• Title/Summary/Keyword: Thin-film technology

Search Result 2,954, Processing Time 0.036 seconds

Fabrication and Characteristics of LB Ultra-thin Film Capacitor (II) (LB 초박막 커패시터의 제작 및 특성 (II))

  • 유승엽;박재철;권영수
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1996.05a
    • /
    • pp.244-247
    • /
    • 1996
  • We had experiment using LB method that can fabricate molecular order ultra-thin film below 100${\AA}$. LB method has known as main technology of information society in 21C, because it is not only free orientation and alignment of molecular but also ability of thickness control as molecular order. In this paper, the fabricated condition and physical properties of functional ultra-thin film of molecular order was investigated and highly efficient ultra-thin film capacitor was fabricated by using ultra-thin LB film for application as electronic device. Possibility of ultra-thin film capacitor was researched by analyzing and measuring electrical properties. Polyimide ultra-thin LB film capacitor was fabricated, ensured theoretically and experimentally its possibility in range of 10Hz∼lMHz through its frequency characteristics.

  • PDF

Electromigration Characteristics in PSG/SiO$_2$ Passivated Al-l%Si Thin Film Interconnections

  • Kim, Jin-Young
    • Journal of Korean Vacuum Science & Technology
    • /
    • v.7 no.2
    • /
    • pp.39-44
    • /
    • 2003
  • Recent ULSI and multilevel structure trends in microelectronic devices minimize the line width down to a quarter micron and below, which results in the high current densities in thin film interconnections. Under high current densities, an EM(electromigration) induced failure becomes one of the critical problems in a microelectronic device. This study is to improve thin film interconnection materials by investigating the EM characteristics in PSG(phosphosilicate glass)/SiO$_2$ passivated Al-l%Si thin film interconnections. Straight line patterns, wide and narrow link type patterns, and meander type patterns, etc. were fabricated by a standard photholithography process. The main results are as follows. The current crowding effects result in the decrease of the lifetime in thin film interconnections. The electric field effects accelerate the decrease of lifetime in the double-layered thin film interconnections. The lifetime of interconnections also depends upon the current conditions of P.D.C.(pulsed direct current) frequencies applied at the same duty factor.

  • PDF

Fluorine doping effect of ZnO film by RF magnetron sputtering (RF magnetron sputtering을 이용한 ZnO 박막의 F 도핑 효과)

  • Ku, Dae-Young;Kim, In-Ho;Lee, In-Kyu;Lee, Kyeong-Seok;Park, Jong-Keuk;Lee, Taek-Sung;Baik, Young-Jun;Cheong, Byung-Ki;Kim, Won-Mok
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2004.07b
    • /
    • pp.1023-1028
    • /
    • 2004
  • RF magnetron sputtering을 이용하여 증착한 투명전도성 ZnO 박막의 F 도핑량에 따른 전기, 구조, 광학적 특성에 대해 고찰하였다. 순수 ZnO와 ZnO : $ZnF_2$(1.3 wt%) 그리고 ZnO : $ZnF_2$(10 wt%) 3개의 타겟들을 2개씩 조합 각각의 rf 파워를 조절하여 co-sputtering 방법으로 $ZnF_2$ wt%를 변화시켜 박막내의 F 도핑량을 조절하였다. 증착된 박막들은 열처리에 따른 물성 변화를 분석하기 위해 $5{\times}10^{-7}$ torr 이하의 진공 분위기에서 $300^{\circ}C$에서 2 시간 동안 열처리하였다. XRD 분석 결과 제작된 모든 ZnO 박막은 (002) 우선 방위 특성을 보였고 F 도핑량 증가에 따라 (101), (110), (100) 방향의 약한 피크들이 나타났으며, 이러한 구조적 특성 변화는 이동도의 변화와 밀접한 관계가 있는 것으로 나타났다. Auger로 박막 내의 F 량을 분석한 결과 최대 5.9 at%의 F이 포함되어 있었으며, 열처리 후 캐리어 농도와 이동도는 증가하였고 최고 $37cm^2/Vs$의 이동도를 나타내었으며, 모든 박막들은 가시광 영역에서 81 % 이상의 투과도를 가졌다.

  • PDF

Preparation of Novel Magnesium Precursors and MgO Thin Films Growth by Atomic Layer Deposition (ALD)

  • Kim, Hyo-Suk;park, Bo Keun;Kim, Chang Gyoun;Son, Seung Uk;Chung, Taek-Mo
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2014.02a
    • /
    • pp.364.2-364.2
    • /
    • 2014
  • Magnesium oxide (MgO) thin films have attracted great scientific and technological interest in recent decades. Because of its distinguished properties such as a wide band gap (7.2 eV), a low dielectric constant (9.8), a low refractive index, an excellent chemical, and thermal stability (melting point=$2900^{\circ}C$), it is widely used as inorganic material in diverse areas such as fire resistant construction materials, optical materials, protective layers in plasma display panels, buffer layers of multilayer electronic/photonic devices, and perovskite ferroelectric thin films. Precursor used in the ALD requires volatility, stability, and low deposition temperature. Precursors using a heteroleptic ligands with different reactivity have advantage of selective reaction of the heteroleptic ligands on substrate during ALD process. In this study, we have synethesized new heteroleptic magnesium precursors ${\beta}$-diketonate and aminoalkoxide which have been widely used for the development of precursor because of the excellent volatility, chelating effects by increasing the coordination number of the metal, and advantages to synthesize a single precursor. A newly-synthesized Mg(II) precursor was adopted for growing MgO thin films using ALD.

  • PDF

Work function engineering on transparent conducting ZnO thin films

  • Heo, Gi-Seok;Hong, Sang-Jin;Park, Jong-Woon;Choi, Bum-Ho;Lee, Jong-Ho;Shin, Dong-Chan
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2007.08b
    • /
    • pp.1706-1707
    • /
    • 2007
  • A possibility of work function engineering on ZnO thin film is studied by in-situ and ex-situ doping process. The work function of ZnO thin film decreases with increasing boron and phosphorus doping quantity. But, the work function of Al-doped ZnO (AZO) thin film increases as the boron doping quantity incresess. The range of work function change on ZnO thin films is 3.5 eV to 5.5 eV. This result shows that the work function of ZnO thin film is indeed engineerable by changing materials of dopants and their compositional distribution of surface. We also discuss the possible mechanism of work function engineering on ZnO thin films.

  • PDF

Surface acoustic wave gas sensors by utilizing the phase change (위상변화를 이용한 표면탄성파 가스센서)

  • Kim, Jin-Sang;Jung, Yong-Chul;Kang, Chong-Yun;Kim, Dal-Young;Nam, Chang-Woo;Yoon, Seok-Jin
    • Journal of Sensor Science and Technology
    • /
    • v.14 no.3
    • /
    • pp.186-190
    • /
    • 2005
  • This paper describes the development of a surface acoustic wave gas sensor that is designed to detect volatile gas by monitering phase change of output signal as a function of time. The sensor consists of SAW oscillators with a center frequency of 100 MHz fabricated on $128^{\circ}$ Y-Z $LiNbO_{3}$ substrates. Experimental results, which show the phase change of output signal under the absorption of volatile gas onto sensors, are presented. The proposed sensor has the properties of high sensitivity compare to the conventional SAW gas sensor and chemical selectivity. Thus, it is thought these results are applicable for use in sensor array of an high performance electronic nose system.

Thin-Film Transistor-Based Strain Sensors on Stiffness-Engineered Stretchable Substrates (강성도 국부 변환 신축성 기판 위에 제작된 박막 트랜지스터 기반 변형률 센서)

  • Youngmin Jo;Gyungin Ryu;Sungjune Jung
    • Journal of Sensor Science and Technology
    • /
    • v.32 no.6
    • /
    • pp.386-390
    • /
    • 2023
  • Stiffness-engineered stretchable substrate technology has been widely used to produce stretchable displays, transistors, and integrated circuits because it is compatible with various flexible electronics technologies. However, the stiffness-engineering technology has never been applied to transistor-based stretchable strain sensors. In this study, we developed thin-film transistor-based strain sensors on stiffness-engineered stretchable substrates. We designed and fabricated strain-sensitive stretchable resistors capable of inducing changes in drain currents of transistors when subjected to stretching forces. The resistors and source electrodes of the transistors were connected in series to integrate the developed stretchable resistors with thin-film transistors on stretchable substrates by printing the resistors after fabricating transistors. The thin-film transistor-based stretchable strain sensors demonstrate feasibility as strain sensors operating under strains of 0%-5%. This strain range can be extended with further investigations. The proposed stiffness-engineering approach will expand the potential for the advancement and manufacturing of innovative stretchable strain sensors.

Study of Low Temperature Solution-Processed Al2O3 Gate Insulator by DUV and Thermal Hybrid Treatment (DUV와 열의 하이브리드 저온 용액공정에 의해 형성된 Al2O3 게이트 절연막 연구)

  • Jang, Hyun Gyu;Kim, Won Keun;Oh, Min Suk;Kwon, Soon-Hyung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.33 no.4
    • /
    • pp.286-290
    • /
    • 2020
  • The formation of inorganic thin films in low-temperature solution processes is necessary for a wide range of commercial applications of organic electronic devices. Aluminum oxide thin films can be utilized as barrier films that prevent the deterioration of an electronic device due to moisture and oxygen in the air. In addition, they can be used as the gate insulating layers of a thin film transistor. In this study, aluminum oxide thin film were formed using two methods simultaneously, a thermal process and the DUV process, and the properties of the thin films were compared. The result of converting aluminum nitrate hydrate to aluminum oxide through a hybrid process using a thermal treatment and DUV was confirmed by XPS measurements. A film-based a-IGZO TFT was fabricated using the formed inorganic thin film as a gate insulating film to confirm its properties.

Fabrication of anti-reflection thin film by using sol-gel hybrid solution (Sol-gel 하이브리드 용액을 이용한 반사방지막 제조)

  • Park, Jong-Guk;Lee, Ji-Sun;Lee, Mi-Jai;Lee, Young Jin;Jeon, Dae-Woo;Kim, Jin-Ho
    • Journal of the Korean Crystal Growth and Crystal Technology
    • /
    • v.26 no.6
    • /
    • pp.220-224
    • /
    • 2016
  • Anti-reflection (AR) thin films were fabricated on a glass substrate by using an ultrasonic spray. Glycidoxypropyl trimethoxysilane (GPTMS) and tetraethyl orthosilicate (TEOS) were used to synthesize a sol-gel hybrid coating solution. The moving speed of spray nozzle was changed from 15~25 mm/s to control the coating thickness of AR thin film. As the moving speed of spray nozzle increased, the thickness of AR thin film decreased from 138 nm to 86 nm. When the AR thin film was fabricated by nozzle moving speed of 20 mm/s, the refractive index and thickness of AR thin film was measured to be 1.31 and 104 nm, respectively. The average reflectance and transmittance of AR thin film coating glass was measured to be 0.75 % and 94 %, respectively into the visible light range of 380~780 nm.

Chemical Vapor Deposition of Ga2O3 Thin Films on Si Substrates

  • Kim, Doo-Hyun;Yoo, Seung-Ho;Chung, Taek-Mo;An, Ki-Seok;Yoo, Hee-Soo;Kim, Yun-Soo
    • Bulletin of the Korean Chemical Society
    • /
    • v.23 no.2
    • /
    • pp.225-228
    • /
    • 2002
  • Amorphous $Ga_2O_3$ films have been grown on Si(100) substrates by metal organic chemical vapor deposition (MOCVD) using gallium isopropoxide, $Ga(O^iPr)_3$, as single precursor. Deposition was carried out in the substrate temperature range 400-800 $^{\circ}C$. X-ray photoelectron spectroscopy (XPS) analysis revealed deposition of stoichiometric $Ga_2O_3$ thin films at 500-600 $^{\circ}C$. XPS depth profiling by $Ar^+$ ion sputtering indicated that carbon contamination exists mostly in the surface region with less than 3.5% content in the film. Microscopic images of the films by scanning electron microscopy (SEM) and atomic force microscopy (AFM) showed formation of grains of approximately 20-40 nm in size on the film surfaces. The root-mean-square surface roughness from an AFM image was ${\sim}10{\AA}$. The interfacial layer of the $Ga_2O_3$/Si was measured to be ${\sim}35{\AA}$ thick by cross-sectional transmission electron microscopy (TEM). From the analysis of gaseous products of the CVD reaction by gas chromatography-mass spectrometry (GC-MS), an effort was made to explain the CVD mechanism.