• 한국정밀공학회지
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• 제24권8호통권197호
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• pp.74-80
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• 2007

The distortion of printed pattern is frequently observed in gravure offset printing process, which can be a serious problem in printing process for printed electronics. The mechanism of pattern distortion is studied and the factors which affect the amount and shape of distortion are found using FEM. The amount and shape of distortion is influenced by material properties of the roller, thickness of roller, applied load, and so on. As the printing pressure increases and Possion ratio increases, the degree of the image distortion increases. And the increase of the thickness of rubber roller brings a large distortion of image, too. In some cases, the distortion of printed pattern can reach a few hundred micromillimeters. The comparison of the experiment result and the simulation result shows good agreement in their quantitative tendency.

• 대한기계학회논문집A
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• 제37권3호
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• pp.287-294
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• 2013

롤투롤 인쇄전자 시스템은 높은 생산성과 낮은 원가를 이점으로 인쇄전자 산업에서 가장 각광을 받고 있는 인쇄기술 중 하나이다. 이러한 롤투롤 인쇄전자 시스템에서 인쇄패턴의 특성은 인쇄물의 기능적 성질을 결정짓는 중요한 문제라 할 수 있다. 따라서 본 연구에서는 인쇄패턴의 특성을 결정짓는 주요 인자들이 특별히 인쇄패턴의 두께와 표면 조도에 미치는 영향성에 대한 분석이 수행되었다. 실험계획법을 적용하여 인쇄패턴의 두께와 표면조도에 대한 각 인자의 주효과 및 교호작용 효과를 정량적으로 제시하였고, 분산분석을 통해 유의한 인자를 찾아내었다. 또한 이에 따르는 통계적 모델이 주요 인자의 함수로서 개발되었다. 이러한 결과는 롤투롤 전자인쇄 시스템의 특징에 따라 요구되는 인쇄패턴의 특성을 얻는데 활용될 수 있을 것이다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.235-236
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• 2009

• 한국의류학회지
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• 제46권6호
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• pp.1074-1087
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• 2022

This study reports an optimization of a 3D printed wrist brace (WB) for various tilting angles (0°, 45°, 90°) of the re-entrant (RE) pattern and thickness (2 mm, 4 mm) using thermoplastic polyurethane (TPU) filaments and thermoplastic elastomer (TPE) filaments. The actual printing time, weight, Poisson's ratio, and tensile property of the manufactured samples were analyzed. The results confirmed that the actual printing time and weight increased with increasing thickness, regardless of the filament type. All tilting angles of the WB showed a negative Poisson's ratio (NPR), the largest of which appeared at 90°. The results of the tensile property analysis showed that a 90° tilting angle also had the largest value of elongation and stress. From these results, we conclude that the most suitable wrist brace is one in which the actual printing time is low, the weight is minimized to a thickness of 2 mm, and the tilting angle of the RE pattern is 90° for good shock absorption. The choice of filaments may be decided upon according to the user's preference, since the TPU is stiff and the TPE is elastic.

• 제어로봇시스템학회논문지
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• 제15권9호
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• pp.877-880
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• 2009

A curing process in post-printing section of R2R process is required for an electrical property of the printed pattern when devices such as RFID, Solar cell are printed. PEN as well as heat-stabilized PET which is used as a plastic substrate would be deformed at high temperature due to change of its elastic modulus. And crack in the printed pattern, which is on the plastic substrate is occurred due to the deformation of the substrate. The occurrence of crack causes electrical resistance to increase and the quality of the device to deteriorate. In case of RFID antenna, the range of reading distance is shortened as the electrical resistance of the antenna is increased. Therefore, the deformation of the plastic substrate, which causes the occurrence of crack, should be minimized by setting up low operating tension in R2R process. In low tension, slippage between a moving substrate and a roller would be generated when the operating speed is increased. And scratch would be occurred when slippage is generated due to an air entrainment, which is related to the thickness of the air film. The thickness of the air film is increased when operating speed is increased as shown by simulation based on mathematical model. The occurrence of scratch in conductive pattern printed by roll to roll process is a critical damage because it causes degradation or failure of electrical property of it.

• Design & Manufacturing
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• 제12권2호
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• pp.5-10
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• 2018

Vacuum-assisted thermoforming is one of the critical steps for successful application of film insert molding(FIM) to parts of complex shape. In this study, the simulations and experiments of thermoforming processes were performed to investigate the effects of process conditions on thickness distribution and printed pattern deformation of films in vacuum-assisted thermoforming. The film thickness uniformity increased with decreasing film heating time, whereas it increased with increasing vacuum delay time. After thermoforming of films with uniform pattern space of 5mm, the maximum space was 9.432mm. Based on the simulation, a modified pattern was calculated to obtain uniform spaces after thermoforming. In the experiments for film with the modified pattern, the maximum space appeared 5.837mm. In, addition. the predicted patterns were in good agreement with the experimental results.

• 한국생산제조학회지
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• 제26권4호
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• pp.351-356
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• 2017

The resistance of printed patterns for electrodes fabricated using printing technology should be minimized. This parameter depends on the pattern width and thickness; however, from the viewpoint of printability, the printed patterns should be printed at the designed width. The resistance of the printed patterns as well as printability is affected by various printing conditions. In this paper, the printing condition is optimized to minimize the resistance of electrodes printed by the roll-to-roll gravure method. This is done by considering the spread ratio of pattern width as a parameter of printability using design experiments. The drying temperature, dryer fan speed, and printing speed are selected as effective factors for the experiment objective. The optimized conditions are obtained and reproducibility test using these demonstrates that the optimized conditions can produce low-resistance electrodes for printability of the pattern width.

• 한국정밀공학회지
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• 제29권10호
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• pp.1144-1148
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• 2012

Process conditions for generating nano patterns handle different process according to the pattern characteristics, and different process data according to patterns in questions. To efficiently find optimal process conditions for generating nano patterns, process data by experiment is needed consideration of the pattern characteristics concerning the equipment. In particular, coating methods of a cylindrical mold differ from it of a flat plate because of viscosity of coating materials. Also the coating thickness affects nano process and pattern line width. So coating method of coating thickness for cylindrical mold is very important on nano pattern generating. In this study, a method is proposed for coating Photo Resist through the spray in order to coat cylindrical mold and measuring the thickness of coating using measuring tip considering the size of cylindrical mold because there is no method in the existing SEM. The proposed method is applied to a real printed electronics system to verify its accuracy and efficiency.

• 한국인쇄학회지
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• 제26권1호
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• pp.39-50
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• 2008

We have manufactured Ag pastes for gravure printing by adding different solvent contents. Then the gravure printability and properties of conductive patterns gravure-printed by the different rheology characteristics of pastes were investigated. The dispersity of pastes was increased and the viscosity and shear rate dependence of viscosity for pastes were decreased by increasing the solvent content. Also storage modulus G', loss modulus G" and angular frequency value when G" starts to be bigger than G' of pastes were increased by decreasing the solvent content. These mean a flow drop of paste. As a result of gravure printing using two plates which have different line counts(175line and 350line), conductive patterns printed using 175line were spreaded more but Ag packing, thickness and conductivity of the conductive patterns were better than those printed using 350line. And the spread values of conductive patterns were increased with solvent contents but the best properties for Ag packing, surface roughness and conductivity of the conductive pattern were obtained by paste (3) which has 550cps of viscosity at $100s^{-1}$ and tan ${\delta}$ > 1 at 10rad/s. As a result of gravure printing using 350 line plate and paste (3), the conductive pattern has $1.2{\mu}m$ of film thickness and $1.9{\times}10^{-5}{\Omega}{\cdot}cm$ of conductivity.

• 한국인쇄학회지
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• 제30권2호
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• pp.23-33
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• 2012

With the development of many display technologies currently applied to them in the field of printed electronics, there have been many researches that high resolution printing for thin and uniform pattern. In this paper, printing ink flow properties in the reverse offset mechanism were simulated. The aim of this research is to expect the ink flow behavior between cliches to make fine pattern by a printing technique which is a reverse offset. The simulation results show that almost the same as the experiments and the flow behavior according to the ink film thickness and printing pressure changes could be expected.