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http://dx.doi.org/10.3795/KSME-A.2013.37.3.287

Statistical Analysis for Thickness and Surface Roughness of Printed Pattern in Roll-to-Roll Printed Electronics System  

Lee, Chang Woo (Dept. of Mechanical Design and Production Engineering, Changwon Nat'l Univ.)
Kim, Nam Seok (Dept. of Mechanical Design and Production Engineering, Konkuk Univ.)
Kim, Chang Wan (Dept. of Mechanical Design and Production Engineering, Konkuk Univ.)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.37, no.3, 2013 , pp. 287-294 More about this Journal
Abstract
The roll-to-roll (R2R) printed electronics system is one of the most promising technologies for the printed electronics industry because of several advantages in terms of productivity and cost. In the R2R printed electronics system, the characteristics of the printed patterns are an important issue that determines the functional quality of the printed matter. This study analyzed how several main factors may affect the characteristics of printed patterns, especially the thickness and surface roughness. The statistical model for estimation of the printed pattern was developed as a function of the main factors using the design of experiment (DOE) methodology. Based on the statistical analysis results, the R2R printed electronics system can be designed to control the characteristics of printed patterns.
Keywords
Roll to Roll Printed Electronics System; Design of Experiment; Thickness of Printed Pattern; Surface roughness of Printed Pattern; Effect; Significant Effect;
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1 Chin, B. D. and Shin, K. H., 2007, "Device Technology of Flexible Organic Devices and Continuous Printing Process," Polymer Science and Technology, Vol. 18, No. 3, pp. 246-252.
2 You, I. K., Koo, J. B. and Lee, Y. k., 2007, "Printed RFID Technology," ETRI, Analysis of Electronics and Telecommunications Trends, Vol. 22, No. 5, pp. 1-11.
3 Pudas, M., Hagberg, J. and Leppavuori, S., 2004, "Printing Parameters and Ink Componints Affecting Ultra-Fine-Line Gravure Offset Printing for Electronic Applications," J. European Ceramic Society, Vol 24, pp. 2943-2950.   DOI   ScienceOn
4 Benkreira, H. and Patel, R., 1993, "Direct Gravure Roll Coating Operations," Chem. Eng. Sci., Vol. 48, pp. 2329-2335.   DOI   ScienceOn
5 Kolouoma, T., Tuomikoski, M., Makela, T., Heimann, J., Haring, J., Kallioiene, J., Harberg, J., Kettunen, I., and Kopola, H., 2004, "Towards Roll to Roll Fabrication of Electronics, Optics and Optoelectronics for Smart and Intelligent Packaging," Proceedings of SPIE, Emerging Optoelectronic Applications, pp. 77-85.
6 He, B. and Lee, J., 2003, "Dynamic Wettability Switching Switching by Surface Roughness Effect," Proceeding of IET Conference, pp. 120-123.
7 Onda, T., Shibuichi, S., Satoh N. and Tsujii, K., 1996, "Superhydrophobic Fractal Surface," Langmuir, Vol 12, pp. 2125-2127.   DOI   ScienceOn
8 Pudas, M., Hagberg, J. and Leppavuori, S., 2002, "The Absorption Ink Transfer Mechanism of Gravure Offset Printing for Electronic Circuitry," IEEE Trans. on Electronics Packaging Manufacturing, Vol. 25, pp. 335-343.   DOI   ScienceOn
9 Pudas, M., Hagberg, J. and Leppavuori, S., 2004, "Printing Parameters and Ink Components Affecting Ultrafine-Line Gravure-Offset Printing for Electronics Applications," Journal of European Ceramic Society, Vol. 24, pp. 2943-2950.   DOI   ScienceOn
10 Dubois, G. B., 1993, "Selecting Proper Winding Tension for Various Web Substrate," Tappi Journal, Vol. 76, pp. 91-93.
11 Douglas, C. M., 2009, Design and Analysis of Experiments, No. 7, John Willey & Sons, Inc., pp. 207 -256.