• Journal of the Korea Institute of Military Science and Technology
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• v.10 no.3
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• pp.120-128
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• 2007

In order to reduce the lead-time and cost, the technology of rapid prototyping(RP) has been widely used. This paper describes the methodology to fabricate a large object by using the principle of rapid prototyping. By laminating thick and sloping polystyrene foam plates, we can make the large model which has three dimensional, continuous surfaces faster and easier than conventional processes. Estimated error was much smaller than other RP products which have stepped effect. For accuracy improvement and post processing, machined metal plates are added between the thick plates. To keep the continuity of surface and strengthen the model, pilot holes and guide rods are applied. By the methodology described in this paper, a missile body with flush air intake was fabricated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.50-53
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• 2003

Most companies use technologies such as stereolithography, selective laser sintering, and fused deposition modeling to make parts for such small consumer products as telephones, heads, and shoes. The largest part that the existing RP systems can make is only 600 mm in length. Because most RP systems build parts by depositing, solidifying, or sintering material point-by-point, making larger objects takes a long time. and in many cases, large objects won't fit the build size. A new effective thick-layered RP process. Transfer type Variable Lamination Manufacturing using expandable polystyrene foam (VLM-ST) has been developed with thick layers and sloped surfaces. In this paper, a scaledown model of F16 Fighter with the length of 800 mm is rapidly fabricated using the VLM-ST process. In order to build a CAD model of F16 larger than 600 mm in length, the approach in VLM-ST is to build larger parts in multiple sub-parts and then glue them together. The fabricated result shows that the VLM-ST process employing thick layers and sloped surfaces is adequate for creating the real-sized large objects in the diverse fields such as automobiles, electric home appliances, electronics. and etc.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.2
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• pp.202-209
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• 2005

A new effective thick-layered RP process, Transfer-type Variable Lamination Manufacturing using expandable polystyrene foam (VLM-ST) has been developed with thick layers and sloped surfaces. VLM-ST has the innate advantages by virtue of its working principle: high building speed, low cost for introduction and maintenance of VLM-ST apparatus, little staircase surface irregularities of parts. Despite these advantages in VLM-ST, the surface roughness of VLM-ST parts is still inadequate to be used as RP master patterns for rapid tooling (RT). This paper describes the systematic and effective methodology to remove the laminated pattern and improve the surface roughness for VLM-ST parts. From the results of surface finishing of VLM-ST parts, it can be seen that the laminated pattern is completely removed and the surface characteristics such as surface roughness, surface hardness, and paintability are improved.

• Composites Research
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• v.22 no.2
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• pp.30-36
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• 2009

In this paper, we propose the design method for the composite torque link of a landing gear for a helicopter. The composite torque link has to be light weighted and very stiff to keep the shock absorber in the landing gear of helicopter. The configuration and structural shape has to be designed in consideration of the RTM (Resin Transfer Molding) manufacturing process which is adopted to minimize the manufacturing cost. The mechanical properties are obtained through the coupon tests with the specimens made by the same manufacturing process for the composite structure. The optimal design process was performed through iterative modifications of the models which were verified by stress analysis using FEM. The composite torque link has lug-shaped parts and is very thick, so 3D Layered solid elements of ABAQUS were used to get the stress field including the stress components in thickness direction and non-linear static analysis using contact B.C. of rigid-deform condition was used to get the optimal design.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1414-1417
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• 2004

A thick-layered RP process, transfer-type variable lamination manufacturing using expandable polystyrene foam (VLMST) has been developed to have the advantageous characteristics such as high building speed, low cost for introduction and maintenance of VLM-ST apparatus, and little staircase surface irregularities of parts. However, VLM-ST has difficulty fabricating an axisymmetric shape and a large-sized freeform shape because of the limited sloping angles and small build size. The objective of this paper is to develop a multi-functional hotwire cutting system using EPS-foam (MHC). MHC employs a four-axis synchronized hotwire cutter with the structure of two XY movable heads and a turntable. In order to examine the applicability of the developed MHC apparatus, an axisymmetric shape, a polyhedral shape and a large-sized freeform shape were fabricated on the apparatus.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.275-280
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• 2001

Recently, the trends of industrial products grow more miniaturization, variety and mass production. Micro drilling which take high precision in cutting work is requested more micro hole and high speed working. Especially, Micro deep hole drilling is becoming more important in a wide spectrum of precision production industries, ranging from the production of automotive fuel injection nozzle, watch and camera parts, medical needles, and thick multi-layered Printed Circuit Boards(PCB) that are demanded for very high density electric circuitry. This paper shows the tool monitoring results of micro drill with tool dynamometer. And additionally, microscope with built-in monitor inspection show the relationship between burr in workpiece and chip form of micro drill machining.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.3
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• pp.372-379
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• 2013

In this study, we investigated the traits of the clad metals used in hot-rolled clad steel plates. We examined the sensitization and mechanical properties of STS 316 steel plate and carbon steel (A516) under the specific circumstances of post heat treatment and whether a weld was multilayered and thick or repeated because of repairs. The test conditions were as follows. The clad steel plates were butt-welded using FCAW/SAW, and the heat treatment was conducted at $625^{\circ}C$, for 80, 160, 320, 640, or 1280 min. The change in the corrosion resistance was evaluated in these specimens. In the case of the carbon steel (A516), as the heat treatment time increased, the annealing effect caused the tensile strength to decrease. The micro- hardness gradually increased and then decreased after 640 min. The elongation and contraction of the area increased gradually. An oxalic acid etch test and EPR test on STS316, a clad metal, showed a STEP structure and no sensitization. From the test results for the multi-layered and repair welds, it could be concluded that there is no effect on the corrosion resistance of clad metals. In summary, the purpose of this study was to suggest some considerations when developing on-site techniques and evaluate the sensitization of stainless steels.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.240-241
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• 2007

In general, high temperature superconducting coated conductors have intermediary buffers layer consisting of seed, diffusion barrier and cap layers. Simplification of the oxide materials buffer architecture in the fabrication of high temperature superconducting coated conductors is required because the deposition of multi-layers buffer architecture leads to a longer manufacturing time and a higher cost process of coated conductors. Thus, single buffer layer deposition seems to be important for practical coated conductor manufacturing process. In this study, a single gradient layered buffer deposition process of YZO for low cost coated conductors has been tried using DC reactive sputtering technique. About several thick YZO gradient single buffer layers deposited by DC co-sputtering process were found to act as a diffusion layer.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.5
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• pp.811-816
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• 2006

The single layered magnetic thin films with anisotropic magnetoresistance behavior have advantage on micro integration due to their low cost in manufacturing. Although the conventional MCo (M=Cu, Ag) amorphous ribbons using a rapid solidification process have showed appropriate for magnetic property for bulk devices, they are not appropriate for micro-scale devices due to their brittleness. We prepared the thermal evaporated 100 nm-thick $Cu_{1-x}Co_x\;and\;Ag_{1-x}Co_x(x=0.1{\sim}0.7)$ films on silicon wafers and investigated the magnetic property of the as-depo films such as magnetization and magnetoresistance ratio. We confirmed that the maximum MR ratio of 1.4 and 2.6% at the external field of 0.5 Tesla in $CuCo_{30},\;AgCo_{40}$ films, respectively. Our result implies that AMR may be slightly less than those of the conventional CuCo and AgCo ribbons due to surface scattering, but their AMR ratio be enough for micro-scale application with easy integration compatibility for the process without surface oxidation.