Korean Journal of Metals and Materials (대한금속재료학회지)

The Korean Institute of Metals and Materials (대한금속재료학회)
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Effect of Plasma Treatment Times on the Adhesion of Cu/Ni Thin Film to Polyimide

폴리이미드와 Cu/Ni층과의 계면결합력에 미치는 플라즈마 처리 시간 효과

  • Woo, Tae-Gyu (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Park, Il-Song (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Jung, Kwang-Hee (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University) ;
  • Jeon, Woo-Yong (Department of Dental Technology, Kwang Yang Health College) ;
  • Seol, Kyeong-Won (Division of Advanced Materials Engineering, College of Engineering, Chonbuk National University)
  • 우태규 (전북대학교 공과대학 신소재공학부) ;
  • 박일송 (전북대학교 공과대학 신소재공학부) ;
  • 정광희 (전북대학교 공과대학 신소재공학부) ;
  • 전우용 (광양보건대학 치기공과) ;
  • 설경원 (전북대학교 공과대학 신소재공학부)
  • Received : 2011.03.04
  • Published : 2011.08.25
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Abstract

This study represents the results of the peel strength and surface morphology according to the preprocessing times of polyimide (PI) in a Cu/Ni/PI structure flexible copper clad laminate production process based on the polyimide. Field emission scanning electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to analyze the surface morphology, crystal structure, and interface binding structure of sputtered Ni, Cu, and electrodeposited copper foil layers. The surface roughness of Ni, Cu deposition layers and the crystal structure of electrodeposited Cu layers were varied according to the preprocessing times. In the RF plasma times that were varied by 100-600 seconds in a preprocessing process, the preprocessing applied by about 300-400 seconds showed a homogeneous surface morphology in the metal layers and that also represented high peel strength for the polyimide. Considering the effect of peel strength on plastic deformation, preprocessing times can reasonably be at about 400 seconds.

Keywords

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