Browse > Article
http://dx.doi.org/10.3740/MRSK.2007.17.4.215

A Study on Improvement of Interfacial Adhesion Energy of Inkjet-printed Ag Thin film on Polyimide by CF4 Plasma Treatment  

Park, Sung-Cheol (School of Material Science and Engineering, Andong National University)
Cho, Su-Hwan (Central R&D Institute, Samsung Electro-mechanics)
Jung, Hyun-Cheol (Central R&D Institute, Samsung Electro-mechanics)
Joung, Jae-Woo (Central R&D Institute, Samsung Electro-mechanics)
Park, Young-Bae (School of Material Science and Engineering, Andong National University)
Publication Information
Korean Journal of Materials Research / v.17, no.4, 2007 , pp. 215-221 More about this Journal
Abstract
The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.
Keywords
Adhesion; Peel test; Inkjet-printed Ag; Polyimide; Thin film;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
Times Cited By SCOPUS : 3
연도 인용수 순위
1 J. Y. Song and J. Yu, Acta Mater., 50, 3985 (2002)   DOI   ScienceOn
2 D. Hu and H. Chen, J. Mater. Sci., 27, 5262 (1992)   DOI
3 Y. H. Kim, Master Thesis., Seoul National University, (2006)
4 Adley F. Rubira, James D. Rancourt, Maggie L. Caplan, Anne K. St. Clair and Larry T. Taylor, Chem. Mater., 6, 2351 (1994)   DOI   ScienceOn
5 L. J. Gerenser, J. Vac. Sci. Technol. A, 6(5), 2897 (1988)   DOI
6 S. C. Park, S. W. Cho, H. C. Jung, J. W. Joung and Y. B. Park, Proceeding of the 2006 fall technical symposium on microelectronics and packaging, 29 (2006)
7 A. J. Kinloch, C. C. Lau and J. G. Williams, Int. J. Frac., 66(1), 45 (1994)   DOI
8 C. D. Wagner, W. M. Riggs, L. E. Davis and J. F. Moulder, Handbook of X-ray Photoelectron Spectroscopy, Perkin-Elmer Corporation, Eden Prairie, MN, U. S. A., (1978)
9 O. D. Greenwood, R. D. Boyd, J. Hopkins and J. P. S. Badyal, J. Adhesion Sci. Techol., 9(3), 311 (1995)   DOI   ScienceOn
10 S. B. Lee, Y. K. Kim and J. S. Kim, Kor. J. Mater. Res., 16(9), 543 (2006)   과학기술학회마을   DOI
11 K-S. Kim and N. Aravas, Int. J. Sol. Struct., 24(4), 417 (1988)   DOI   ScienceOn
12 M. H. Kim and K. W. Lee, Met. Mater. Int., 12(5), 425 (2006)   DOI   ScienceOn
13 S. H. Kim, S. W. Na, N. -E. Lee, Y. W. Nam and Y. H. Kim, Surf. Coat. Technol., 200, 2072 (2005)   DOI   ScienceOn
14 Y. B. Park, I. S. Park and J. Yu, Mater. Sci. Eng., A266, 261 (1999)   DOI   ScienceOn
15 Y. B. Park and J. Yu, Met. Mater. Int., 7(2), 123 (2001)   DOI
16 Z. Liu and Y. Su, K. Varahramyan, Thin Solid Films, 478, 275 (2005)   DOI   ScienceOn