• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.10
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• pp.1375-1381
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• 2018

In this paper, we studied coatings of the DLC thin film for improving loosening torque of dental implant screw. We used a filtered arc ion plating process which can realize the most dense DLC layer by coating the DLC thin film on the surface of the dental abutment screw. It showed both hardness comparable to diamond and low friction coefficient similar to graphite, and to improve the loosening phenomenon by increasing the screw tightening force Cr/CrN, Ti/TiN or Ti/TiN/Cr/CrN buffer layers were deposited for 5 to 10 minutes to improve the adhesion of the DLC thin film to the surface of the Ti (Gr.5), and then the DLC thin film was coated for about 15 minutes. As a result, the Cr/CrN buffer layer exhibited the highest hardness of 29.7 GPa, the adhesion of 18.62N on average, and a very low coefficient of friction of less than 0.2 as a whole. And we measured loosening torque after one million times with masticatory movement simulator. As a result, the values of the coated screw loosening torque were clearly higher than those of the uncoated screw. From this, it was found that the DLC coating was effective methods improving the loosening torque. In addition, it was confirmed that the cytotoxicity test and cell adhesion test showed high biocompatibility.

• Journal of the Korean Vacuum Society
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• v.8 no.3B
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• pp.262-268
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• 1999

Polycarbonate (PC) and Polymethylmethacrylate (PMMA) surface was modified by ion assisted reaction (IAR) technique to obtain the hydrophilic functional groups and improve the wettability. In conditions of ion assisted reaction, ion beam energy was changed from 500 to 1500eV, and ion dose and oxygen gas blown rate were fixed $1\times10^{16}$ ions/$\textrm{cm}^2$ and 4ml/min, respectively. Wetting angle of water on PC and PMMA surface modified by $Ar^+$ ion without blowing oxygen at 4ml/mon showed $5^{\circ}$ and $10^{\circ}$. Changes of wetting angle with oxygen gas and $Ar^+$ ion irradiation were explained by considering formation of hydrophilic group due to a reaction between irradiated polymer chain by energetic ion irradiation and blown oxygen gas. X-ray photoelectron spectroscopy analysis shows that hydrophilic groups such as -C-O, -(C=O)- and -(C=O)-O- are formed on the surface of polymer by chemical interaction. The polymer surface modification using ion assisted reaction only changed the surface physical properties and sept the bulk properties. In comparison with other modification methods, the surface modification by IAR treatment was chemically stable and enhanced the adhesion between metal and polymer surface. The applications of various kinds of polymer surface modification methods, metal and polymer surface. The applications of various kinds of polymer surface modification could be appled to the new materials about hydrophilic surface properties by IAR treatment. The adhesion between metal film and polymer measured by Scotch tape test whether the hydrophilic surfaces could improve the adhesion strength or not.

• Korean Journal of Materials Research
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• v.17 no.4
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• pp.215-221
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• 2007

The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.8
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• pp.658-662
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• 2001

This paper describes on the fabrication and characteristics of hot-film type micro-flowsensors integrated with Pt-RTD(resistance thermometer device) and micro-heater on the SOI(Si-on-insulator) membrane and trench structures, in which MGO thin-film was used as medium layer in order to improve adhesion of Pt thin-film to SiO$_2$ layer. Output voltages increased due to increase of heat-loss from sensor to external. The output voltage was 250 nV at N$_2$ flow rate of 2000 sccm/min, heating power of 0.3 W. The response time($\tau$:63%) was about 42 msec when input flow was step-input. The results indicated that micro-flowsensors with the SOI membrane and trench structures have properties of a high-resolution and ow consume power.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.33-39
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• 2014

To establish the reliability of a packaging structures, adhesion testing of key interfaces is a critical task. Due to the material mismatch, the interface may be prone to delamination failure due to conditions during the manufacturing of the product or just from the day-to-day use. To assess the reliability of the interface adhesion strength testing can be performed during the design phase of the product. One test method of interest is the four-point bending (4PB) adhesion strength test method. This test method has been implemented in a variety of situations to evaluate the adhesion strength of interfaces in bimaterial structures to the interfaces within thin film multilayer stacks. This article presents a review of the 4PB adhesion strength testing method and key implementations of the technique in regards to semiconductor packaging.

• Journal of the Korean Vacuum Society
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• v.6 no.S1
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• pp.110-114
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• 1997

Development of metal ion source growth of high quality Cu metal film formation of non-stoichiometric $SnO_2$ films of Si(100), and modification fo polymer surface by low enregy ion beam have been carried out at KIST Ion Beam Lab. A new metal ion source with high ion beam flux has been developed by a hybrid ion beam (HIB) deposition and non-stoichiometric $SnO_2$ films are controlled by supplying energy. The ion assisted reaction (IAR) in which keV ion beam is irradiated in reactive gas environment has been deveolped for modifying the polymers and enhancing adhesion to other materials and advantages of the IAR have been reviewed.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.958-961
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• 2007

The electrical characteristics of organic thin-filmtransistor (OTFTs) can be improved by inserting adhesion layer on gate dielectrics. Adhesion layer was used as polymeric adhesion layer deposited on inorganic gate insulators such as silicon dioxide $(SiO_2)$ and it was formed by vapor deposition polymerization (VDP) instead of spin-coating process. The OTFTs obtained the on/off ratio $of{\sim}10^4$, threshold voltage of 1.8V, subthreshold slop of 2.9 V/decade and field effect mobility about $0.01\;cm^2/Vs$.

• Journal of Surface Science and Engineering
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• v.32 no.3
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• pp.406-409
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• 1999

Thin films of silver with high reflectance of 95% and above were fabricated successfully on polyester substrate by using e-beam evaporation processes. The optimum process condition was investigated by varying the current values applied while keeping the substrate temperature at room temperature by circulating the cooling water around it during deposition. Thin films of silver deposited with 30 mA as current revealed the highest reflectance of 96.4%, while being illuminated with a light of 700nm wave-length. But their adhesion showed unsatisfactory results. Though the films showed a condensation type in the cross-sectional views, they revealed crystallinity in the planes of (111) and (200) and growth orientation in <100> direction.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.87-87
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• 2010

We report a new patterning technique of inorganic materials by using thin-film transfer printing (TFTP) with atomic layer deposition. This method consists of the atomic layer deposition (ALD) of inorganic thin film and a nanotransfer printing (nTP) that is based on a water-mediated transfer process. In the TFTP method, the Al2O3 ALD growth occurs on FTS-coated PDMS stamp without specific chemical species, such as hydroxyl group. The CF3-terminated alkylsiloxane monolayer, which is coated on PDMS stamp, provides a weak adhesion between the deposited Al2O3 and stamp, and promotes the easy and complete release of Al2O3 film from the stamp. And also, the water layer serves as an adhesion layer to provide good conformal contact and form strong covalent bonding between the Al2O3 layer and Si substrate. Thus, the TFTP technique is potentially useful for making nanochannels of various inorganic materials.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.749-751
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• 2007

A buffer layer consisting of $SiO_x/Ta/Ti$ has been developed in order to overcome the adhesion and stress problems between poly-Si film and mica. Polycrystalline silicon thin film transistor was successfully fabricated on the mica and transferred to a flexible plastic substrate.