• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.227-230
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• 2004

Phosphor layers on rear plate of PDP were formed via osmosis coating process in an attempt to improve thickness uniformity of phosphor layer and eventually to enhance luminance and its efficiency of plasma display panel. The phosphor layers were formed uniformly not only on the sidewalls of barrier ribs but also on the dielectric layer of rear plate by the process. The processing parameters affecting the thickness uniformity of the phosphor layer formed by the osmotic coating process were investigated.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.1068-1071
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• 2004

We report the techniques to obtain the high uniformity of the phosphor film thickness in the cold cathode fluorescent lamps, which are widely used as a back-light for the liquid crystal display. The thickness variation of the phosphor layer was sensitive to blowing conditions. The optimum conditions were obtained at flow rate of 15 sccm for 30 min at 40 $^{\circ}C$. The optimum and uniform thickness of a phosphor layer gives good luminous output.

• 대한전자공학회논문지
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• 제25권1호
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• pp.88-93
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• 1988

For coherent optical information processing the thickness uniformity of the spatial light modulators(SLMs)is highly demanded. The liquid crystal display(LCD), which is commercialized as a pocket-sized television, is considered as one of the most cheap 2-dimensional SLM. But usually it has lack of thickness uniformity. Thus phase correction to compensate the thickness nonuniformity must be preceded before it is used as an SLM. In this paper relatively easy phase compensation method applicable to binary SLMs is discussed and experimentally verified by using the optical joint transformantion concept.

• 청정기술
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• 제17권2호
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• pp.103-109
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• 2011

전기도금의 seed layer를 형성하는 무전해 동도금 공정의 throwing power (TP)와 두께 편차를 개선하기 위한 공정 최적화 방법을 제시하였다. 실험계획법 (DOE)을 이용하여 가능한 모든 공정 인자들 가운데 TP와 두께 편차에 가장 큰 영향을 미치는 주요 인자를 파악해 보았다. 균일성을 가진 via filling을 위해서는 도금액 내의 Cu 이온의 농도를 높여주고 도금 온도를 낮추어 주는 것이 바람직한 것으로 판단되었으며 이는 표면 반응성의 측면에서 설명되었다. Kinetic Monte Carlo (MC) 모사가 이를 시각화하기 위해 도입되었으며 실험에서 관찰된 현상을 정성적으로 무리 없이 설명할 수 있었다. 실험계획법을 이용한 체계적인 실험과 이를 뒷받침하는 이론적인 모사가 결합된 본 연구의 접근법은 관련 공정에서 유용하게 활용될 수 있을 것이다.

• 한국방사선학회논문지
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• 제13권5호
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• pp.705-711
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• 2019

현재 최신 장비의 두부 CT검사에서 파라메타의 변화와 선량변화에 대한 연구가 부족하고 특히 노이즈, 균일도 해석 및 선량변화에 대한 연구가 부족하다고 생각된다. 따라서 높은 사양 두부 CT 사용 시 노출 파라메타 중 관전압, 슬라이스 두께, 피치변화에 대해 분석하여 이때 발생하는 현상에 대해서 연구하고자 하였다. 실험을 통해서 균일도는 고관전압과 두꺼운 슬라이스 선택 및 최저 피치를 사용할 때 균일도가 좋음을 알 수 있었다. 모두 조합한 결과 균일도가 가장 조건은 140 kVp, 10 mm, pitch 0.5로 나타났다. 노이즈는 관전압과 슬라이스 두께를 높이면 피치에 관계없이 개선되는 것을 알 수 있었고, 선량은 관전압과 피치의 증가에 따라 선형적으로 증가하는 것으로 나타났다. 따라서 본 연구결과는 고 사양의 두부 CT 사용에서 참고자료가 될 것이다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.223-227
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• 2002

As the channel length of device shrinks below $0.13{\mu}m$, CMP(chemical mechanical polishing) process got into key process for global planarization in the chip manufacturing process. The removal rate and non-uniformity of the CMP characteristics occupy an important position to CMP process control. Especially, the post-CMP thickness variation depends on the device yield as well as the stability of subsequent process. In this paper, every wafer polished two times for the improvement of oxide CMP process characteristics. Then, we discussed the removal rate and non-uniformity characteristics of post-CMP process. As a result of CMP experiment, we have obtained within-wafer non-uniformity (WIWNU) below 4 [%], and wafer-to-wafer non-uniformity (WTWNU) within 3.5 [%]. It is very good result, because the reliable non-uniformity of CMP process is within 5 [%].

• 한국정밀공학회지
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• 제22권4호
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• pp.44-51
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• 2005

In this paper, a new polishing head with the variable pressure structure was studied to improve the planarization uniformity of the conventional template-metal head. Metal surface waviness and slurry distribution on the pad have been known to affect the polishing uniformity even in the synchronized quill and platen velocities. A polishing head with silicon rubber sheet was used to get a curved pressure distribution. In the experiment, the vertical deflection behavior on the pad was characterized with back pressure in the air chamber. Quill force increased linearly with backpressure. However, backpressure under a quill force made the upward movements of the quill. In the wafer polishing experiments, polishing rate and polishing thickness distribution were severely changed with backpressure. The best uniformity was observed with the standard deviation off.5％ level of average polishing removal 215nm at backpressure 12.1kPa.

• 반도체디스플레이기술학회지
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• 제21권3호
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• pp.101-104
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• 2022

Mist-CVD is known to have advantages of low cost and high productivity compared to ALD and PECVD methods. It is capable of reacting to the substrate by misting an aqueous solution using ultrasonic waves under vacuum-free conditions of atmospheric pressure. In particular, Ga₂O₃ is regarded as advanced power semiconductor material because of its high quality of transmittance, and excellent electrical conductivity through N-type doping. In this study, Computational Fluid Dynamics were used to predict the uniformity of the thin film on a large-area substrate. And also the deposition pattern and uniformity were analyzed using the flow velocity and particle tracking method. The uniformity was confirmed by quantifying the deposition cross section with an FIB-SEM, and the consistency of the uniformity prediction was secured through the analysis of the CFD distribution. With the analysis and experimental results, the match rate of deposition area was 80.14% and the match rate of deposition thickness was 55.32%. As the experimental and analysis results were consistent, it was confirmed that it is possible to predict the deposition thickness uniformity of Mist-CVD.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집D
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• pp.311-318
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• 2001

A three-dimensional numerical analysis of the flow and heat transfer characteristic of wood-flour-filled polypropylene melt in an extrusion die was carried out Used for this analysis were Finite Concept Method based on FVM, unstructured grid and non-Newtonian fluid viscosity model. Temperature and flow fields are closely coupled through temperature dependent viscosity and viscous dissipation. With large Peclet, Nahme, Brinkman numbers, viscous heating caused high temperature belt near die housing, Changing taper plate thickness and examining some predefined parameters at die exit investigated the effect of taper plate on velocity and temperature uniformities. In the presence of taper plate, uniformity at die exit could be improved and there existed an optimum thickness to maximize it.

• 반도체디스플레이기술학회지
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• 제21권4호
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• pp.71-76
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• 2022

We evaluated and developed a 6th generation large-size polisher in the type of face-up and Oscar. We removed the hillocks of the low temperature poly-silicon (LTPS) thin film with this polisher. The surface roughness of LTPS was lowered from 7.9 nm to 0.6 nm after CMP(chemical mechanical polishing). The thickness of the LTPS is measured through reflectance in real time during polishing, and the polishing process is completed according to this thickness. The within glass non-uniformity (WIGNU) was 6.2% and the glass-to-glass non-uniformity (GTGNU) was 2.5%, targeting the LTPS thickness of 400Å. In addition, the residual slurry after the CMP process was removed through the Core Flow PVA Brush and alkaline chemical.