.013 Pa) was applied by controlling the TTIP flow rate which is introduced by its own vapor pressure, whereas higher titanium partial pressure was formed through increasing the flow rate by using a carrier gas (CG). Then the precursor partial pressures [TTIP+CG] = 0:027 Pa and 0.093 Pa were obtained. At $V_f$, all the films exhibit a columnar structure, but the degree of inhomogeneity is decreased with the precursor partial pressure. Phase transformation from anatase ([TTIP] < 0.013 Pa) to amorphous ([TTIP+CG] = 0:093 Pa) has been evidenced since the $O^+_2$ ion to neutral flux ratio in the plasma was decreased and more carbon contained in the film. However, in the case of -50 V, the related growth rate for different precursor partial pressures is slightly (~15%) decreased. The columnar morphology at [TTIP] < 0.013 Pa has been changed into a granular structure, but still homogeneous columns are observed for [TTIP+CG] = 0:027 Pa and 0.093 Pa. Rutile phase has been generated at [TTIP] < 0:013 Pa. Ellipsometry measurements were performed on the films deposited at -50 V; results show that the precursor addition from low to high levels leads to a decrease in refractive index.

Characteristics by deposition and heat treatment of Cr and Al thin film on stainless steel (금속 기판위에 Cr과 Al 증착 및 열처리 융합 기술에 의한 표면 형상 변화)

  • Kim, Kyoung-Bo;Lee, Jongpil;Kim, Moojin
    • Journal of Convergence for Information Technology
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    • v.11 no.3
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    • pp.167-173
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    • 2021
  • There is an increasing interest in manufacturing various electronic devices on a bendable substrate. In this paper, we observed a surface morphology by annealing for 20 minutes at temperatures of 150 ℃, 350 ℃, and 550 ℃, respectively, with samples coated by chromium and aluminum. Data on surfaces are investigated using high-resolution SEM and AFM that can measure roughness up to nm. There is no difference from the sample without heat treatment up to 350 ℃, but the change of crystal grains can be observed at 550 ℃. In the future, for application to the flexible optoelectronic field, additional characteristics such as electrical conductivity and reflectivity will be analyzed and optical devices will be manufactured. In conclusion, we will explore the possibility of applying metal materials to flexible electronic devices.

Influence of Fluorine Doping on Hardness and Compressive Stress of the Diamond-Like Carbon Thin Film

  • Sayed Mohammad Adel Aghili;Raheleh Memarzadeh;Reza Bazargan Lari;Akbar Eshaghi
    • Korean Journal of Materials Research
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    • v.33 no.4
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    • pp.124-129
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    • 2023
  • This study assessed the influences of fluorine introduced into DLC films on the structural and mechanical properties of the sample. In addition, the effects of the fluorine incorporation on the compressive stress in DLC films were investigated. For this purpose, fluorinated diamond-like carbon (F-DLC) films were deposited on cobalt-chromium-molybdenum substrates using radio-frequency plasma-enhanced chemical vapor. The coatings were examined by Raman scattering (RS), Attenuated total reflectance Fourier transform infrared spectroscopic analysis (ATR-FTIR), and a combination of elastic recoil detection analysis and Rutherford backscattering (ERDA-RBS). Nano-indentation tests were performed to measure hardness. Also, the residual stress of the films was calculated by the Stony equation. The ATR-FTIR analysis revealed that F was present in the amorphous matrix mainly as C-F and C-F2 groups. Based on Raman spectroscopy results, it was determined that F made the DLC films more graphitic. Additionally, it was shown that adding F into the DLC coating resulted in weaker mechanical properties and the F-DLC coating exhibited lower stress than DLC films. These effects were attributed to the replacement of strong C = C by feebler C-F bonds in the F-DLC films. F-doping decreased the hardness of the DLC from 11.5 to 8.8 GPa. In addition, with F addition, the compressive stress of the DLC sample decreased from 1 to 0.7 GPa.

Development of a Temperature Sensor for OLED Degradation Compensation Embedded in a-IGZO TFT-based OLED Display Pixel (a-IGZO TFT 기반 OLED 디스플레이 화소에 내장되는 OLED 열화 보상용 온도 센서의 개발)

  • Seung Jae Moon;Seong Gyun Kim;Se Yong Choi;Jang Hoo Lee;Jong Mo Lee;Byung Seong Bae
    • Journal of Sensor Science and Technology
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    • v.33 no.1
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    • pp.56-61
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    • 2024
  • The quality of the display can be managed by effectively managing the temperature generated by the panel during use. Conventional display panels rely on an external reference resistor for temperature monitoring. However, this approach is easily affected by external factors such as temperature variations from the driving circuit and chips. These variations reduce reliability, causing complicated mounting owing to the external chip, and cannot monitor the individual pixel temperatures. However, this issue can be simply and efficiently addressed by integrating temperature sensors during the display panel manufacturing process. In this study, we fabricated and analyzed a temperature sensor integrated into an a-IGZO (amorphous indium-gallium-zinc-oxide) TFT array that was to precisely monitor temperature and prevent the deterioration of OLED display pixels. The temperature sensor was positioned on top of the oxide TFT. Simultaneously, it worked as a light shield layer, contributing to the reliability of the oxide. The characteristics of the array with integrated temperature sensors were measured and analyzed while adjusting the temperature in real-time. By integrating a temperature sensor into the TFT array, monitoring the temperature of the display became easier and more accurate. This study could contribute to managing the lifetime of the display.

Preparation of bioactive materials by crystallization sintering (결정화 소결에 의한 생체활성재료의 제조)

  • 명중재;이안배;정용선;신건철;김호건
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.8 no.1
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    • pp.169-178
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    • 1998
  • The crystal phases precipitated in various compositions glass of CaO-$SiO_2-P_2O_5$ system, were identified by XRD. E composition (CaO 49.4, $SiO_2\;36.8,\;P_2O_5$ 8.8 wt%) glass in which both apatite(($Ca_{10}(PO_4)_6O$ and $\beta$-wollastonite($CaSiO_3$) crystals would precipitate by heating, was selected as an experimental composition to prepare the glass ceramics with high bending strength and good bioactivity to the living bone. Glass powders of E composition were unidirectionally crystallized at $1050^{\circ}$C in the temperature-gadient furnace and the resultant glass ceramics were characterized. Bending strength of the glass ceramics was also measured. To investigate the bond forming ability between the glass ceramics and living bone tissue, soaking test of glass ceramics in simulated body fluid was carried out. Densed glass ceramics composed of apatite and $\beta$-wollastonite crystal were prepared by unidirectional crystallization under the optimum conditions. (2 0 2) plane of $\beta$-wollastonite crystals tended to grow perpendicularly to the crystallization direction. Average bending strength of this glass ceramics was 186.9 MPa, higher than that of the glass ceramics prepared by isothermal (not directional) crystallization In soaking test, a thin layer of apatite crystallite was formed on surface of the glass ceramics in 3 days. Apatite crystals formed on the glass ceramics could be act a role to make the chemical bond between the glass ceramics and living bone tissue.

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Effect of Post-annealing on the Interfacial adhesion Energy of Cu thin Film and ALD Ru Diffusion Barrier Layer (후속 열처리에 따른 Cu 박막과 ALD Ru 확산방지층의 계면접착에너지 평가)

  • Jeong, Minsu;Lee, Hyeonchul;Bae, Byung-Hyun;Son, Kirak;Kim, Gahui;Lee, Seung-Joon;Kim, Soo-Hyun;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.3
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    • pp.7-12
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    • 2018
  • The effects of Ru deposition temperature and post-annealing conditions on the interfacial adhesion energies of atomic layer deposited (ALD) Ru diffusion barrier layer and Cu thin films for the advanced Cu interconnects applications were systematically investigated. The initial interfacial adhesion energies were 8.55, 9.37, $8.96J/m^2$ for the sample deposited at 225, 270, and $310^{\circ}C$, respectively, which are closely related to the similar microstructures and resistivities of Ru films for ALD Ru deposition temperature variations. And the interfacial adhesion energies showed the relatively stable high values over $7.59J/m^2$ until 250h during post-annealing at $200^{\circ}C$, while dramatically decreased to $1.40J/m^2$ after 500 h. The X-ray photoelectron spectroscopy Cu 2p peak separation analysis showed that there exists good correlation between the interfacial adhesion energy and the interfacial CuO formation. Therefore, ALD Ru seems to be a promising diffusion barrier candidate with reliable interfacial reliability for advanced Cu interconnects.

Study on Growth and Opto-Electrical Characterization of $CdS_{1-x}Se_{x}$ Thin Film using Chemical Bath Deposition Method (CBD 방법에 의한 $CdS_{1-x}Se_{x}$ 박막의 열처리에 따른 광전기적 특성)

  • Hong, K.J.;Choi, S.P.;Lee, S.Y.;You, S.H.;Shin, Y.J.;Lee, K.K.;Suh, S.S.;Kim, H.S.;Yun, E.H.;Kim, S.U.;Shin, Y.J.;Jeong, T.S.;Shin, H.K.;KIm, T.S.;Moon, J.D.;Jeon, S.L.
    • Journal of Sensor Science and Technology
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    • v.4 no.1
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    • pp.51-63
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    • 1995
  • Polycrystalline $CdS_{1-x}Se_{x}$ thin films were grown on ceramic substrate using a chemical bath deposition method. They were annealed at various temperature and X-ray diffraction patterns were measured by X-ray diffractometer in order to study $CdS_{1-x}Se_{x}$ polycrystal structure using extrapolation method of X-ray diffraction patterns for the CdS, CdSe samples annealed in $N_{2}$ gas at $550^{\circ}C$ it was found hexagonal structure which had the lattice constant $a_{0}=4.1364{\AA}$, $c_{0}=6.7129{\AA}$ in CdS and $a_{0}=4.3021{\AA}$, $c_{0}=7.0142{\AA}$ in CdSe, respectively. Hall effect on these samples was measured by Van der Pauw method and then studied on carrier density and mobility depending on temperature. We measured also spectral response, sensitivity(${\gamma}$), maximum allowable power dissipation and response time on these samples.

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