• Title/Summary/Keyword: Thickness of Printed Pattern

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Distortion of Printed Patterns in Printed Electronics (전자 인쇄에서의 인쇄 패턴 왜곡)

  • Kim, Chung-Hwan;Lee, Taik-Min;Kim, Dong-Soo;Choi, Byung-Oh
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.8 s.197
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    • pp.74-80
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    • 2007
  • The distortion of printed pattern is frequently observed in gravure offset printing process, which can be a serious problem in printing process for printed electronics. The mechanism of pattern distortion is studied and the factors which affect the amount and shape of distortion are found using FEM. The amount and shape of distortion is influenced by material properties of the roller, thickness of roller, applied load, and so on. As the printing pressure increases and Possion ratio increases, the degree of the image distortion increases. And the increase of the thickness of rubber roller brings a large distortion of image, too. In some cases, the distortion of printed pattern can reach a few hundred micromillimeters. The comparison of the experiment result and the simulation result shows good agreement in their quantitative tendency.

Statistical Analysis for Thickness and Surface Roughness of Printed Pattern in Roll-to-Roll Printed Electronics System (롤투롤 인쇄전자 시스템에서 인쇄패턴의 두께와 표면조도에 관한 통계적 분석)

  • Lee, Chang Woo;Kim, Nam Seok;Kim, Chang Wan
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.37 no.3
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    • pp.287-294
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    • 2013
  • The roll-to-roll (R2R) printed electronics system is one of the most promising technologies for the printed electronics industry because of several advantages in terms of productivity and cost. In the R2R printed electronics system, the characteristics of the printed patterns are an important issue that determines the functional quality of the printed matter. This study analyzed how several main factors may affect the characteristics of printed patterns, especially the thickness and surface roughness. The statistical model for estimation of the printed pattern was developed as a function of the main factors using the design of experiment (DOE) methodology. Based on the statistical analysis results, the R2R printed electronics system can be designed to control the characteristics of printed patterns.

Characterization of 3D Printed Wrist Brace with Various Tilting Angles of Re-entrant Pattern Using Thermoplastic Elastomer

  • Ye-Eun Park;Hyejin Lee;Imjoo Jung;Sunhee Lee
    • Journal of the Korean Society of Clothing and Textiles
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    • v.46 no.6
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    • pp.1074-1087
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    • 2022
  • This study reports an optimization of a 3D printed wrist brace (WB) for various tilting angles (0°, 45°, 90°) of the re-entrant (RE) pattern and thickness (2 mm, 4 mm) using thermoplastic polyurethane (TPU) filaments and thermoplastic elastomer (TPE) filaments. The actual printing time, weight, Poisson's ratio, and tensile property of the manufactured samples were analyzed. The results confirmed that the actual printing time and weight increased with increasing thickness, regardless of the filament type. All tilting angles of the WB showed a negative Poisson's ratio (NPR), the largest of which appeared at 90°. The results of the tensile property analysis showed that a 90° tilting angle also had the largest value of elongation and stress. From these results, we conclude that the most suitable wrist brace is one in which the actual printing time is low, the weight is minimized to a thickness of 2 mm, and the tilting angle of the RE pattern is 90° for good shock absorption. The choice of filaments may be decided upon according to the user's preference, since the TPU is stiff and the TPE is elastic.

A study on the Relation between Strain & Conductivity of the Printed Pattern in Post-Printing Section of Roll to Roll process (롤투롤 공정의 인쇄 후 구간에서 변형률과 인쇄한 패턴의 전기 전도도와의 관계에 대한 연구)

  • Choi, Jae-Ho;Lee, Chang-Woo;Shin, Kee-Hyun
    • Journal of Institute of Control, Robotics and Systems
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    • v.15 no.9
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    • pp.877-880
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    • 2009
  • A curing process in post-printing section of R2R process is required for an electrical property of the printed pattern when devices such as RFID, Solar cell are printed. PEN as well as heat-stabilized PET which is used as a plastic substrate would be deformed at high temperature due to change of its elastic modulus. And crack in the printed pattern, which is on the plastic substrate is occurred due to the deformation of the substrate. The occurrence of crack causes electrical resistance to increase and the quality of the device to deteriorate. In case of RFID antenna, the range of reading distance is shortened as the electrical resistance of the antenna is increased. Therefore, the deformation of the plastic substrate, which causes the occurrence of crack, should be minimized by setting up low operating tension in R2R process. In low tension, slippage between a moving substrate and a roller would be generated when the operating speed is increased. And scratch would be occurred when slippage is generated due to an air entrainment, which is related to the thickness of the air film. The thickness of the air film is increased when operating speed is increased as shown by simulation based on mathematical model. The occurrence of scratch in conductive pattern printed by roll to roll process is a critical damage because it causes degradation or failure of electrical property of it.

A study on the thickness distribution and pattern deformation of films in vacuum-assisted thermoforming (열진공성형에서 발생하는 필름의 두께 분포와 패턴 변형에 관한 연구)

  • Seong, Gyeom-Son;Lee, Ho-Sang
    • Design & Manufacturing
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    • v.12 no.2
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    • pp.5-10
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    • 2018
  • Vacuum-assisted thermoforming is one of the critical steps for successful application of film insert molding(FIM) to parts of complex shape. In this study, the simulations and experiments of thermoforming processes were performed to investigate the effects of process conditions on thickness distribution and printed pattern deformation of films in vacuum-assisted thermoforming. The film thickness uniformity increased with decreasing film heating time, whereas it increased with increasing vacuum delay time. After thermoforming of films with uniform pattern space of 5mm, the maximum space was 9.432mm. Based on the simulation, a modified pattern was calculated to obtain uniform spaces after thermoforming. In the experiments for film with the modified pattern, the maximum space appeared 5.837mm. In, addition. the predicted patterns were in good agreement with the experimental results.

Optimization of Printing Conditions Using Design Experiments for Minimization of Resistances of Electrodes in Roll-to-roll Gravure Printing Process (롤투롤 그라비어 방식의 인쇄 전극 저항 최소화를 위한 실험계획법 적용 인쇄 공정 조건 최적화)

  • Lee, Sang Yoon;Kim, Cheol;Kim, Chung Hwan
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.26 no.4
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    • pp.351-356
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    • 2017
  • The resistance of printed patterns for electrodes fabricated using printing technology should be minimized. This parameter depends on the pattern width and thickness; however, from the viewpoint of printability, the printed patterns should be printed at the designed width. The resistance of the printed patterns as well as printability is affected by various printing conditions. In this paper, the printing condition is optimized to minimize the resistance of electrodes printed by the roll-to-roll gravure method. This is done by considering the spread ratio of pattern width as a parameter of printability using design experiments. The drying temperature, dryer fan speed, and printing speed are selected as effective factors for the experiment objective. The optimized conditions are obtained and reproducibility test using these demonstrates that the optimized conditions can produce low-resistance electrodes for printability of the pattern width.

PR Coating for Electron Beam Lithography of Cylindrical Mold and Measuring Coating Thickness of It using Measuring Tip (원통금형의 전자빔 가공을 위한 PR 코팅 및 측정 팁을 이용한 두께측정)

  • Lee, Seung-Woo;Kim, Jeong-O;Suh, Jeong
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.10
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    • pp.1144-1148
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    • 2012
  • Process conditions for generating nano patterns handle different process according to the pattern characteristics, and different process data according to patterns in questions. To efficiently find optimal process conditions for generating nano patterns, process data by experiment is needed consideration of the pattern characteristics concerning the equipment. In particular, coating methods of a cylindrical mold differ from it of a flat plate because of viscosity of coating materials. Also the coating thickness affects nano process and pattern line width. So coating method of coating thickness for cylindrical mold is very important on nano pattern generating. In this study, a method is proposed for coating Photo Resist through the spray in order to coat cylindrical mold and measuring the thickness of coating using measuring tip considering the size of cylindrical mold because there is no method in the existing SEM. The proposed method is applied to a real printed electronics system to verify its accuracy and efficiency.

A Study on Properties of Conductive Pattern by the Rheology Characteristics of Ag Pastes for Gravure Printing (그라비어 인쇄용 Ag Paste의 레오로지 특성에 따른 전도성 패턴의 물성 연구)

  • Lee, Dong-Wook;Cho, Mi-Jeong;Lee, Mi-Young;Nam, Su-Yong;Lee, Taik-Min
    • Journal of the Korean Graphic Arts Communication Society
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    • v.26 no.1
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    • pp.39-50
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    • 2008
  • We have manufactured Ag pastes for gravure printing by adding different solvent contents. Then the gravure printability and properties of conductive patterns gravure-printed by the different rheology characteristics of pastes were investigated. The dispersity of pastes was increased and the viscosity and shear rate dependence of viscosity for pastes were decreased by increasing the solvent content. Also storage modulus G', loss modulus G" and angular frequency value when G" starts to be bigger than G' of pastes were increased by decreasing the solvent content. These mean a flow drop of paste. As a result of gravure printing using two plates which have different line counts(175line and 350line), conductive patterns printed using 175line were spreaded more but Ag packing, thickness and conductivity of the conductive patterns were better than those printed using 350line. And the spread values of conductive patterns were increased with solvent contents but the best properties for Ag packing, surface roughness and conductivity of the conductive pattern were obtained by paste (3) which has 550cps of viscosity at $100s^{-1}$ and tan ${\delta}$ > 1 at 10rad/s. As a result of gravure printing using 350 line plate and paste (3), the conductive pattern has $1.2{\mu}m$ of film thickness and $1.9{\times}10^{-5}{\Omega}{\cdot}cm$ of conductivity.

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A Study on the Computer Simulation of Ink Flow in the Reverse Offset Printing (Reverse Offset에서 잉크 전이 유동에 관한 시뮬레이션 연구)

  • Lee, Ane-Seok;Youn, Jong-Tae
    • Journal of the Korean Graphic Arts Communication Society
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    • v.30 no.2
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    • pp.23-33
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    • 2012
  • With the development of many display technologies currently applied to them in the field of printed electronics, there have been many researches that high resolution printing for thin and uniform pattern. In this paper, printing ink flow properties in the reverse offset mechanism were simulated. The aim of this research is to expect the ink flow behavior between cliches to make fine pattern by a printing technique which is a reverse offset. The simulation results show that almost the same as the experiments and the flow behavior according to the ink film thickness and printing pressure changes could be expected.