Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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A Study on the Characteristics of FTS Type Ion Plating System and Thin film Deposition

FTS형 이온 플레이팅의 특성 및 박막 형성에 관한 연구

  • Sung, Y.M. (Department of Electrical Engineering. Pusan National University) ;
  • Lee, C.Y. (Department of Electrical Engineering. Pusan National University) ;
  • Shin, J.H. (Dong Eui University) ;
  • Kim, G.S. (Dong Myung Junior College) ;
  • Cho, J.S. (Department of Electrical Engineering. Pusan National University) ;
  • Park, C.H. (Department of Electrical Engineering. Pusan National University)
  • 성열문 (부산대학교 공과대학 전기공학과) ;
  • 이창영 (부산대학교 공과대학 전기공학과) ;
  • 신중홍 (동의대학교) ;
  • 김규섭 (동명공업전문대학) ;
  • 조정수 (부산대학교 공과대학 전기공학과) ;
  • 박정후 (부산대학교 공과대학 전기공학과)
  • Published : 1994.07.21
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Abstract

We developed the ion plating system, consisted of the Facing Target Magnetron Sputtering System and the r.f, electrode of the coil type, which was available to control the reactive and the adhesion between thin film and substrate, and studied about the discharge characteristics and the optimum condition in order to form the high quality thin film. The characteristics of discharge and plasma was measured as Double Probe and Electrostatic Retarding Grid Analyzer. The incident ion energy on the substrate was increased as the increasing r.f power, bias voltage. By the r.f electrode, the ionization rate of the sputtered particles was about 75%, and the mean incident ion energy depend on the value which was difference between the plasma potential and biased substrate potential.

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