• Title/Summary/Keyword: Thin-film electrode

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A Study on the Characteristics of FTS Type Ion Plating System and Thin film Deposition (FTS형 이온 플레이팅의 특성 및 박막 형성에 관한 연구)

  • Sung, Y.M.;Lee, C.Y.;Shin, J.H.;Kim, G.S.;Cho, J.S.;Park, C.H.
    • Proceedings of the KIEE Conference
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    • 1994.07b
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    • pp.1589-1592
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    • 1994
  • We developed the ion plating system, consisted of the Facing Target Magnetron Sputtering System and the r.f, electrode of the coil type, which was available to control the reactive and the adhesion between thin film and substrate, and studied about the discharge characteristics and the optimum condition in order to form the high quality thin film. The characteristics of discharge and plasma was measured as Double Probe and Electrostatic Retarding Grid Analyzer. The incident ion energy on the substrate was increased as the increasing r.f power, bias voltage. By the r.f electrode, the ionization rate of the sputtered particles was about 75%, and the mean incident ion energy depend on the value which was difference between the plasma potential and biased substrate potential.

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A study on the electrical switching properties of oxide metal (산화금속의 전기적 스위칭 특성 연구)

  • Choi, Sung-Jai;Lee, Won-Sik
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.9 no.3
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    • pp.173-178
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    • 2009
  • We have investigated the electrical properties of oxide metal thin film device. The device has been fabricated top-top electrode structure and its transport properties are measured in order to study the resistance change. Electrical properties with linear voltage sweep on a electrodes are used to show the variation of resistance of oxide metal thin film device. Fabricated oxide metal thin film device with MIM structure is changed from a low conductive Off-state to a high conductive On-state by the external linear voltage sweep. The $Si/SiO_2/MgO$ device is switched from a high resistance state to a low resistance state by forming. Consequently, we believe oxide metal is a promising material for a next-generation nonvolatile memory and other electrical applications.

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Leakage Current of Hydrogenated Amorphous Silicon Thin-Film Transistors (수소화된 비정질규소 박막트랜지스터의 누설전류)

  • Lee, Ho-Nyeon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.8 no.4
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    • pp.738-742
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    • 2007
  • The variations in the device characteristics of hydrogenated amorphous thin-film transistors (a-Si:H TFTs) were studied according to the processes of pixel electrode fabrication to make active-matrix flat-panel displays. The off-state current was about 1 pA and the switching ratio was over $10^6$ before fabrication of pixel electrodes; however, the off-state current increased over 10 pA after fabrication of pixel electrodes. Surface treatment on SiNx passivation layers using plasma could improve the off-state characteristics after pixel electrode process. $N_2$ plasma treatment gave the best result. Charge accumulation on the SiNx passivation layer during the deposition of transparent conducting layer might cause the increase of off-state current after the fabrication of pixel electrodes.

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Capacitive Touch Sensor Pixel Circuit with Single a-InGaZnO Thin Film Transistor (단일 a-InGaZnO 박막 트랜지스터를 이용한 정전용량 터치 화소 센서 회로)

  • Kang, In Hye;Hwang, Sang Ho;Baek, Yeong Jo;Moon, Seung Jae;Bae, Byung Seong
    • Journal of Sensor Science and Technology
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    • v.28 no.2
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    • pp.133-138
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    • 2019
  • The a-InGaZnO (a-IGZO) thin film transistor (TFT) has the advantages of larger mobility than that of amorphous silicon TFTs, acceptable reliability and uniformity over a large area, and low process cost. A capacitive-type touch sensor was studied with an a-IGZO TFT that can be used on the front side of a display due to its transparency. A capacitive sensor detects changes of capacitance between the surface of the finger and the sensor electrode. The capacitance varies according to the distance between the sensor plate and the touching or non-touching of the sensing electrode. A capacitive touch sensor using only one a-IGZO TFT was developed with the reduction of two bus lines, which made it easy to reduce the pixel pitch. The proposed sensor circuit maintained the amplification performance, which was investigated for various drive conditions.

The optical and electrical properties of IGZO thin film fabricated by RF magnetron sputtering according to RF power (RF magnetron sputtering법으로 형성된 IGZO박막의 RF power에 따른 광학적 및 전기적 특성)

  • Zhang, Ya Jun;Kim, Hong Bae
    • Journal of the Semiconductor & Display Technology
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    • v.12 no.1
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    • pp.41-45
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    • 2013
  • IGZO transparent conductive thin films were widely used as transparent electrode of optoelectronic devices. We have studied the optical and electrical properties of IGZO thin films. The IGZO thin films were deposited on the corning 1737 glass by RF magnetron sputtering method. The RF power in sputtering process was varied as 25, 50, 75and 100 W, respectively. All of the thin films transmittance in the visible range was above 85%. XRD analysis showed that amorphous structure of the thin films without any peak. The thin films were electrically characterized by high mobility above $13.4cm^2/V{\cdot}s$, $7.0{\times}10^{19}cm^{-3}$ high carrier concentration and $6{\times}10^{-3}{\Omega}-cm$ low resistivity. By the studies we found that IGZO transparent thin film can be used as transparent electrodes in electronic devices.

Fabrication of Field-Emitter Arrays using the Mold Method for FED Applications

  • Cho, Kyung-Jea;Ryu, Jeong-Tak;Kim, Yeon-Bo;Lee, Sang-Yun
    • Transactions on Electrical and Electronic Materials
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    • v.3 no.1
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    • pp.4-8
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    • 2002
  • The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

Role of Am Piezoelectric Crystal Orientation in Solidly Mounted Film Bulk Acoustic Wave Resonators

  • Lee, Si-Hyung;Kang, Sang-Chul;Han, Sang-Chul;Ju, Byung-Kwon;Yoon, Ki-Hyun;Lee, Jeon-Kook
    • Journal of the Korean Ceramic Society
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    • v.40 no.4
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    • pp.393-397
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    • 2003
  • To investigate the effect of AIN c-axis orientation on the resonance performance of film bulk acoustic wave resonators, solidly mounted resonators with crybtallographically different AIN piezoelectric films were prepared by changing only the bottom electrode surface conditions. As increasing the degree of c-axis texturing, the effective electromechanical coupling coefficient ($\kappa$$\_$eff/)$^2$ in resonators increased gradually. The least 4 degree of full width at half maximum in an AIN(002) rocking curve, which corresponds to $\kappa$$^2$$\_$eff/ of above 5%, was measured to be necessary for band pass filter applications in wireless communication system. The longitudinal acoustic wave velocity of AIN films varied with the degree of c-axis texturing. The velocity of highly c-axis textured AIN film was extracted to be about 10200 n/s by mathematical analysis using Matlab.

Electrical Properties of SCT Ceramic Thin Film with Top Electrode (상부전극에 따른 SCT 세라믹 박막의 전기적 특성)

  • Cho, C.N.;Kim, J.S.;Shin, C.G.;Choi, W.S.;Kim, C.H.;Park, Y.P.;Yoo, Y.G.;Lee, J.U.
    • Proceedings of the KIEE Conference
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    • 1999.07d
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    • pp.1501-1503
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    • 1999
  • The $(Sr_{0.85}Ca_{0.15})TiO_3$(SCT) thin films are deposited on Pt-coated electrode$(Pt/TiO_2/SiO_2/Si)$ using RF sputtering method. Ag, Cu, Al, Pt films for the formation of top eletrode were doposited on SCT thin films by thermal evaporator and sputtering. The effects of top electodes have be studied on SCT samples with a variety of top electrode materials.

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Recent Progress on Voltage Drop Compensation in Top Emission Organic Light Emitting Diodes (OLED)

  • Jeong, Byoung-Seong
    • Journal of the Semiconductor & Display Technology
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    • v.19 no.1
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    • pp.49-54
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    • 2020
  • The voltage drop due to the thin cathode film at the large size top emission OLED panel was successfully compensated with making electrical contact between thin cathode and anode auxiliary electrode by 355nm wavelength of laser. It was found that the luminance uniformity dramatically increased from around 15% to more than 80% through this electrical compensation between thin cathode and anode auxiliary electrode. Moreover, the removing process for EL materials on the anode auxiliary electrode process by laser was very reliable and stable. Therefore, it is thought that the EL removal method using laser to make electrical contacts is very appropriate to mass production for such a large size top emission OLEDs to obtain high uniformity of luminance.

Chemical Solution Deposition of PZT/Oxide Electrode Thin Film Capacitors and Their Micro-patterning by using SAM

  • Suzuki, Hisao
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.907-912
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    • 2005
  • Micro-patterns of $Pb(Zr_{0.53}Ti_{0.47})O_3$, PZT, thin films with a MPB composition were deposited on $Pt/Ti/SiO_2/Si$ substrate from molecular-designed PZT precursor solution by using self-assembledmonolayer(SAM) as a template. This method includes deposition of SAM followed by the optical etching by exposing the SAM to the UV-light, leading to the patterned SAM as a selective deposition template. The pattern of SAM was formed by irradiating UV-light to the SAM on a substrate and/or patterned PZT thin film through a metal mask for the selective deposition of patterned PZT or lanthanum nickel oxide (LNO) precursor films from alkoxide-based precursor solutions. As a result, patterned ferroelectric PZT and PZT/LNO thin film capacitors with good electrical properties in micrometer size could be successfully deposited.

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